公开(公告)号：US20170279019A1

公开(公告)日：2017-09-28

申请号：US15503872

申请日：2015-10-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Mitsuhiko UEDA ,  Yoshiharu SANAGAWA ,  Takanori AKETA

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/56 ,  H01L33/48 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/32 ,  H01L33/38 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16152 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.

公开(公告)号：US20170122799A1

公开(公告)日：2017-05-04

申请号：US15404013

申请日：2017-01-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takafumi OKUDO ,  Takahiro MIYATAKE ,  Yoshiharu SANAGAWA ,  Masao KIRIHARA ,  Yoichi NISHIJIMA ,  Takanori AKETA ,  Ryo TOMOIDA

IPC: G01J1/04

CPC classification number: G01J1/0403 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0411 ,  G01J1/0437 ,  G01J5/0025 ,  G01J5/02 ,  G01J5/0235 ,  G01J5/06 ,  G01J5/0806 ,  G01J5/0831

Abstract: An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.

公开(公告)号：US20220178034A1

公开(公告)日：2022-06-09

申请号：US17604426

申请日：2020-03-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Mohd ERMAN ,  Fumitoshi SHINNO ,  Hiroshi ADACHI ,  Yoshiharu SANAGAWA

IPC: C25B11/063 ,  C25B1/26 ,  C25B11/093

Abstract: An electrically conductive substrate contains at least titanium. An intermediate layer is provided on a primary surface of the electrically conductive substrate. A composite layer is provided on the intermediate layer. The composite layer includes tantalum layers and catalyst layers. Each of the catalyst layers contains platinum and iridium. Each of the tantalum layers is made from tantalum oxide, tantalum, or a mixture of tantalum oxide and tantalum. The tantalum layers and the catalyst layers are alternately stacked one layer by one layer in a thickness direction of the electrically conductive substrate. A bottom layer of the composite layer closest to the primary surface of the electrically conductive substrate is constituted by one tantalum layer of the tantalum layers. A top layer of the composite layer furthest from the electrically conductive substrate is constituted by one catalyst layer of the catalyst layers.

公开(公告)号：US20160020374A1

公开(公告)日：2016-01-21

申请号：US14774207

申请日：2014-03-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takanori AKETA ,  Yoshiharu SANAGAWA ,  Mitsuhiko UEDA ,  Takaaki YOSHIHARA ,  Shintaro HAYASHI ,  Toshihiko SATO

IPC: H01L33/64 ,  H01L33/62 ,  H01L27/15 ,  H01L33/54 ,  H01L33/40 ,  H01L33/56 ,  H01L33/60 ,  H01L33/38

CPC classification number: H01L33/647 ,  H01L24/32 ,  H01L27/156 ,  H01L33/387 ,  H01L33/40 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.

Abstract translation: 发光模块包括：包括具有绝缘性的树脂的第一基板和嵌入树脂中的铜成分; 位于第一基板的铜部件上方的第二基板，并焊接到铜部件上; 形成在所述第二基板上方的安装电极; 以及放置在第二基板上方的LED，并将金锡焊接到安装电极。