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公开(公告)号：US20100187659A1
公开(公告)日：2010-07-29
申请号：US12659968
申请日：2010-03-26
申请人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
发明人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
CPC分类号： H01L23/3178 , H01L21/78 , H01L23/291 , H01L23/293 , H01L23/3114 , H01L23/3142 , H01L23/3171 , H01L23/3192 , H01L23/528 , H01L23/544 , H01L23/562 , H01L24/02 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/94 , H01L24/96 , H01L2223/5446 , H01L2224/02255 , H01L2224/0226 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05568 , H01L2224/05569 , H01L2224/05571 , H01L2224/05647 , H01L2224/12105 , H01L2224/13023 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/05042 , H01L2924/05442 , H01L2924/0665 , H01L2924/07025 , H01L2924/10161 , H01L2924/10253 , H01L2924/12042 , H01L2924/182 , H01L2924/186 , H01L2924/3025 , H01L2924/00 , H01L2224/13 , H01L2924/00014 , H01L2924/00012
摘要： An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface.
摘要翻译： 本发明的半导体器件包括具有钝化膜的半导体芯片和设置在钝化膜上方的密封树脂层，用于密封半导体芯片的正面。 密封树脂层延伸到钝化膜的侧表面以覆盖侧表面。
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公开(公告)号：US07714448B2
公开(公告)日：2010-05-11
申请号：US11667849
申请日：2005-11-16
申请人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
发明人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
CPC分类号： H01L23/3178 , H01L21/78 , H01L23/291 , H01L23/293 , H01L23/3114 , H01L23/3142 , H01L23/3171 , H01L23/3192 , H01L23/528 , H01L23/544 , H01L23/562 , H01L24/02 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/94 , H01L24/96 , H01L2223/5446 , H01L2224/02255 , H01L2224/0226 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05568 , H01L2224/05569 , H01L2224/05571 , H01L2224/05647 , H01L2224/12105 , H01L2224/13023 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/05042 , H01L2924/05442 , H01L2924/0665 , H01L2924/07025 , H01L2924/10161 , H01L2924/10253 , H01L2924/12042 , H01L2924/182 , H01L2924/186 , H01L2924/3025 , H01L2924/00 , H01L2224/13 , H01L2924/00014 , H01L2924/00012
摘要： An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface.
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公开(公告)号：US08575764B2
公开(公告)日：2013-11-05
申请号：US12659968
申请日：2010-03-26
申请人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
发明人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
IPC分类号： H01L23/48
CPC分类号： H01L23/3178 , H01L21/78 , H01L23/291 , H01L23/293 , H01L23/3114 , H01L23/3142 , H01L23/3171 , H01L23/3192 , H01L23/528 , H01L23/544 , H01L23/562 , H01L24/02 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/94 , H01L24/96 , H01L2223/5446 , H01L2224/02255 , H01L2224/0226 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05568 , H01L2224/05569 , H01L2224/05571 , H01L2224/05647 , H01L2224/12105 , H01L2224/13023 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/05042 , H01L2924/05442 , H01L2924/0665 , H01L2924/07025 , H01L2924/10161 , H01L2924/10253 , H01L2924/12042 , H01L2924/182 , H01L2924/186 , H01L2924/3025 , H01L2924/00 , H01L2224/13 , H01L2924/00014 , H01L2924/00012
摘要： An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface.
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公开(公告)号：US20080006910A1
公开(公告)日：2008-01-10
申请号：US11667849
申请日：2005-11-16
申请人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
发明人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
CPC分类号： H01L23/3178 , H01L21/78 , H01L23/291 , H01L23/293 , H01L23/3114 , H01L23/3142 , H01L23/3171 , H01L23/3192 , H01L23/528 , H01L23/544 , H01L23/562 , H01L24/02 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/94 , H01L24/96 , H01L2223/5446 , H01L2224/02255 , H01L2224/0226 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05568 , H01L2224/05569 , H01L2224/05571 , H01L2224/05647 , H01L2224/12105 , H01L2224/13023 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/05042 , H01L2924/05442 , H01L2924/0665 , H01L2924/07025 , H01L2924/10161 , H01L2924/10253 , H01L2924/12042 , H01L2924/182 , H01L2924/186 , H01L2924/3025 , H01L2924/00 , H01L2224/13 , H01L2924/00014 , H01L2924/00012
摘要： An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface.
