摘要:
A double-mode surface-acoustic device having a piezoelectric substrate with two reflectors placed on the piezoelectric substrate and first through third interdigital electrodes placed on the substrate consecutively between the two reflectors. Each electrode containing first through third number of pairs of electrode fingers, respectively.
摘要:
A surface acoustic wave device includes: interdigital transducers; first electrode pads that are connected to the interdigital transducers through wire patterns; and a piezoelectric substrate on which the interdigital transducers, the first electrode pads, and the wire patterns, are formed. In this surface acoustic wave device, at least one of the first electrode pads is not connected to a ground pattern, and the piezoelectric substrate has a conductivity in the range of 10−12/Ω·cm to 10−6/Ω·cm.
摘要:
A surface-acoustic-wave device includes at least first and second surface-acoustic-wave elements formed on a common piezoelectric substrate and cascaded with each other, each of the first and second surface-acoustic-wave elements including a plurality of interdigital electrodes having a plurality of electrode fingers overlapping with each other in correspondence to a path of a surface acoustic wave on the piezoelectric substrate, wherein the width of overlapping of the electrode fingers is changed between the first surface-acoustic-wave element and the second surface-acoustic-wave element.
摘要:
A surface acoustic wave device includes a piezoelectric substrate of a LiTaO.sub.3 single crystal, the crystal having X, Y and Z axes and a cut plane. The X axis of the crystal is oriented in a direction of propagation of surface acoustic waves. The cut plane of the crystal is rotated around the X axis at a rotated angle from the Y axis to the Z axis, the rotated angle being in a range between 40.degree. and 42.degree.. A pair of reflectors are formed on the substrate and aligned in a row in the direction of propagation. Interdigital transducers are formed on the substrate and aligned in the row in the direction of propagation, the interdigital transducers interposed between the reflectors, each interdigital transducer having pairs of mutually opposed primary electrode fingers and secondary electrode fingers, the interdigital transducers including at least a front transducer, a middle transducer and a rear transducer aligned in the row in the direction of propagation. In the device, a ratio of the number of pairs of the electrode fingers in one of the front transducer and the rear transducer to the number of pairs of the electrode fingers in the middle transducer is in a range between 55% and 80%.
摘要:
A surface acoustic wave device includes: interdigital transducers; first electrode pads that are connected to the interdigital transducers through wire patterns; and a piezoelectric substrate on which the interdigital transducers, the first electrode pads, and the wire patterns, are formed. In this surface acoustic wave device, at least one of the first electrode pads is not connected to a ground pattern, and the piezoelectric substrate has a conductivity in the range of 10−12/Ω·cm to 10−6/Ω·cm.
摘要:
A piezoelectric substrate having two reflectors along a propagation path of a surface acoustic wave and three interdigital electrodes provided on said piezoelectric substrate consecutively between the reflectors. A primary side electrode is connected to an input/output terminal and a secondary side electrode is connected to a second input/output terminal. Each interdigital electrode includes include pairs of electrode fingers, where the pair of electrodes for one interdigital electrode is different than a pair of electrodes for another interdigital electrode.
摘要:
A surface acoustic wave device supported by a package body. At least one surface acoustic wave element having interdigital electrodes disposed on a propagation path of a surface acoustic wave on the piezoelectric substrate. These interdigital electrodes include an input-side interdigital electrode connected to a ground pad on the package body and an output-side interdigital electrode connected to another ground pad on the package body.
摘要:
There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
摘要:
A filter includes: a first acoustic wave filter having acoustic wave filters cascaded, an input stage of the acoustic wave filters including a first multimode filter; a second acoustic wave filter having acoustic wave filters cascaded, an input stage of these acoustic wave filters including a second multimode filter having an aperture length different from that of the first multimode filter, the second acoustic wave filter receiving an unbalanced in signal applied to the first acoustic wave filter, and having a pass band that does not overlap with that of the first acoustic wave filter.
摘要:
A package for an electronic device includes a cavity that houses an electronic element, and grooves or holes formed on or in sidewalls that define the cavity. The grooves or holes extend from an open side of the cavity so as not to reach a bottom side of the package.