公开(公告)号：US07855397B2

公开(公告)日：2010-12-21

申请号：US12016720

申请日：2008-01-18

申请人： Randall G. Alley ,  Philip A. Deane ,  David A. Koester ,  Thomas Peter Schneider ,  Jesko von Windheim

发明人： Randall G. Alley ,  Philip A. Deane ,  David A. Koester ,  Thomas Peter Schneider ,  Jesko von Windheim

IPC分类号： H01L33/00 ,  H01L23/34 ,  H01L35/02 ,  H01L21/00

CPC分类号： H01L23/38 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L27/16 ,  H01L2224/0401 ,  H01L2224/05111 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/06102 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/0105

摘要： An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.

摘要翻译： 电子组件可以包括封装衬底，集成电路（IC）半导体芯片，多个金属互连结构和热电热泵。 集成电路（IC）半导体芯片可以具有包括其上的输入/输出焊盘和与有源侧相反的背面的有源侧，并且IC半导体芯片可以布置成有效侧面向封装基板的第一表面。 多个金属互连结构可以在IC半导体芯片的有源侧和封装基板的第一表面之间，并且多个金属互连结构可以在IC半导体芯片的有源侧和第一表面之间提供机械连接 的包装基板。 热电热泵可以耦合到封装衬底，热电热泵构造成主动地泵送IC半导体芯片和封装衬底之间的热量。 还讨论了相关的方法和结构。

公开(公告)号：US20090072385A1

公开(公告)日：2009-03-19

申请号：US12016720

申请日：2008-01-18

申请人： Randall G. Alley ,  Philip A. Deane ,  David A. Koester ,  Thomas Peter Schneider ,  Jesko Von Windheim

发明人： Randall G. Alley ,  Philip A. Deane ,  David A. Koester ,  Thomas Peter Schneider ,  Jesko Von Windheim

IPC分类号： H01L23/38 ,  H01L21/58

CPC分类号： H01L23/38 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L27/16 ,  H01L2224/0401 ,  H01L2224/05111 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/06102 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/0105

摘要： An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.

摘要翻译： 电子组件可以包括封装衬底，集成电路（IC）半导体芯片，多个金属互连结构和热电热泵。 集成电路（IC）半导体芯片可以具有包括其上的输入/输出焊盘和与有源侧相反的背面的有源侧，并且IC半导体芯片可以布置成有效侧面向封装基板的第一表面。 多个金属互连结构可以在IC半导体芯片的有源侧和封装基板的第一表面之间，并且多个金属互连结构可以在IC半导体芯片的有源侧和第一表面之间提供机械连接 的包装基板。 热电热泵可以耦合到封装衬底，热电热泵构造成主动地泵送IC半导体芯片和封装衬底之间的热量。 还讨论了相关的方法和结构。

公开(公告)号：US20090000652A1

公开(公告)日：2009-01-01

申请号：US12146012

申请日：2008-06-25

申请人： Jesko von Windheim ,  Randall G. Alley

发明人： Jesko von Windheim ,  Randall G. Alley

IPC分类号： H01L35/02

CPC分类号： H01L35/30 ,  H01L23/38 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/32145 ,  H01L2924/01019 ,  H01L2924/01079

摘要： A thermoelectric structure may include first and second thermally conductive layers. The first and second thermally conductive layers may be laterally spaced apart in a direction parallel with respect to surfaces of the first and second thermally conductive layers so that a gap is defined between edges of the first and second thermally conductive layers. A thermoelectric element may bridge the gap between the first and second thermally conductive layers, and the thermoelectric element may include a thermoelectric material on respective surface portions of the first and second thermally conductive layers.

摘要翻译： 热电结构可以包括第一和第二导热层。 第一和第二导热层可以在相对于第一和第二导热层的表面平行的方向上横向间隔开，使得在第一和第二导热层的边缘之间限定间隙。 热电元件可以桥接第一和第二导热层之间的间隙，并且热电元件可以在第一和第二导热层的相应表面部分上包括热电材料。

公开(公告)号：US08063298B2

公开(公告)日：2011-11-22

申请号：US11563443

申请日：2006-11-27

申请人： David A. Koester ,  Randall G. Alley

发明人： David A. Koester ,  Randall G. Alley

IPC分类号： H01L35/02 ,  H01L35/34

CPC分类号： H01L35/34

摘要： A method of forming a thermoelectric device may include providing a substrate having a surface, and thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate. Moreover, the thermoelectric p-n couple may include a p-type thermoelectric element and an n-type thermoelectric element. In addition, a thermally conductive field layer may be formed on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate. Related structures are also discussed.

摘要翻译： 形成热电装置的方法可以包括提供具有表面的基板，并将热电p-n耦合热耦合到基板的表面的第一部分。 此外，热电p-n耦合可以包括p型热电元件和n型热电元件。 此外，导热场层可以形成在衬底表面的与衬底表面的第一部分相邻的第二部分上。 还讨论了相关结构。

公开(公告)号：US07838759B2

公开(公告)日：2010-11-23

申请号：US11472913

申请日：2006-06-22

申请人： Randall G. Alley ,  David A. Koester

发明人： Randall G. Alley ,  David A. Koester

IPC分类号： H01L35/10 ,  H01L35/34

CPC分类号： H01L35/10 ,  H01L35/08 ,  H01L35/32 ,  H01L35/34 ,  Y10T29/4913

摘要： A method of forming a thermoelectric device may include forming a pattern of conductive traces, and forming an electrically insulating matrix between the conductive traces of the pattern of conductive traces. In addition, a plurality of thermoelectric elements may be electrically and mechanically coupled to the pattern of conductive traces so that each conductive trace of the pattern of conductive traces has one of the plurality of thermoelectric elements thereon. In addition, the plurality of thermoelectric elements may be free of the electrically insulating matrix. Related methods and structures are also discussed.

