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Patent Agency Ranking
公开(公告)号：US20180254398A1
公开(公告)日：2018-09-06
申请号：US15974316
申请日：2018-05-08
Inventor： Takanori AKETA , Mitsuhiko UEDA , Toru HIRANO
CPC classification number: H01L33/62 , H01L24/14 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/44 , H01L33/486 , H01L33/641 , H01L2924/01322 , H01L2933/0066 , H01L2924/00
Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
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公开(公告)号：US20170279019A1
公开(公告)日：2017-09-28
申请号：US15503872
申请日：2015-10-27
Inventor： Mitsuhiko UEDA , Yoshiharu SANAGAWA , Takanori AKETA
CPC classification number: H01L33/62 , H01L33/32 , H01L33/38 , H01L33/486 , H01L33/54 , H01L33/56 , H01L2224/16145 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/16152 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.
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公开(公告)号：US20210229120A1
公开(公告)日：2021-07-29
申请号：US17258005
申请日：2019-06-25
Inventor： Mitsuhiko UEDA , Tatsuya KIRIYAMA , Hiroaki TACHIBANA , Shogo SHIBUYA
Abstract: A mist-generating device includes: a droplet generating unit that generates, in a third liquid, a functional droplet including a first liquid that is spherical and a second liquid that covers an entirety of the first liquid and has a volatility lower than a volatility of the first liquid; and a mist-generating unit that generates a multilayer mist obtained by atomizing the third liquid containing the functional droplet.
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公开(公告)号：US20160020374A1
公开(公告)日：2016-01-21
申请号：US14774207
申请日：2014-03-11
Inventor： Takanori AKETA , Yoshiharu SANAGAWA , Mitsuhiko UEDA , Takaaki YOSHIHARA , Shintaro HAYASHI , Toshihiko SATO
CPC classification number: H01L33/647 , H01L24/32 , H01L27/156 , H01L33/387 , H01L33/40 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H01L2924/12041 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.
Abstract translation: 发光模块包括：包括具有绝缘性的树脂的第一基板和嵌入树脂中的铜成分; 位于第一基板的铜部件上方的第二基板，并焊接到铜部件上; 形成在所述第二基板上方的安装电极; 以及放置在第二基板上方的LED，并将金锡焊接到安装电极。
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公开(公告)号：US20160218262A1
公开(公告)日：2016-07-28
申请号：US14916308
申请日：2014-09-03
Inventor： Takanori AKETA , Mitsuhiko UEDA , Toru HIRANO
CPC classification number: H01L33/62 , H01L24/14 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/44 , H01L33/486 , H01L33/641 , H01L2924/01322 , H01L2933/0066 , H01L2924/00
Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
Abstract translation: 发光器件包括从LED芯片的第二导电半导体层的表面的侧面朝向安装基板的第二导体部分的表面的侧面突出的结构，以接触第二导体部分的表面，并且被定位成围绕外部 第二电极的周边。 第一电极和第一导体部通过第一接合部彼此接合，并且将第二电极和第二导体部彼此接合的第二接合部填充由第二电极，突出结构和第二导体部包围的空间。 突出结构设置成围绕第二电极的外周延伸以在平面视图中围绕第二接合部分。 安装基板的一部分在平面视图中与突出结构重叠的高度与第二接合部分的第二导体部分的高度相同或更低。
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