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    Heterogeneous integrated circuits and devices thereof with a surrogate substrate and transferred semiconductor devices
    1.
    发明授权
    Heterogeneous integrated circuits and devices thereof with a surrogate substrate and transferred semiconductor devices 有权
    异质集成电路及其装置具有替代衬底和转移的半导体器件

    公开(公告)号：US09524872B1

    公开(公告)日：2016-12-20

    申请号：US13096780

    申请日：2011-04-28

    申请人： Peter D. Brewer ,  Andrew T. Hunter ,  Yakov Royter

    发明人： Peter D. Brewer ,  Andrew T. Hunter ,  Yakov Royter

    IPC分类号： H01L21/30 ,  H01L21/18

    CPC分类号： H01L21/185 ,  H01L21/18 ,  H01L21/187 ,  H01L21/76251 ,  H01L21/76264 ,  H01L21/82 ,  H01L21/8258

    摘要： A heterogeneous integrated circuit and method of making the same. An integrated circuit includes a surrogate substrate including a material selected from the group consisting of Group II, Group III, Group IV, Group V, and Group VI materials and their combinations; at least one active semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials; and at least one transferred semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials. The at least one active semiconductor device and the at least one transferred device are interconnected.

    摘要翻译： 异构集成电路及其制作方法。 集成电路包括包括选自由组II，组III，组IV，组V和组VI材料及其组合组成的组的材料的替代衬底; 至少一个活性半导体器件，其包括选自由IV-IV族，III-V族和II-VI族组成的组的材料组合; 以及至少一个转移的半导体器件，其包括选自由IV-IV族，III-V族和II-VI族组成的组的材料组合。 所述至少一个有源半导体器件和所述至少一个转移器件互连。

    Method of fabrication of heterogeneous integrated circuits and devices thereof
    2.
    发明授权
    Method of fabrication of heterogeneous integrated circuits and devices thereof 有权
    异质集成电路的制造方法及其装置

    公开(公告)号：US07972936B1

    公开(公告)日：2011-07-05

    申请号：US12365112

    申请日：2009-02-03

    申请人： Peter D. Brewer ,  Andrew T. Hunter ,  Yakov Royter

    发明人： Peter D. Brewer ,  Andrew T. Hunter ,  Yakov Royter

    IPC分类号： H01L21/30

    CPC分类号： H01L21/185 ,  H01L21/18 ,  H01L21/187 ,  H01L21/76251 ,  H01L21/76264 ,  H01L21/82 ,  H01L21/8258

    摘要： A heterogeneous integrated circuit and method of making the same. An integrated circuit includes a surrogate substrate including a material selected from the group consisting of Group II, Group III, Group IV, Group V, and Group VI materials and their combinations; at least one active semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials; and at least one transferred semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials. The at least one active semiconductor device and the at least one transferred device are interconnected.

    摘要翻译： 异构集成电路及其制作方法。 集成电路包括包括选自由组II，组III，组IV，组V和组VI材料及其组合组成的组的材料的替代衬底; 至少一个活性半导体器件，其包括选自由IV-IV族，III-V族和II-VI族组成的组的材料组合; 以及至少一个转移的半导体器件，其包括选自由IV-IV族，III-V族和II-VI族组成的组的材料组合。 所述至少一个有源半导体器件和所述至少一个转移器件互连。

    Method of self-latching for adhesion during self-assembly of electronic or optical components
    5.
    发明授权
    Method of self-latching for adhesion during self-assembly of electronic or optical components 失效
    电子或光学部件自组装过程中自锁的方法

    公开(公告)号：US06974604B2

    公开(公告)日：2005-12-13

    申请号：US10218053

    申请日：2002-08-12

    申请人： Andrew T. Hunter ,  Peter D. Brewer

    发明人： Andrew T. Hunter ,  Peter D. Brewer

    IPC分类号： B05D3/10 ,  B32B7/00 ,  C09J5/04 ,  G02B3/00 ,  H01L21/98 ,  H01L23/00 ,  H01Q21/00

    CPC分类号： H01L25/50 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2924/01322 ,  H01L2924/00

    摘要： A method for assembling components on a substrate including the steps of: (a) selectively coating at least a first receptor site of the substrate with a liquid precursor that forms a solid adhesive upon contact with an initiator; (b) providing each of the components with an adhesion surface that has the initiator; and (c) depositing the components on the substrate in a manner that causes a first of the components to contact the at least first receptor site whereupon contact between the initiator and the liquid precursor causes formation of the adhesive which affixes the first compound to the first receptor site. In a preferred embodiment of the invention, the precursor is a liquid monomer and the initiator initiates a polymerization reaction upon contact with the monomer to form a solid polymer.

