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    Apparatus and method for filling high aspect ratio via holes in electronic substrates
    1.
    发明授权
    Apparatus and method for filling high aspect ratio via holes in electronic substrates 有权
    用于通过电子基板中的孔填充高纵横比的装置和方法

    公开(公告)号：US06708873B2

    公开(公告)日：2004-03-23

    申请号：US10191378

    申请日：2002-07-08

    申请人： Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

    发明人： Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

    IPC分类号： B23K3102

    CPC分类号： H05K3/4069 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/246 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0126 ,  H05K2203/085 ,  H01L2924/00

    摘要： An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e., at least 5:1 to be filled with an electrically conductive material such as a solder or a conductive polymer such that vias or interconnects can be formed in electronic substrates. The present invention apparatus and method can be advantageously used in fabricating substrates for display panels by forming conductive vias and interconnects for placing a voltage potential on pixel display elements formed on the display panels.

    摘要翻译： 公开了一种用于填充电子基板中的高纵横比孔的装置和方法，其可以有利地用于填充具有大于5:1的纵横比的孔。 在装置中，填充板和真空板与连接装置结合使用，使得在两个板之间形成间隙以容纳配备有高纵横比通孔的电子基板。 填充板配备有注入槽，而真空板配备有真空槽，使得当基板夹在其中时，通孔可以从空气排出并同时从液体的底侧和顶侧注入液体 底物。 本发明的新型设备和方法允许填充具有小直径，即小至10um，高纵横比（即至少5:1）的通孔，以填充诸如焊料的导电材料 或导电聚合物，使得可以在电子基板中形成通孔或互连。 本发明的装置和方法可以有利地用于制造用于显示面板的基板，通过形成用于在形成在显示面板上的像素显示元件上放置电压电位的导电通孔和互连。

    Apparatus for filling high aspect ratio via holes in electronic substrates
    2.
    发明授权
    Apparatus for filling high aspect ratio via holes in electronic substrates 有权
    用于通过电子基板中的孔填充高纵横比的装置

    公开(公告)号：US06461136B1

    公开(公告)日：2002-10-08

    申请号：US09383325

    申请日：1999-08-26

    申请人： Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

    发明人： Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

    IPC分类号： H05K310

    CPC分类号： H05K3/4069 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/246 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0126 ,  H05K2203/085 ,  H01L2924/00

    摘要： An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e., at least 5:1 to be filled with an electrically conductive material such as a solder or a conductive polymer such that vias or interconnects can be formed in electronic substrates. The present invention apparatus and method can be advantageously used in fabricating substrates for display panels by forming conductive vias and interconnects for placing a voltage potential on pixel display elements formed on the display panels.

    摘要翻译： 公开了一种用于填充电子基板中的高纵横比孔的装置和方法，其可以有利地用于填充具有大于5:1的纵横比的孔。 在装置中，填充板和真空板与连接装置结合使用，使得在两个板之间形成间隙以容纳配备有高纵横比通孔的电子基板。 填充板配备有注入槽，而真空板配备有真空槽，使得当基板夹在其中时，通孔可以从空气排出并同时从液体的底侧和顶侧注入液体 底物。 本发明的新型设备和方法允许填充具有小直径，即小至10um，高纵横比（即至少5:1）的通孔，以填充诸如焊料的导电材料 或导电聚合物，使得可以在电子基板中形成通孔或互连。 本发明的装置和方法可以有利地用于制造用于显示面板的基板，通过形成用于在形成在显示面板上的像素显示元件上放置电压电位的导电通孔和互连。

    Ultrasonic method and actuator for inducing motion of an object
    3.
    发明授权
    Ultrasonic method and actuator for inducing motion of an object 有权
    用于诱导物体运动的超声波方法和致动器

    公开(公告)号：US06362557B1

    公开(公告)日：2002-03-26

    申请号：US09649486

    申请日：2000-08-28

    申请人： Peter A. Gruber ,  Frederic Maurer ,  George F. Walker

    发明人： Peter A. Gruber ,  Frederic Maurer ,  George F. Walker

    IPC分类号： H01L4108

    CPC分类号： H01L41/0906

    摘要： An actuator scaled to macroscopic or microscopic sizes, uses ultrasonic energy to induce motion of an object in a desired direction. The actuator includes one or more pair of piezoelectric transducers connected with a transducer tip. Supplying the piezoelectric transducers with alternating current electrical power causes the tip to vibrate at ultrasonic frequencies. Urging the vibrating tip into contact with a surface on the object at a selected angle of inclination induces the object to move in the desired direction at a rate determined by the inclination angle. Multiple actuators can be used to induce a fall range of movements of variously shaped objects. In microscopic form, the actuator can be used to create a MEMS device. The optional application of a compliant material either on the transducer tip or on the object's surface enhances the movement induced by the actuator.

