公开(公告)号：US20170005079A1

公开(公告)日：2017-01-05

申请号：US15113749

申请日：2015-01-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Lutz HOEPPEL ,  Juergen MOOSBURGER ,  Andreas PLOESSL ,  Patrick RODE ,  Peter NAGEL ,  Dominik SCHOLZ

IPC: H01L25/16 ,  H01L33/58 ,  H01L31/147 ,  H01L31/0232 ,  H01L25/00 ,  H01L31/18

CPC classification number: H01L25/167 ,  H01L25/50 ,  H01L31/02327 ,  H01L31/147 ,  H01L31/18 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/96 ,  H01L2933/0033 ,  H01L2933/0091

Abstract: A method for producing a plurality of optoelectronic semiconductor components (100) is provided, comprising the following steps: a) providing an auxiliary carrier (2); b) providing a plurality of semiconductor chips (10), wherein each of the semiconductor chips has a carrier body (12) and a semiconductor body (4) arranged on an upper side (22) of the carrier body; c) attaching the plurality of semiconductor chips on the auxiliary carrier, wherein the semiconductor chips are spaced apart from one another in a lateral direction (L) and wherein the semiconductor bodies are facing the auxiliary carrier, as seen from the carrier body; d) forming a scattering layer (18), at least in regions between the semiconductor bodies of adjacent semiconductor chips; e) forming a composite package (20); f) removing the auxiliary carrier (2); and g) individually separating the composite package into a plurality of optoelectronic semiconductor components (100).

Abstract translation: 提供了一种用于制造多个光电子半导体部件（100）的方法，包括以下步骤：a）提供辅助载体（2）; b）提供多个半导体芯片（10），其中每个半导体芯片具有布置在载体主体的上侧（22）上的载体主体（12）和半导体本体（4） c）将多个半导体芯片附接在辅助载体上，其中半导体芯片在横向（L）上彼此间隔开，并且其中半导体主体面向辅助载体，如从载体主体所见; d）至少在相邻半导体芯片的半导体主体之间的区域中形成散射层（18）; e）形成复合包装（20）; f）拆下辅助载体（2）; 以及g）将所述复合封装单独地分离成多个光电子半导体部件（100）。

公开(公告)号：US20160247966A1

公开(公告)日：2016-08-25

申请号：US15144728

申请日：2016-05-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias SABATHIL ,  Andreas PLÖßL ,  Hans-Jürgen LUGAUER ,  Alexander LINKOV ,  Patrick RODE

IPC: H01L33/08 ,  H01L33/00 ,  H01L33/06 ,  H01L33/50 ,  H01L33/22 ,  H01L33/32

CPC classification number: H01L33/08 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/22 ,  H01L33/26 ,  H01L33/32 ,  H01L33/502 ,  H01L33/504

Abstract: The invention relates to a light-emitting semiconductor component, comprising—a first semiconductor body (1), which comprises an active zone (11) in which during the operation of the light-emitting semiconductor component electromagnetic radiation is generated, at least some of which leaves the first semiconductor body (1) through a radiation exit surface (1a), and—a second semiconductor body (2), which is suitable for converting the electromagnetic radiation into converted electromagnetic radiation having a longer wavelength, wherein—the first semiconductor body (1) and the second semiconductor body (2) are produced separately from each other,—the second semiconductor body (2) is electrically inactive, and—the second semiconductor body (2) is in direct contact with the radiation exit surface (1a) and is attached there to the first semiconductor body (1) without connecting means.

Abstract translation: 本发明涉及一种发光半导体部件，包括：第一半导体本体（1），其包括活性区（11），其中在发光半导体部件产生电磁辐射的操作期间，产生至少一些 所述第一半导体本体（1）通过辐射出射表面（1a）离开所述第一半导体本体（1），以及 - 第二半导体本体（2），其适于将所述电磁辐射转换为具有较长波长的转换电磁辐射，其中，所述第一半导体 主体（1）和第二半导体本体（2）彼此分开制造， - 第二半导体体（2）是电不活动的，并且第二半导体本体（2）与辐射出口表面 1a），并且在没有连接装置的情况下附接到第一半导体本体（1）。