Reactive end group containing polyimides and polyamic acids and photosensitive compositions thereof

    公开(公告)号:US11535709B2

    公开(公告)日:2022-12-27

    申请号:US16809556

    申请日:2020-03-05

    申请人: PROMERUS, LLC

    IPC分类号: C08G73/10 G03F7/038

    摘要: Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.