公开(公告)号：US5422435A

公开(公告)日：1995-06-06

申请号：US887774

申请日：1992-05-22

Applicant: Hem P. Takiar ,  Peng-Cheng Lin ,  Luu T. Nguyen

Inventor： Hem P. Takiar ,  Peng-Cheng Lin ,  Luu T. Nguyen

IPC: H01L25/18 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H01L23/02

CPC classification number: H01L23/49575 ,  H01L23/49531 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48471 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49121

Abstract: A circuit assembly which includes a semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on the first surface. A first element having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on one of its surfaces is mounted on and at least partially supported at its second surface by the first surface of the semiconductor die. The first element is positioned such that the semiconductor die electrical contact is exposed. A fine wire conductor having first and second ends is connected at its first end to either the semiconductor die electrical contact or the first element electrical contact. A method of manufacturing this circuit assembly is also disclosed.

Abstract translation: 一种电路组件，其包括具有基本上平行的相对的第一和第二表面的半导体管芯和安装在第一表面上的至少一个电触头。 具有基本上平行的相对的第一和第二表面的第一元件以及安装在其表面之一上的至少一个电触点安装在其第二表面上并且至少部分地被半导体管芯的第一表面支撑。 第一元件被定位成使得半导体管芯电接触被暴露。 具有第一端和第二端的细线导体在其第一端处连接到半导体管芯电接触或第一元件电接触。 还公开了一种制造该电路组件的方法。

公开(公告)号：US5504370A

公开(公告)日：1996-04-02

申请号：US306668

申请日：1994-09-15

Applicant: Peng-Cheng Lin ,  Hem P. Takiar

Inventor： Peng-Cheng Lin ,  Hem P. Takiar

IPC: H01L23/495 ,  H01L25/03 ,  H01L27/07

CPC classification number: H01L23/49541 ,  H01L23/49575 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/3025

Abstract: An electronic system circuit package is disclosed herein. The package utilizes a lead frame having an electrically conductive component support segment incorporating provisions for mounting a plurality of electronic components directly on the support segment in accordance with a predetermined circuit design. The circuit package is then encapsulated in a dielectric medium. In a preferred embodiment, at least some of the electronic components are mounted directly to electrically isolated subsegments of the component support segment and electrically interconnected through their respective subsegments to other components.

Abstract translation: 本文公开了一种电子系统电路封装。 封装采用具有导电部件支撑段的引线框架，该引线框架包括根据预定电路设计将多个电子部件直接安装在支撑段上的装置。 然后将电路封装封装在电介质中。 在优选实施例中，至少一些电子部件直接安装在部件支撑部分的电隔离子部分上，并通过其相应的子部分电连接到其它部件。

公开(公告)号：US5502289A

公开(公告)日：1996-03-26

申请号：US403061

申请日：1995-03-13

Applicant: Hem P. Takiar ,  Peng-Cheng Lin

Inventor： Hem P. Takiar ,  Peng-Cheng Lin

IPC: H01L25/18 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H05K1/00

CPC classification number: H01L23/49575 ,  H01L23/49531 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48471 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49121

Abstract: A circuit assembly which includes a semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on the first surface. A first element having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on one of its surfaces is mounted on and at least partially supported at its second surface by the first surface of the semiconductor die. The first element is positioned such that the semiconductor die electrical contact is exposed. A fine wire conductor having first and second ends is connected at its first end to either the semiconductor die electrical contact or the first element electrical contact. A method of manufacturing this circuit assembly is also disclosed.

公开(公告)号：US5428245A

公开(公告)日：1995-06-27

申请号：US239346

申请日：1994-05-06

Applicant: Peng-Cheng Lin ,  Seth R. Sanders ,  Hem P. Takiar

Inventor： Peng-Cheng Lin ,  Seth R. Sanders ,  Hem P. Takiar

IPC: G01R1/20 ,  H01L23/495 ,  H01L23/48

CPC classification number: H01L23/495 ,  G01R1/20 ,  H01L23/49541 ,  H01L2924/0002 ,  Y10S257/924

Abstract: A lead frame for use in an integrated circuit package is disclosed herein. The lead frame includes a magnetic component winding wherein the winding is formed as an integral part of the lead frame. Additional windings may be formed as an integral part of the lead frame and then folded into position over the first winding to form a multiple layered magnetic component winding. In one embodiment, the lead frame based winding is coated with a magnetic material to form a lead frame based inductor. There is also disclosed a method of producing a lead frame including a magnetic component winding wherein the winding is formed as an integral part of the lead frame.

