MAKING AN ORDERED ELEMENT LIST
    1.
    发明申请
    MAKING AN ORDERED ELEMENT LIST 有权
    订购订单单元清单

    公开(公告)号:US20130181043A1

    公开(公告)日:2013-07-18

    申请号:US13351645

    申请日:2012-01-17

    IPC分类号: G06F17/40

    CPC分类号: G06K19/06037 G06K7/1465

    摘要: A method of making an ordered element list includes providing a plurality of machine-readable codes, each machine-readable code encoding a corresponding element or a reference to a corresponding element, and wherein each element of the plurality of elements forms a portion of a plurality of different ordered lists, each ordered list enabling a function having one or more operations; using a receiver to receive in order a digital image of each of a plurality of the machine-readable codes; using a processor to extract the elements received or referenced by the received digital images of the machine-readable codes; arranging the extracted elements in the received order to form an ordered list; and using a processor to perform the function enabled by the ordered list.

    摘要翻译: 制造有序元素列表的方法包括提供多个机器可读代码,每个机器可读代码编码对应元件或对相应元件的引用,并且其中多个元素中的每个元素形成多个元件的一部分 每个有序列表启用具有一个或多个操作的功能; 使用接收机按顺序接收多个机器可读代码中的每一个的数字图像; 使用处理器来提取由所接收的机器可读代码的数字图像接收或引用的元素; 以所接收的顺序排列所提取的元素以形成有序列表; 并使用处理器执行由有序列表启用的功能。

    APPARATUS AND METHOD FOR USING MACHINE-READABLE CODES
    2.
    发明申请
    APPARATUS AND METHOD FOR USING MACHINE-READABLE CODES 失效
    使用机器可读代码的装置和方法

    公开(公告)号:US20130062402A1

    公开(公告)日:2013-03-14

    申请号:US13231125

    申请日:2011-09-13

    IPC分类号: G06F17/30 G06K7/10

    CPC分类号: G06K7/10792

    摘要: A method of using a machine-readable code to extract information includes using an image-capture device to capture a digital image of a machine-readable code encoding information wherein the image-capture device is positioned at any of a plurality of angles relative to the machine-readable code; using a processor to extract the information encoded in the machine-readable code; using the processor to analyze the captured digital image of the machine-readable code and calculate the relative positioned angle at which the image-capture device was positioned when the image-capture device captured the digital image of the machine-readable code; and using the processor and the calculated relative positioned angle to determine information.

    摘要翻译: 使用机器可读代码提取信息的方法包括使用图像捕获设备来捕获机器可读代码编码信息的数字图像,其中图像捕获设备相对于所述多个角度位于任意多个角度 机器可读代码; 使用处理器提取在机器可读代码中编码的信息; 使用所述处理器来分析所述机器可读代码的所捕获的数字图像,并且当所述图像捕获设备捕获所述机器可读代码的数字图像时,计算所述图像捕获设备所位于的相对定位的角度; 并使用处理器和计算的相对定位角来确定信息。

    IMPRINTED MULTI-LAYER MICRO-STRUCTURE
    4.
    发明申请
    IMPRINTED MULTI-LAYER MICRO-STRUCTURE 有权
    改进的多层微结构

    公开(公告)号:US20150060111A1

    公开(公告)日:2015-03-05

    申请号:US14012195

    申请日:2013-08-28

    申请人: RONALD STEVEN COK

    发明人: RONALD STEVEN COK

    IPC分类号: H05K1/02

    摘要: An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.

    摘要翻译: 压印的微结构包括具有与之相关的第一层的衬底。 第一,第二和第三微通道印在第一层中,并且分别位于其中的第一,第二和第三微细线。 第二层与第一层相邻并与第一层接触。 包括第一和第二连接微线的印刷的第一和第二连接微通道分别与第一和第二微线接触并与第三微线隔离。 第三层与第二层相邻并与第二层接触,并且具有印刷桥微通道,桥接微线与第一和第二连接微线接触并与第三微线分离,使得第一和第二 微线电连接并与第三微线电隔离。