    摘要翻译： 一种用于在基板上组装部件的方法，包括以下步骤：（a）用与引发剂接触时形成固体粘合剂的液体前体选择性地涂覆基材的至少第一受体部位; （b）为每个组分提供具有引发剂的粘合表面; 和（c）以使得第一组分接触所述至少第一受体部位的方式将组分沉积在基底上，由此引发剂和液体前体之间的接触引起粘合剂的形成，所述粘合剂将第一化合物固定到第一 受体位点。 在本发明的优选实施方案中，前体是液体单体，并且引发剂在与单体接触时引发聚合反应以形成固体聚合物。

    Carbon nanotube array interface material and methods
    6.
    发明授权
    Carbon nanotube array interface material and methods 有权
    碳纳米管阵列界面材料及方法

    公开(公告)号：US08808857B1

    公开(公告)日：2014-08-19

    申请号：US12185020

    申请日：2008-08-01

    申请人： Peter D. Brewer ,  Andrew T. Hunter

    发明人： Peter D. Brewer ,  Andrew T. Hunter

    IPC分类号： B32B9/00

    CPC分类号： B32B9/00 ,  B32B5/24 ,  Y10T428/30

    摘要： An interface material employing carbon nanotube (CNT) array and a method of fabricating the same. A first CNT array is provided on a first substrate. A second CNT array is provided on a second substrate. A first support layer is disposed on the first CNT array, wherein the first CNT array is between the first support layer and the first substrate. A second support layer is disposed on the second CNT array, wherein the second CNT array is between the second support layer and the second substrate. The first support layer is attached to the second support layer. The first and second substrates are removed, thereby providing the interface material.

    摘要翻译： 使用碳纳米管（CNT）阵列的界面材料及其制造方法。 在第一衬底上提供第一CNT阵列。 第二CNT阵列设置在第二基板上。 第一支撑层设置在第一CNT阵列上，其中第一CNT阵列位于第一支撑层和第一基底之间。 第二支撑层设置在第二CNT阵列上，其中第二CNT阵列位于第二支撑层和第二基板之间。 第一支撑层附接到第二支撑层。 去除第一和第二基板，从而提供界面材料。

    Self-location method and apparatus
    8.
    发明授权
    Self-location method and apparatus 失效
    自定位方法和装置

    公开(公告)号：US07105376B1

    公开(公告)日：2006-09-12

    申请号：US10888178

    申请日：2004-07-08

    申请人： Peter D. Brewer ,  Clifford A. Lebeau ,  Andrew T. Hunter

    发明人： Peter D. Brewer ,  Clifford A. Lebeau ,  Andrew T. Hunter

    IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/46

    CPC分类号： H01L24/95 ,  H01L21/68 ,  H01L25/50 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14

    摘要： A method and apparatus for transporting and dispersing microstructures on a substrate by fluidic self-assembly. The apparatus has an assembly vessel that is tilted and rotated to apply uncaptured microstructures back onto the substrate as the assembly vessel rotates. The assembly vessel has ramp structures that collect the microstructures that have not been captured by the substrate at the lower edge of the assembly vessel, carry the microstructures as the assembly vessel rotates, and release the microstructures back on to the substrate at the upper edge of the assembly vessel. Vibrational energy may also be applied to the assembly vessel to assist in the dispersal and location of the microstructures on the substrate.

    摘要翻译： 一种用于通过流体自组装在基底上传送和分散微结构的方法和装置。 该装置具有一个组装容器，该容器在组装容器旋转时倾斜并旋转以将未捕获的微结构施加到衬底上。 组装容器具有倾斜结构，其收集在组装容器的下边缘处未被基底捕获的微结构，当组装容器旋转时承载微结构，并将微结构释放回到基底上的上边缘 装配船。 也可以将振动能量施加到组装容器上以帮助微结构在基底上的分散和定位。