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1.发明授权公开(公告)号：US06583385B1
公开(公告)日：2003-06-24
申请号：US10028417
申请日：2001-12-19
IPC分类号： B23K1005
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/0056 , B23K26/0838 , B23K26/10 , B23K2101/42 , H01R43/0221 , H01R43/0256
摘要： A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads along a common axis, placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser, and sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.
摘要翻译： 公开了一种用于回流分散在连接到柔性基板的多个电路导体焊盘和使用激光的至少一个电子部件之间的焊料的方法。 该方法包括沿公共轴对准多个电路导体焊盘，将至少一个具有浅色表面侧的电子部件放置在一对电路导体焊盘上，其中浅色表面面对激光，并且扫掠 激光穿过多个电子部件和导体焊盘以回流焊料而不损坏衬底。
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2.发明授权公开(公告)号：US07030977B2
公开(公告)日：2006-04-18
申请号：US10430669
申请日：2003-05-06
IPC分类号： G01N21/00
CPC分类号： H05K13/08
摘要： The present invention provides a system for the contactless testing and configuring of electronic assemblies during the manufacturing process. The system includes an onboard optical transceiver, a system controller, and a controller optical transceiver. The onboard optical transceiver is located on the electronic assembly. The onboard optical transceiver is connected to an integrated circuit which is capable of performing functional tests or storing programs on the assembly. The controller optical transceiver is connected to the system controller and located adjacent to the electronic assembly. The onboard transceiver and the controller optical transceiver are used to establish a contactless communication link between the system controller and the electronic assembly. The contactless nature of the communication link allows the assembly to be transported past the controller optical transceiver by a simple conveyor while the system controller is communicating with the electronic assembly.
摘要翻译： 本发明提供了一种用于在制造过程中非接触式测试和配置电子组件的系统。 该系统包括板载光收发器，系统控制器和控制器光收发器。 车载光收发器位于电子组件上。 板载光收发器连接到能够对组件进行功能测试或存储程序的集成电路。 控制器光收发器连接到系统控制器并位于电子组件附近。 板载收发器和控制器光收发器用于在系统控制器和电子组件之间建立非接触式通信链路。 通信链路的非接触性质允许组件通过简单的传送带传输通过控制器光收发器，同时系统控制器与电子组件通信。
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公开(公告)号：US06830176B2
公开(公告)日：2004-12-14
申请号：US10061599
申请日：2002-02-01
申请人： Peter Joseph Sinkunas , Zhong-You Shi , Jay D. Baker , Robert Edward Belke , Charles Frederick Schweitzer , Raymond Eric Foster , Stephen Edward Fuks
发明人： Peter Joseph Sinkunas , Zhong-You Shi , Jay D. Baker , Robert Edward Belke , Charles Frederick Schweitzer , Raymond Eric Foster , Stephen Edward Fuks
IPC分类号： B23K3100
摘要： A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.
摘要翻译： 公开了一种用于修复柔性电路的新系统和方法。 柔性电路向电子设备传导电信号。 该系统通常包括柔性电路衬底，至少一个电导体和修补贴片。 柔性电路基板具有切割区域和修复区域。 所述至少一个电导体由所述柔性电路基板支撑。 电导体被配置为承载电信号。 修补补片用于至少电连接两个维修区域。
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公开(公告)号：US07102888B2
公开(公告)日：2006-09-05
申请号：US10828396
申请日：2004-04-20
申请人： Andrew Z. Glovatsky , Jay D. Baker , Richard Keith McMillan , Myron Lemecha , Daniel Roger Vander Sluis
发明人： Andrew Z. Glovatsky , Jay D. Baker , Richard Keith McMillan , Myron Lemecha , Daniel Roger Vander Sluis
CPC分类号： B60R16/0207
摘要： An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.