    EMBOSSED MICRO-STRUCTURE WITH CURED TRANSFER MATERIAL METHOD
    5.
    发明申请
    EMBOSSED MICRO-STRUCTURE WITH CURED TRANSFER MATERIAL METHOD 有权
    固化微结构与固化转移材料方法

    公开(公告)号:US20140262452A1

    公开(公告)日:2014-09-18

    申请号:US13833244

    申请日:2013-03-15

    IPC分类号: B29C59/02 H05K1/02

    摘要: A method of making an embossed micro-structure includes providing a transfer substrate, an emboss substrate, and an embossing stamp having one or more stamp structures. Transfer material is coated on the transfer substrate. The transfer material on the transfer substrate is contacted with the stamp structures to adhere transfer material to the stamp structures. A curable emboss layer is coated on the emboss substrate. The stamp structures and adhered transfer material are contacted to the curable emboss layer on the emboss substrate to emboss a micro-structure in the curable emboss layer and transfer the transfer material to the embossed micro-structure. The curable emboss layer is cured to form a cured emboss layer having embossed micro-structures corresponding to the stamp structures and having transfer material in the embossed micro-structures. The stamp structures is removed from the cured emboss layer, substantially leaving the transfer material in the micro-structure.

    摘要翻译: 制造压花微结构的方法包括提供转印衬底,压花衬底和具有一个或多个印模结构的压花印模。 转印材料涂覆在转印衬底上。 转印基材上的转印材料与印模结构接触以将转印材料粘附到印模结构上。 将可固化的压花层涂覆在压花基材上。 印模结构和粘附的转印材料与压花基材上的可固化压花层接触以压印可固化压花层中的微结构并将转印材料转印到压花微结构。 可固化压花层被固化以形成具有对应于印模结构并且在压花微结构中具有转印材料的压花微结构的固化压印层。 从固化的压花层去除印模结构,基本上留下微结构中的转印材料。

    TOUCH-RESPONSIVE CAPACITOR WITH POLARIZING DIELECTRIC STRUCTURE
    6.
    发明申请
    TOUCH-RESPONSIVE CAPACITOR WITH POLARIZING DIELECTRIC STRUCTURE 有权
    具有极化介质结构的触摸式电容器

    公开(公告)号:US20130278544A1

    公开(公告)日:2013-10-24

    申请号:US13454145

    申请日:2012-04-24

    申请人: RONALD STEVEN COK

    发明人: RONALD STEVEN COK

    CPC分类号: G06F3/044 G02F1/13338

    摘要: A touch-responsive capacitive apparatus includes means for defining first and second surfaces, a first micro-wire layer formed on the first surface, the first micro-wire layer including a plurality of electrically connected first micro-wires, a second micro-wire layer formed on the second surface, the second micro-wire layer including a plurality of electrically connected second micro-wires, and a polarizing dielectric structure located between the first and second micro-wire layers.

    摘要翻译: 触敏电容装置包括用于限定第一和第二表面的装置,形成在第一表面上的第一微线层,第一微线层包括多个电连接的第一微线,第二微线层 形成在所述第二表面上,所述第二微线层包括多个电连接的第二微线,以及位于所述第一和第二微线层之间的偏振电介质结构。

    MAKING IMAGE-BASED PRODUCT FROM DIGITIAL IMAGE COLLECTION
    8.
    发明申请
    MAKING IMAGE-BASED PRODUCT FROM DIGITIAL IMAGE COLLECTION 有权
    从数字图像采集中制作基于图像的产品

    公开(公告)号:US20130101231A1

    公开(公告)日:2013-04-25

    申请号:US13278287

    申请日:2011-10-21

    申请人: RONALD STEVEN COK

    发明人: RONALD STEVEN COK

    IPC分类号: G06K9/62

    CPC分类号: G06F17/30256 G06F17/3028

    摘要: A method of making an image-based product includes storing a plurality of digital images; providing one or more image distributions, each image distribution corresponding to a theme and including a distribution of image types related to the theme; selecting a theme having a corresponding image distribution, the image distribution having a distribution of image types; using a computer to select digital images from the plurality of digital images, the selected digital images having the image distribution corresponding to the selected theme; and assembling the selected digital images into an image-based product.

