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1.发明授权公开(公告)号：US06583385B1
公开(公告)日：2003-06-24
申请号：US10028417
申请日：2001-12-19
IPC分类号： B23K1005
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/0056 , B23K26/0838 , B23K26/10 , B23K2101/42 , H01R43/0221 , H01R43/0256
摘要： A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads along a common axis, placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser, and sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.
摘要翻译： 公开了一种用于回流分散在连接到柔性基板的多个电路导体焊盘和使用激光的至少一个电子部件之间的焊料的方法。 该方法包括沿公共轴对准多个电路导体焊盘，将至少一个具有浅色表面侧的电子部件放置在一对电路导体焊盘上，其中浅色表面面对激光，并且扫掠 激光穿过多个电子部件和导体焊盘以回流焊料而不损坏衬底。
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2.发明授权公开(公告)号：US07030977B2
公开(公告)日：2006-04-18
申请号：US10430669
申请日：2003-05-06
IPC分类号： G01N21/00
CPC分类号： H05K13/08
摘要： The present invention provides a system for the contactless testing and configuring of electronic assemblies during the manufacturing process. The system includes an onboard optical transceiver, a system controller, and a controller optical transceiver. The onboard optical transceiver is located on the electronic assembly. The onboard optical transceiver is connected to an integrated circuit which is capable of performing functional tests or storing programs on the assembly. The controller optical transceiver is connected to the system controller and located adjacent to the electronic assembly. The onboard transceiver and the controller optical transceiver are used to establish a contactless communication link between the system controller and the electronic assembly. The contactless nature of the communication link allows the assembly to be transported past the controller optical transceiver by a simple conveyor while the system controller is communicating with the electronic assembly.
摘要翻译： 本发明提供了一种用于在制造过程中非接触式测试和配置电子组件的系统。 该系统包括板载光收发器，系统控制器和控制器光收发器。 车载光收发器位于电子组件上。 板载光收发器连接到能够对组件进行功能测试或存储程序的集成电路。 控制器光收发器连接到系统控制器并位于电子组件附近。 板载收发器和控制器光收发器用于在系统控制器和电子组件之间建立非接触式通信链路。 通信链路的非接触性质允许组件通过简单的传送带传输通过控制器光收发器，同时系统控制器与电子组件通信。
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公开(公告)号：US20050258153A1
公开(公告)日：2005-11-24
申请号：US10850223
申请日：2004-05-20
CPC分类号： H05K3/363 , B23K1/0008 , B23K2101/38 , H05K3/3494 , H05K2201/0108 , H05K2201/0397 , H05K2203/107
摘要： A method for interconnecting flat cable is disclosed. The flat cable has a plurality of conductors attached to an insulating layer. The method includes removing an insulation layer from a first and second flat cable portions to expose the plurality of conductors, applying a thermal plate to the exposed plurality of conductors of the first flat cable portion, applying solder to first flat cable portion, placing the plurality of conductors of second flat cable portion over the plurality of conductors of first flat cable portion having applied solder, applying a transparent plate over the first and second flat cable portions, scanning a laser beam through the transparent plate to reflow the solder between the first and second flat cable portions.
摘要翻译： 公开了一种用于互连扁平电缆的方法。 扁平电缆具有连接到绝缘层的多个导体。 该方法包括从第一和第二扁平电缆部分去除绝缘层以露出多个导体，将热板施加到暴露的第一扁平电缆部分的多个导体，将焊料施加到第一扁平电缆部分， 在第一扁平电缆部分的多个导体上的第二扁平电缆部分的导体上具有所施加的焊料，在第一和第二扁平电缆部分上施加透明板，扫描通过透明板的激光束以在第一和第二扁平电缆部分之间回流焊料， 第二扁平电缆部分。
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4.发明授权公开(公告)号：US06612025B1
公开(公告)日：2003-09-02
申请号：US09656043
申请日：2000-09-06
IPC分类号： H05K334
CPC分类号： H05K3/4038 , H05K3/062 , H05K3/445 , H05K3/4641 , H05K2201/0305 , H05K2201/0361 , H05K2201/0373 , H05K2201/0394 , H05K2201/0397 , H05K2201/09581 , H05K2203/1438 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： A method for forming connections within a multi-layer electronic circuit board 10. The method includes forming an aperture within the circuit board and selectively coating the interior surface of the aperture with a polar solder mask material that is effective to bond with solder that is selectively inserted into the aperture, thereby retaining the solder within the aperture and improving the electrical connection provided by the solder.
摘要翻译： 一种用于在多层电子电路板10内形成连接的方法。该方法包括在电路板内形成孔，并用极性焊料掩模材料选择性地涂覆孔的内表面，极性焊料掩模材料有效地与选择性地焊接 插入到孔中，从而将焊料保持在孔内并改善由焊料提供的电连接。
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公开(公告)号：US07009142B2
公开(公告)日：2006-03-07
申请号：US10850223
申请日：2004-05-20
IPC分类号： B23K26/00
CPC分类号： H05K3/363 , B23K1/0008 , B23K2101/38 , H05K3/3494 , H05K2201/0108 , H05K2201/0397 , H05K2203/107
摘要： A method for interconnecting flat cable is disclosed. The flat cable has a plurality of conductors attached to an insulating layer. The method includes removing an insulation layer from a first and second flat cable portions to expose the plurality of conductors, applying a thermal plate to the exposed plurality of conductors of the first flat cable portion, applying solder to first flat cable portion, placing the plurality of conductors of second flat cable portion over the plurality of conductors of first flat cable portion having applied solder, applying a transparent plate over the first and second flat cable portions, scanning a laser beam through the transparent plate to reflow the solder between the first and second flat cable portions.
摘要翻译： 公开了一种用于互连扁平电缆的方法。 扁平电缆具有连接到绝缘层的多个导体。 该方法包括从第一和第二扁平电缆部分去除绝缘层以露出多个导体，将热板施加到暴露的第一扁平电缆部分的多个导体，将焊料施加到第一扁平电缆部分， 在第一扁平电缆部分的多个导体上的第二扁平电缆部分的导体具有施加的焊料，在第一和第二扁平电缆部分上施加透明板，扫描通过透明板的激光束以在第一和第二扁平电缆部分之间回流焊料， 第二扁平电缆部分。
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