Abstract translation: 本文公开了一种用于集成电路封装的引线框架。 引线框架包括磁性部件绕组，其中绕组形成为引线框架的整体部分。 另外的绕组可以形成为引线框架的整体部分，然后折叠到第一绕组上的位置以形成多层磁性部件绕组。 在一个实施例中，基于引线框的绕组被涂覆有磁性材料以形成基于引线框架的电感器。 还公开了一种制造包括磁性部件绕组的引线框架的方法，其中绕组形成为引线框架的整体部分。

公开(公告)号：US5348316A

公开(公告)日：1994-09-20

申请号：US914950

申请日：1992-07-16

Applicant: Peng-Cheng Lin

Inventor： Peng-Cheng Lin

IPC: H01L21/683 ,  H05K13/04 ,  B25B11/00

CPC classification number: H01L21/6838 ,  H01L24/75 ,  H05K13/0408 ,  H01L2221/68322 ,  Y10T279/11

Abstract: The invention provides a method and apparatus for picking a separated semiconductor die 128 from a wafer and placing it on a die attach pad 144 for bonding thereto. In a preferred embodiment, the apparatus comprises a die collet having a body 124 with a proximal end 123 and a distal end 125; at least one pair of spaced-apart walls 136 extending distally from the distal end of the body and having opposing faces 181 defining an aperture 126, the faces of the walls being sloped such that a distal portion of the aperture is wider than the die and a proximal portion of the aperture is narrower than the die; a recess 152 on the faces of the walls extending substantially the length of the die, the recess having a distally-facing surface 154 for contacting at least a portion of the top side 138 of the die; and means for holding the die in the aperture, usually including a vacuum port 128. The method comprises providing a collet like the aforementioned; positioning the aperture 126 over a die 120; exerting a vacuum pressure through the vacuum port 128 to retain the die in the aperture such that a portion of the top side contacts the distally-facing surface 154 of the recess 152; positioning the die over the pad 144 such that the bottom side of the die is parallel to the pad; and discontinuing the vacuum pressure to release the die from the aperture.

Abstract translation: 本发明提供了一种用于从晶片拾取分离的半导体管芯128并将其放置在管芯附接垫144上用于与其结合的方法和装置。 在优选实施例中，该装置包括具有主体124的模具夹头，其具有近端123和远端125; 至少一对隔开的壁136从主体的远端向远侧延伸并且具有限定孔126的相对面181，壁的表面倾斜，使得孔的远端部分比模具更宽， 孔的近端部分比模具更窄; 在壁的表面上的凹部152基本上延伸到模具的长度，凹部具有用于接触模具的顶侧138的至少一部分的朝向远端的表面154; 以及用于将模具保持在孔中的装置，通常包括真空端口128.该方法包括提供如上所述的夹头; 将孔126定位在模具120上; 通过真空端口128施加真空压力以将模具保持在孔中，使得顶侧的一部分接触凹部152的面向远端的表面154; 将管芯定位在焊盘144上，使得管芯的底侧平行于焊盘; 并停止真空压力以从孔中释放模具。

公开(公告)号：US5339216A

公开(公告)日：1994-08-16

申请号：US25296

申请日：1993-03-02

Applicant: Peng-Cheng Lin ,  Hem P. Takiar

Inventor： Peng-Cheng Lin ,  Hem P. Takiar

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/12 ,  H01L23/16 ,  H01L23/31 ,  H01L23/34 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H05K7/20

CPC classification number: H01L24/32 ,  H01L23/16 ,  H01L23/3738 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/564 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: In semiconductor packing, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die, A thermally-conductive member is positioned in a cooperating manner with the die during the packaging process.

Abstract translation: 在半导体封装中，用于降低模具上的热应力并增强模具的强度的方法和装置。在封装过程中，导热构件以与模具协同的方式定位。

公开(公告)号：US5901043A

公开(公告)日：1999-05-04

申请号：US285344

申请日：1994-08-03

Applicant: Peng-Cheng Lin ,  Hem P. Takiar

Inventor： Peng-Cheng Lin ,  Hem P. Takiar

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/12 ,  H01L23/16 ,  H01L23/31 ,  H01L23/34 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H05K7/20

CPC classification number: H01L24/32 ,  H01L23/16 ,  H01L23/3738 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/564 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: In semiconductor packaging, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die. A thermally-conductive member is positioned in a cooperating manner with the die during the packaging process.

Abstract translation: 在半导体封装中，用于降低模具上的热应力并增强模具的强度的方法和装置。 在包装过程中，导热构件以与模具协同的方式定位。

公开(公告)号：US5495398A

公开(公告)日：1996-02-27

申请号：US462812

申请日：1995-06-05

Applicant: Hem P. Takiar ,  Peng-Cheng Lin

Inventor： Hem P. Takiar ,  Peng-Cheng Lin

IPC: H01L25/18 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H05K1/00

CPC classification number: H01L23/49575 ,  H01L23/49531 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48471 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49121

Abstract: A circuit assembly which includes a semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on the first surface. A first element having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on one of its surfaces is mounted on and at least partially supported at its second surface by the first surface of the semiconductor die. The first element is positioned such that the semiconductor die electrical contact is exposed. A fine wire conductor having first and second ends is connected at its first end to either the semiconductor die electrical contact or the first element electrical contact. A method of manufacturing this circuit assembly is also disclosed.