摘要翻译： 本发明的半导体器件包括具有钝化膜的半导体芯片和设置在钝化膜上方的密封树脂层，用于密封半导体芯片的正面。 密封树脂层延伸到钝化膜的侧表面以覆盖侧表面。
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公开(公告)号：US08432046B2
公开(公告)日：2013-04-30
申请号：US13274738
申请日：2011-10-17
申请人： Osamu Miyata , Shingo Higuchi
发明人： Osamu Miyata , Shingo Higuchi
CPC分类号： H01L24/30 , H01L21/78 , H01L23/3114 , H01L23/525 , H01L24/05 , H01L24/12 , H01L2224/0401 , H01L2224/05541 , H01L2224/05559 , H01L2224/05568 , H01L2224/05572 , H01L2224/0558 , H01L2224/05644 , H01L2224/13006 , H01L2224/13023 , H01L2224/16 , H01L2224/274 , H01L2224/81191 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/10157 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , H01L2924/207 , H01L2924/00 , H01L2224/05552
摘要： There is provided a semiconductor device with which stress can be prevented from locally concentrating on an external connecting terminal on a post and thus damages of the external connecting terminal can be prevented. The semiconductor device includes a semiconductor chip, a sealing resin layer stacked on a surface of the semiconductor chip, and the post which penetrates the sealing resin layer in a stacking direction of the semiconductor chip and the sealing resin layer, protrudes from the sealing resin layer, and has a periphery of the protruding portion opposedly in contact with a surface of the sealing resin layer in the stacking direction.
摘要翻译： 提供了可以防止应力局部集中在柱上的外部连接端子上的半导体器件，从而可以防止外部连接端子的损坏。 半导体器件包括半导体芯片，层叠在半导体芯片的表面上的密封树脂层和在半导体芯片和密封树脂层的堆叠方向上穿透密封树脂层的柱从密封树脂层突出 并且具有与层叠方向上的密封树脂层的表面相接触的突出部的周边。
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公开(公告)号：US08063495B2
公开(公告)日：2011-11-22
申请号：US11992985
申请日：2006-10-03
申请人： Osamu Miyata , Shingo Higuchi
发明人： Osamu Miyata , Shingo Higuchi
CPC分类号： H01L24/30 , H01L21/78 , H01L23/3114 , H01L23/525 , H01L24/05 , H01L24/12 , H01L2224/0401 , H01L2224/05541 , H01L2224/05559 , H01L2224/05568 , H01L2224/05572 , H01L2224/0558 , H01L2224/05644 , H01L2224/13006 , H01L2224/13023 , H01L2224/16 , H01L2224/274 , H01L2224/81191 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/10157 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , H01L2924/207 , H01L2924/00 , H01L2224/05552
摘要： There is provided a semiconductor device with which stress can be prevented from locally concentrating on an external connecting terminal on a post and thus damages of the external connecting terminal can be prevented. The semiconductor device includes a semiconductor chip, a sealing resin layer stacked on a surface of the semiconductor chip, and the post which penetrates the sealing resin layer in a stacking direction of the semiconductor chip and the sealing resin layer, protrudes from the sealing resin layer, and has a periphery of the protruding portion opposedly in contact with a surface of the sealing resin layer in the stacking direction.
摘要翻译： 提供了可以防止应力局部集中在柱上的外部连接端子上的半导体器件，从而可以防止外部连接端子的损坏。 半导体器件包括半导体芯片，层叠在半导体芯片的表面上的密封树脂层和在半导体芯片和密封树脂层的堆叠方向上穿透密封树脂层的柱从密封树脂层突出 并且具有与层叠方向上的密封树脂层的表面相接触的突出部的周边。
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公开(公告)号：US07436063B2
公开(公告)日：2008-10-14
申请号：US11242125
申请日：2005-10-04
申请人： Osamu Miyata , Shingo Higuchi
发明人： Osamu Miyata , Shingo Higuchi
IPC分类号： H01L23/48
CPC分类号： H01L23/49816 , H01L23/49838 , H01L2224/16 , H01L2224/17051 , H01L2224/17104 , H01L2924/01078 , H01L2924/00012
摘要： A packaging substrate according to the present invention is a packaging substrate to which a semiconductor chip having a plurality of connection metal bodies on a surface thereof is bonded with the surface opposed to the packaging substrate and comprises a wiring provided on a bonding surface to which the semiconductor chip is bonded, a plurality of electrode parts provided on the bonding surface and electrically connected to the wiring, a wiring protective layer for coating and protecting the wiring, electrode openings formed by partly opening the wiring protective layer for separately exposing each of the electrode parts from the wiring protective layer, and escape openings each formed in continuation with each of the electrode openings in the wiring protective layer for introducing therein a part of the connection metal body to be connected to each of the electrode parts to escape.