摘要翻译： 集成车辆结构包括塑料支撑结构中的电子位置。 该电子站点具有安装在其上的电子部件的柔性基板。 塑料支撑结构限定了塑料安装表面，其包括从塑料支撑结构突出的多个细长肋。 每个肋具有形成塑料安装表面的一部分的侧边缘。 柔性基板安装到塑料安装表面，并且多个气流通道由柔性基板中的相邻肋限定。 也可以提供限定金属安装表面的方法支撑结构。 一个或多个电子侧可以附接到金属和塑料安装表面。
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公开(公告)号：US07024067B2
公开(公告)日：2006-04-04
申请号：US10268407
申请日：2002-10-10
申请人： Jay D. Baker , Zhong-You Shi , Lawrence L. Kneisel
发明人： Jay D. Baker , Zhong-You Shi , Lawrence L. Kneisel
IPC分类号： G02B6/26
CPC分类号： F02D41/28 , F02B75/22 , F02B77/085 , F02B77/089 , F02D2400/18 , F02M51/005 , F05C2225/08 , G01F23/2925 , G01L11/02 , G01L23/16 , G02B6/12004 , G02B6/12007 , G02B6/122 , G02B6/1221 , G02B6/4298 , G02B6/43 , G02B2006/12104 , G02B2006/12109 , G08C23/02 , G08C2201/31 , G08C2201/41
摘要： A signal transmission system comprising a signal conduction matrix formed into a shape that allows transmission of a signal through the matrix using at least one surface signal router, at least one signal source operatively connected to a surface of the matrix and that generates a signal that propagates through matrix, and at least one signal receiver operatively connected to a surface of the matrix and that receives the signal from the signal source. The signal may be coded, modulated, frequency-converted, or amplified. The surface signal router can be a reflective coating, an indentation, a pressure fit structure, or at least one inclined cut on the surface of the matrix. A frequency-selective filter can be used to allow selective detection by a target signal receiver. The invention is also directed to various method of transmitting a signal using a signal conduction matrix.
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公开(公告)号：US5116641A
公开(公告)日：1992-05-26
申请号：US570063
申请日：1990-08-20
申请人： Daxesh K. Patel , Jay D. Baker
发明人： Daxesh K. Patel , Jay D. Baker
CPC分类号： H01C17/00 , H01L21/705 , H05K3/0029 , H05K1/0306 , H05K1/092 , H05K1/16 , H05K1/167 , H05K2203/0769 , H05K2203/0783 , H05K2203/1383 , H05K3/0052 , H05K3/0097 , H05K3/28
摘要： A method is provided for forming a thick-film circuit having at least one thick-film resistor element upon a substrate and laser scribing the substrate to remove the circuit from the remaining portion of the substrate. A thick-film circuit comprising conductor lines and at least one resistor element is first printed upon a substrate. Thereafter, the resistor element may be laser trimmed to increase the resistance value thereof. After laser trimming, a protective material such as ethyl cellulose is coated onto the outer surface of the resistor element to protect it from hot-slag ceramic material generated during a laser scribing operation. The substrate is then topside laser scribed to separate the thick-film circuit from the remaining portion of the substrate. Following laser scribing, the protective material is removed by washing the resistor element with a solvent.
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公开(公告)号：US06501031B1
公开(公告)日：2002-12-31
申请号：US09655809
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Jay D. Baker , Robert Edward Belke , Myron Lemecha , Richard Keith McMillan , Thomas B. Krautheim
发明人： Andrew Z. Glovatsky , Jay D. Baker , Robert Edward Belke , Myron Lemecha , Richard Keith McMillan , Thomas B. Krautheim
IPC分类号： H05K111
CPC分类号： H05K3/445 , H05K3/386 , H05K3/4038 , H05K3/4092 , H05K2201/0305 , H05K2201/0361 , H05K2201/0394 , H05K2201/0397 , H05K2201/09554 , H05K2201/09581 , H05K2203/1438 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/49172
摘要： A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the dielectric layer 14 and core member 12 using a layer of adhesive material 18. Circuit board design 10 further having selectively formed “blind” apertures, vias or cavities 22 formed through the first circuit portion 20, dielectric layer 14, and adhesive layer 18, thereby exposing core member 12.