公开(公告)号：US5491360A

公开(公告)日：1996-02-13

申请号：US364700

申请日：1994-12-28

Applicant: Peng-Cheng Lin

Inventor： Peng-Cheng Lin

IPC: H01L23/495 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC classification number: H01L23/49541 ,  H01L23/49575 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14

Abstract: An electric packaging arrangement for isolated circuits is described. A lead frame is formed with at least one off-centered tie bar connected between one of the circuits on the lead frame's internal lead and an external handling side rail. The tie bar is off-centered by a specified distance from the longitudinal center line of the package. The external side rail is used to support and align the lead frame during manufacturing. To meet safety requirements, such as the UL-1950 requirements, electrical components in a primary circuit and a secondary circuit are attached and electrically coupled to the lead frame in a manner such that the smallest internal distance between internal circuits is at least a predefined distance. The external distance between the tie bar, connected to the secondary circuit, and the closest primary circuit pin is set to meet external circuit component spacing requirements for isolated circuits. The described arrangement has a number of applications including packaging isolated circuits using small form factor packages such as dual-in-line (DIP) and small outline (SO) packages.

Abstract translation: 描述了用于隔离电路的电气封装装置。 引线框架形成有连接在引线框架的内部引线上的一个电路和外部处理侧导轨之间的至少一个偏心连接杆。 拉杆从包装的纵向中心线偏离指定距离。 外部侧轨用于在制造过程中支撑和对齐引线框架。 为了满足诸如UL-1950要求的安全要求，初级电路和次级电路中的电气部件被附接并电连接到引线框架，使得内部电路之间的最小内部距离至少为预定距离 。 连接到次级电路的连接杆与最接近的初级电路引脚之间的外部距离设置为满足隔离电路的外部电路部件间隔要求。 所描述的布置具有许多应用，包括使用诸如双列直插（DIP）和小外形（SO）封装的小尺寸封装的封装隔离电路。

公开(公告)号：US5415331A

公开(公告)日：1995-05-16

申请号：US272713

申请日：1994-07-08

Applicant: Peng-Cheng Lin

Inventor： Peng-Cheng Lin

IPC: H01L21/683 ,  H05K13/04 ,  H01L21/52 ,  H01L21/68

CPC classification number: H01L21/6838 ,  H01L24/75 ,  H05K13/0408 ,  H01L2221/68322 ,  Y10T279/11

Abstract: The invention provides a method and apparatus for picking a separated semiconductor die 128 from a wafer and placing it on a die attach pad 144 for bonding thereto. In a preferred embodiment, the apparatus comprises a die collet having a body 124 with a proximal end 123 and a distal end 125; at least one pair of spaced-apart walls 136 extending distally from the distal end of the body and having opposing faces 181 defining an aperture 126, the faces of the walls being sloped such that a distal portion of the aperture is wider than the die and a proximal portion of the aperture is narrower than the die; a recess 152 on the faces of the walls extending substantially the length of the die, the recess having a distally-facing surface 154 for contacting at least a portion of the top side 138 of the die; and means for holding the die in the aperture, usually including a vacuum port 128. The method comprises providing a collet like the aforementioned; positioning the aperture 126 over a die 120; exerting a vacuum pressure through the vacuum port 128 to retain the die in the aperture such that a portion of the top side contacts the distally-facing surface 154 of the recess 152; positioning the die over the pad 144 such that the bottom side of the die is parallel to the pad; and discontinuing the vacuum pressure to release the die from the aperture.

Abstract translation: 本发明提供了一种用于从晶片拾取分离的半导体管芯128并将其放置在管芯附接垫144上用于与其结合的方法和装置。 在优选实施例中，该装置包括具有主体124的模具夹头，其具有近端123和远端125; 至少一对隔开的壁136从主体的远端向远侧延伸并且具有限定孔126的相对面181，壁的表面倾斜，使得孔的远端部分比模具更宽， 孔的近端部分比模具更窄; 在壁的表面上的凹部152基本上延伸到模具的长度，凹部具有用于接触模具的顶侧138的至少一部分的朝向远端的表面154; 以及用于将模具保持在孔中的装置，通常包括真空端口128.该方法包括提供如上所述的夹头; 将孔126定位在模具120上; 通过真空端口128施加真空压力以将模具保持在孔中，使得顶侧的一部分接触凹部152的面向远端的表面154; 将管芯定位在焊盘144上，使得管芯的底侧平行于焊盘; 并停止真空压力以从孔中释放模具。