    摘要翻译: 制作基于图像的产品的方法包括存储多个数字图像; 提供一个或多个图像分布,每个图像分布对应于主题并且包括与所述主题相关的图像类型的分布; 选择具有相应图像分布的主题,所述图像分布具有图像类型的分布; 使用计算机从多个数字图像中选择数字图像,所选择的数字图像具有对应于所选主题的图像分布; 以及将所选择的数字图像组装成基于图像的产品。

    MICRO-WIRE ELECTRODE STRUCTURE WITH SINGLE-LAYER DUMMY MICRO-WIRES
    9.
    发明申请
    MICRO-WIRE ELECTRODE STRUCTURE WITH SINGLE-LAYER DUMMY MICRO-WIRES 审中-公开
    单层微型电线微电极结构

    公开(公告)号:US20150242010A1

    公开(公告)日:2015-08-27

    申请号:US14191482

    申请日:2014-02-27

    申请人: RONALD STEVEN COK

    发明人: RONALD STEVEN COK

    IPC分类号: G06F3/044 H05K1/02

    摘要: A micro-wire electrode structure includes a substrate having a surface. A plurality of first micro-wire electrodes spatially separated by first electrode gaps is located in a first layer in relation to the surface, each first micro-wire electrode including a plurality of electrically connected first micro-wires. A plurality of electrically isolated second micro-wire electrodes is located in a second layer in relation to the surface, the second layer at least partially different from the first layer. Each second micro-wire electrode includes a plurality of electrically connected second micro-wires. A plurality of first gap micro-wires is located in each first electrode gap, at least some of the first gap micro-wires located in a gap layer different from the first layer. The first gap micro-wires are electrically isolated from the first micro-wires.

    摘要翻译: 微线电极结构包括具有表面的基板。 通过第一电极间隙空间分隔的多个第一微线电极位于相对于表面的第一层中,每个第一微线电极包括多个电连接的第一微线。 多个电隔离的第二微线电极相对于表面位于第二层中,第二层至少部分地不同于第一层。 每个第二微线电极包括多个电连接的第二微线。 多个第一间隙微细线位于每个第一电极间隙中,至少一些第一间隙微细线位于不同于第一层的间隙层中。 第一间隙微线与第一微线电隔离。

    MULTI-LAYER MICRO-WIRE SUBSTRATE STRUCTURE
    10.
    发明申请
    MULTI-LAYER MICRO-WIRE SUBSTRATE STRUCTURE 有权
    多层微电极基板结构

    公开(公告)号:US20150068789A1

    公开(公告)日:2015-03-12

    申请号:US14023740

    申请日:2013-09-11

    申请人: RONALD STEVEN COK

    发明人: RONALD STEVEN COK

    IPC分类号: H05K1/11

    摘要: A multi-layer micro-wire structure includes a substrate having a substrate edge. A first layer is formed over the substrate extending to a first layer edge. One or more first micro-channels are imprinted in the first layer, at least one imprinted first micro-channel having a micro-wire forming at least a portion of an exposed first connection pad in the first layer. A second layer is formed over the first layer extending to a second layer edge. One or more second micro-channels are imprinted in the second layer, at least one imprinted second micro-channel having a micro-wire forming at least a portion of an exposed second connection pad in the second layer. The second-layer edge is farther from the substrate edge than the first-layer edge for at least a portion of the second-layer edge so that the first connection pads are exposed through the second layer.

    摘要翻译: 多层微线结构包括具有基板边缘的基板。 第一层形成在延伸到第一层边缘的衬底上。 一个或多个第一微通道被印在第一层中,至少一个压印的第一微通道具有在第一层中形成暴露的第一连接焊盘的至少一部分的微线。 在延伸到第二层边缘的第一层上形成第二层。 一个或多个第二微通道被印在第二层中,至少一个压印的第二微通道具有在第二层中形成暴露的第二连接焊盘的至少一部分的微线。 对于第二层边缘的至少一部分,第二层边缘比第一层边缘离基板边缘更远,使得第一连接焊盘通过第二层曝光。