    摘要翻译： 按照宏观或微观尺寸的致动器，使用超声波能量来诱导物体沿所需方向的运动。 致动器包括与换能器尖端连接的一对或多对压电换能器。 为具有交流电功率的压电换能器提供使尖端以超声频率振动。 将振动尖端以选定的倾斜角度与物体上的表面接触，使得物体以由倾斜角确定的速率在所需方向上移动。 可以使用多个致动器来引起各种形状物体的运动的下降范围。 在微观形式中，致动器可用于创建MEMS装置。 在换能器尖端或物体表面上可选地应用柔性材料增强了由致动器引起的运动。

    Method and apparatus for forming solder bumps
    5.
    发明授权
    Method and apparatus for forming solder bumps 失效
    用于形成焊料凸点的方法和装置

    公开(公告)号：US6056191A

    公开(公告)日：2000-05-02

    申请号：US70121

    申请日：1998-04-30

    申请人： Guy Paul Brouillette ,  Peter Alfred Gruber ,  Frederic Maurer

    发明人： Guy Paul Brouillette ,  Peter Alfred Gruber ,  Frederic Maurer

    IPC分类号： B23K3/06 ,  H01L21/60 ,  H05K3/34 ,  B23K3/00

    CPC分类号： H05K3/3457 ,  B23K3/0623 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0113

    摘要： The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface. The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2.5 .mu.m per inch of die length. The present invention further provides a method and apparatus for filling a multiplicity of cavities in a mold surface by providing a stream of molten solder and then intimately contacting the surface of the molten solder with a multiplicity of cavities such that the molten solder readily fills the cavities. The apparatus further provides means for removing excess molten solder from the surface of the mold without disturbing the molten solder already filled in the cavities. The present invention further discloses a flexible die for dispensing molten solder consisting of a die body that is constructed of a metal sheet capable of flexing of not less than 1.5 .mu.m per inch of die length, a gate opening for receiving a supply of molten solder, a slot opening for dispensing the molten solder onto a solder receiving surface, and a pressure means associated with the die body for providing adequate pressure such that the die body intimately contacting the solder receiving mold surface.

    摘要翻译： 本发明公开了一种通过熔融焊料筛选技术形成焊料凸块的方法和装置，其中使用由金属板构成的柔性模头来保持模头和焊料接收模具表面之间的紧密接触。 当与压力装置组合使用时，柔性模头能够符合任何弯曲的模具表面，只要曲率不超过每英寸模头长度2.5微米。 本发明还提供了一种用于通过提供熔融焊料流来填充模具表面中的多个空腔并随后使熔融焊料的表面与多个空腔紧密接触的方法和装置，使得熔融焊料容易地填充空腔 。 该装置还提供了用于从模具表面去除多余的熔融焊料而不干扰已经填充在空腔中的熔融焊料的装置。 本发明还公开了一种用于分配熔融焊料的柔性模具，其由由能够弯曲不小于每英寸模头长度1.5μm的金属板构成的模具本体构成，用于接收熔融焊料供应的门开口 ，用于将熔融焊料分配到焊料接收表面上的槽口，以及与模具本体相关联的压力装置，用于提供足够的压力，使得模具体与焊料接收模具表面紧密接触。

    Method and apparatus for forming solder bumps
    10.
    发明授权
    Method and apparatus for forming solder bumps 有权
    用于形成焊料凸点的方法和装置

    公开(公告)号：US06394334B1

    公开(公告)日：2002-05-28

    申请号：US09536810

    申请日：2000-03-28

    申请人： Guy Paul Brouillette ,  Peter Alfred Gruber ,  Frederic Maurer

    发明人： Guy Paul Brouillette ,  Peter Alfred Gruber ,  Frederic Maurer

    IPC分类号： B23K100

    CPC分类号： B23K3/00 ,  B23K1/00 ,  B23K3/0623 ,  B33Y30/00 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3457 ,  H05K2203/0113 ,  H01L2924/00014

    摘要： The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface, The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2.5 &mgr;m per inch of die length. The present invention further provides a method and apparatus for filling a multiplicity of cavities in a mold surface by providing a stream of molten solder and then intimately contacting the surface of the molten solder with a multiplicity of cavities such that the molten solder readily fills the cavities. The apparatus further provides means for removing excess molten solder from the surface of the mold without disturbing the molten solder already filled in the cavities. The present invention further discloses a flexible die for dispensing molten solder consisting of a die body that is constructed of a metal sheet capable of flexing of not less than 1.5 &mgr;m per inch of die length, a gate opening for receiving a supply of molten solder, a slot opening for dispensing the molten solder onto a solder receiving surface, and a pressure means associated with the die body for providing adequate pressure such that the die body intimately contacting the solder receiving mold surface.

    摘要翻译： 本发明公开了一种通过熔融焊料筛选技术形成焊料凸块的方法和装置，其中使用由金属板构成的柔性模头来保持模头和焊料接收模具表面之间的紧密接触。柔性模具 当与压力装置组合使用时，头部能够符合任何弯曲的模具表面，只要曲率不超过2.5英寸/英寸的模头长度。 本发明还提供了一种用于通过提供熔融焊料流来填充模具表面中的多个空腔并随后使熔融焊料的表面与多个空腔紧密接触的方法和装置，使得熔融焊料容易地填充空腔 。 该装置还提供了用于从模具表面去除多余的熔融焊料而不干扰已经填充在空腔中的熔融焊料的装置。 本发明还公开了一种用于分配熔融焊料的柔性模具，其由由能够弯曲不小于1.5mum /英寸的模具长度的金属板构成的模具本体构成，用于接收熔融焊料的供给的闸门开口， 用于将熔融焊料分配到焊料接收表面上的槽口，以及与模具主体相关联的压力装置，用于提供足够的压力，使得模具体与焊料接收模具表面紧密接触。