摘要翻译： 具有芯构件12，设置在其上的一对电介质层14,16的多层电子电路板设计10以及使用粘合材料层连接到电介质层14和芯构件12的第一电路部分20 电路板设计10还具有选择性地形成通过第一电路部分20形成的“盲”孔，通孔或空腔22，电介质层14和粘合层18，从而露出芯构件12。
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公开(公告)号：US06412168B1
公开(公告)日：2002-07-02
申请号：US09655750
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Jay D. Baker
发明人： Andrew Z. Glovatsky , Jay D. Baker
IPC分类号： H01K310
CPC分类号： H05K3/4038 , H05K3/386 , H05K3/44 , H05K2201/0305 , H05K2201/0361 , H05K2201/0397 , H05K2201/09554 , Y10T29/49126 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165
摘要： A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26.
摘要翻译： 具有选择性地形成的孔或腔26的多层电子电路板设计10
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9.发明授权
公开(公告)号：US5579573A
公开(公告)日：1996-12-03
申请号：US320812
申请日：1994-10-11
CPC分类号： H01L24/29 , H01L21/563 , H01L24/32 , H01L2224/1319 , H01L2224/16225 , H01L2224/274 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/01047 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , Y10T29/49144 , Y10T29/49146
摘要： Method for fabricating an undercoated chip electrically interconnected to a substrate. The method includes the initial step of depositing a predetermined quantity of a liquid undercoat material onto the chip or the substrate. The method continues with the step of interconnecting the chip to the substrate so as to form an electrical interconnection bond therebetween. Finally, the method concludes with the step of heating, reflowing and curing the undercoat material during or after the step of electrically interconnecting the chip to the substrate.
摘要翻译： `制造与基片电连接的底涂芯片的方法。 该方法包括将预定量的液体底涂层材料沉积到芯片或基底上的初始步骤。 该方法继续将芯片与衬底互连以在其间形成电互连结的步骤。 最后，该方法的结论是在将芯片与衬底电互连的步骤期间或之后加热，回流和固化底涂层材料的步骤。
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公开(公告)号：US5545073A
公开(公告)日：1996-08-13
申请号：US43943
申请日：1993-04-05
摘要： An apparatus and method for cleaning a workpiece with abrasive CO.sub.2 snow operates with a nozzle for creating and expelling the snow. The nozzle includes an upstream section for receiving CO.sub.2 in a gaseous form, and having a first contour shaped for subsonic flow of the CO.sub.2. The nozzle also includes a downstream section for directing the flow of the CO.sub.2 and the snow toward the workpiece, with the downstream section having a second contour shaped for supersonic flow of the CO.sub.2. The nozzle includes a throat section, interposed between the upstream and downstream sections, for changing the CO.sub.2 from the gaseous phase along a constant entropy line to a gas and snow mixture within the downstream section at a speed of at least Mach 1.0. In this manner, additional kinetic energy is imparted to the snow by delaying the conversion into the solid phase until the gaseous CO.sub.2 reaches supersonic speeds.
摘要翻译： 用研磨二氧化碳雪清洁工件的设备和方法与用于产生和排出雪的喷嘴一起工作。 喷嘴包括用于接收气体形式的CO 2的上游部分，并且具有成形为CO 2的亚音速流的第一轮廓。 喷嘴还包括用于将CO 2和雪的流动引向工件的下游部分，其中下游部分具有成形为用于CO 2的超音速流动的第二轮廓。 喷嘴包括插入在上游部分和下游部分之间的喉部，用于将CO 2从气相沿着恒定的熵线以至少马赫数为1.0的速度在下游部分内改变为气体和混合物。 以这种方式，通过延迟转化为固相直到气态CO 2达到超音速速度，赋予雪额外的动能。
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