摘要翻译： 根据本发明的封装基板是其表面上具有多个连接金属体的半导体芯片与与封装基板相对的表面接合的封装基板，并且包括设置在接合表面上的布线， 半导体芯片接合，设置在接合表面上并电连接到布线的多个电极部分，用于涂覆和保护布线的布线保护层，通过部分地打开布线保护层而形成的电极开口，用于分别暴露每个电极 以及与布线保护层中的每个电极开口连续形成的排出口，用于引入要连接到每个电极部分的连接金属体的一部分以逃逸。
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公开(公告)号：US20120032325A1
公开(公告)日：2012-02-09
申请号：US13274738
申请日：2011-10-17
申请人： Osamu MIYATA , Shingo Higuchi
发明人： Osamu MIYATA , Shingo Higuchi
IPC分类号： H01L23/498
CPC分类号： H01L24/30 , H01L21/78 , H01L23/3114 , H01L23/525 , H01L24/05 , H01L24/12 , H01L2224/0401 , H01L2224/05541 , H01L2224/05559 , H01L2224/05568 , H01L2224/05572 , H01L2224/0558 , H01L2224/05644 , H01L2224/13006 , H01L2224/13023 , H01L2224/16 , H01L2224/274 , H01L2224/81191 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/10157 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , H01L2924/207 , H01L2924/00 , H01L2224/05552
摘要： There is provided a semiconductor device with which stress can be prevented from locally concentrating on an external connecting terminal on a post and thus damages of the external connecting terminal can be prevented. The semiconductor device includes a semiconductor chip, a sealing resin layer stacked on a surface of the semiconductor chip, and the post which penetrates the sealing resin layer in a stacking direction of the semiconductor chip and the sealing resin layer, protrudes from the sealing resin layer, and has a periphery of the protruding portion opposedly in contact with a surface of the sealing resin layer in the stacking direction.
摘要翻译： 提供了可以防止应力局部集中在柱上的外部连接端子上的半导体器件，从而可以防止外部连接端子的损坏。 半导体器件包括半导体芯片，层叠在半导体芯片的表面上的密封树脂层和在半导体芯片和密封树脂层的堆叠方向上穿透密封树脂层的柱从密封树脂层突出 并且具有与层叠方向上的密封树脂层的表面相接触的突出部的周边。
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公开(公告)号：US20060071333A1
公开(公告)日：2006-04-06
申请号：US11242125
申请日：2005-10-04
申请人： Osamu Miyata , Shingo Higuchi
发明人： Osamu Miyata , Shingo Higuchi
IPC分类号： H01L23/48
CPC分类号： H01L23/49816 , H01L23/49838 , H01L2224/16 , H01L2224/17051 , H01L2224/17104 , H01L2924/01078 , H01L2924/00012
摘要： A packaging substrate according to the present invention is a packaging substrate to which a semiconductor chip having a plurality of connection metal bodies on a surface thereof is bonded with the surface opposed to the packaging substrate and comprises a wiring provided on a bonding surface to which the semiconductor chip is bonded, a plurality of electrode parts provided on the bonding surface and electrically connected to the wiring, a wiring protective layer for coating and protecting the wiring, electrode openings formed by partly opening the wiring protective layer for separately exposing each of the electrode parts from the wiring protective layer, and escape openings each formed in continuation with each of the electrode openings in the wiring protective layer for introducing therein a part of the connection metal body to be connected to each of the electrode parts to escape.
摘要翻译： 根据本发明的封装基板是其表面上具有多个连接金属体的半导体芯片与与封装基板相对的表面接合的封装基板，并且包括设置在接合表面上的布线， 半导体芯片接合，设置在接合表面上并电连接到布线的多个电极部分，用于涂覆和保护布线的布线保护层，通过部分地打开布线保护层而形成的电极开口，用于分别暴露每个电极 以及与布线保护层中的每个电极开口连续形成的排出口，用于引入要连接到每个电极部分的连接金属体的一部分以逃逸。
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公开(公告)号：US20090224409A1
公开(公告)日：2009-09-10
申请号：US11992985
申请日：2006-10-03
申请人： Osamu Miyata , Shingo Higuchi
发明人： Osamu Miyata , Shingo Higuchi
CPC分类号： H01L24/30 , H01L21/78 , H01L23/3114 , H01L23/525 , H01L24/05 , H01L24/12 , H01L2224/0401 , H01L2224/05541 , H01L2224/05559 , H01L2224/05568 , H01L2224/05572 , H01L2224/0558 , H01L2224/05644 , H01L2224/13006 , H01L2224/13023 , H01L2224/16 , H01L2224/274 , H01L2224/81191 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/10157 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , H01L2924/207 , H01L2924/00 , H01L2224/05552
摘要： There is provided a semiconductor device with which stress can be prevented from locally concentrating on an external connecting terminal on a post and thus damages of the external connecting terminal can be prevented. The semiconductor device includes a semiconductor chip, a sealing resin layer stacked on a surface of the semiconductor chip, and the post which penetrates the sealing resin layer in a stacking direction of the semiconductor chip and the sealing resin layer, protrudes from the sealing resin layer, and has a periphery of the protruding portion opposedly in contact with a surface of the sealing resin layer in the stacking direction.
摘要翻译： 提供了可以防止应力局部集中在柱上的外部连接端子上的半导体器件，从而可以防止外部连接端子的损坏。 半导体器件包括半导体芯片，层叠在半导体芯片的表面上的密封树脂层和在半导体芯片和密封树脂层的堆叠方向上穿透密封树脂层的柱从密封树脂层突出 并且具有与层叠方向上的密封树脂层的表面相接触的突出部的周边。
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