摘要翻译： 形成热电装置的方法可以包括形成导电迹线图案，以及在导电迹线图案的导电迹线之间形成电绝缘矩阵。 此外，多个热电元件可以电连接和机械耦合到导电迹线图案，使得导电迹线图案的每个导电迹线都具有多个热电元件之一。 另外，多个热电元件可以没有电绝缘基体。 还讨论了相关的方法和结构。

公开(公告)号：US07679203B2

公开(公告)日：2010-03-16

申请号：US11681303

申请日：2007-03-02

申请人： Jayesh Bharathan ,  David A. Koester ,  Randall G. Alley ,  Rama Venkatasubramanian ,  Pratima Addepalli ,  Bing Shen ,  Cynthia Watkins

发明人： Jayesh Bharathan ,  David A. Koester ,  Randall G. Alley ,  Rama Venkatasubramanian ,  Pratima Addepalli ,  Bing Shen ,  Cynthia Watkins

IPC分类号： H01L37/00

CPC分类号： H01L35/34 ,  H01L35/32 ,  Y10S257/93

摘要： A method of forming a thermoelectric device may include forming a plurality of islands of thermoelectric material on a deposition substrate. The plurality of islands of thermoelectric material may be bonded to a header substrate so that the plurality of islands are between the deposition substrate and the header substrate. More particularly, the islands of thermoelectric material may be epitaxial islands of thermoelectric material having crystal structures aligned with a crystal structure of the deposition substrate. Related structures are also discussed.

摘要翻译： 形成热电装置的方法可以包括在沉积基板上形成多个热电材料岛。 多个热电材料岛可以结合到集管基板，使得多个岛在沉积基板和集管基板之间。 更具体地，热电材料岛可以是具有与沉积基板的晶体结构对准的晶体结构的热电材料的外延岛。 还讨论了相关结构。

公开(公告)号：US20100257871A1

公开(公告)日：2010-10-14

申请号：US11641563

申请日：2006-12-18

申请人： Rama Venkatasubramanian ,  Brooks C. O'Quinn ,  Edward P. Siivola ,  Kip D. Coonley ,  Pratima Addepalli ,  Randall G. Alley ,  John Posthill ,  Thomas Colpitts ,  Anil J. Reddy ,  James Christopher Caylor ,  Peter Thomas

发明人： Rama Venkatasubramanian ,  Brooks C. O'Quinn ,  Edward P. Siivola ,  Kip D. Coonley ,  Pratima Addepalli ,  Randall G. Alley ,  John Posthill ,  Thomas Colpitts ,  Anil J. Reddy ,  James Christopher Caylor ,  Peter Thomas

IPC分类号： F25B21/02

CPC分类号： H01L35/00 ,  H01L23/38 ,  H01L35/04 ,  H01L35/30 ,  H01L35/32 ,  H01L35/325 ,  H01L35/34 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A thermoelectric device having at least one thermoelectric unit including at least one thermoelectric pair of n-type and p-type thermoelements, a first header coupled to one side of the thermoelectric pair, and a second header coupled to a second side of the thermoelectric pair. The thermoelectric pair has a thermal conduction channel area smaller than an area of the first header or the second header such that the thermal conduction area is a fraction of the area of the first header or the second header.

摘要翻译： 一种热电装置，其具有至少一个热电单元，所述热电单元包括至少一个n型和p型热电偶的热电对，连接到所述热电对的一侧的第一集管和耦合到所述热电对的第二侧的第二集管 。 热电对具有小于第一集管或第二集管的面积的导热通道面积，使得热传导面积是第一集管或第二集管的面积的一部分。

公开(公告)号：US07997087B2

公开(公告)日：2011-08-16

申请号：US12403866

申请日：2009-03-13

申请人： Rama Venkatasubramanian ,  Randall G. Alley ,  Pratima Addepalli ,  Anil J. Reddy ,  Edward P. Siivola ,  Brooks C. O'Quinn ,  Kip D. Coonley ,  John Posthill ,  Thomas Colpitts

发明人： Rama Venkatasubramanian ,  Randall G. Alley ,  Pratima Addepalli ,  Anil J. Reddy ,  Edward P. Siivola ,  Brooks C. O'Quinn ,  Kip D. Coonley ,  John Posthill ,  Thomas Colpitts

IPC分类号： F25B21/02 ,  F25D23/00 ,  F28D15/00 ,  H05K7/20

CPC分类号： F25B21/02 ,  F25B2321/003 ,  H01L35/30 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.

摘要翻译： 一种用于控制固体介质中的发热装置的温度的结构，系统和方法，其中热量从所述介质提取到至少一个热提取装置中，所述热提取装置将热量散发到除了介质之外的环境中 与散热装置热耦合的散热器; 并且来自介质的热量通过将散热器热耦合到介质的第一热界面材料散发到散热器中。

公开(公告)号：US20090282852A1

公开(公告)日：2009-11-19

申请号：US12403866

申请日：2009-03-13

申请人： Rama Venkatasubramanian ,  Randall G. Alley ,  Pratima Addepalli ,  Anil J-Reddy ,  Edward P. Siivola ,  Brooks C. O'Quinn ,  Kip D. Coonley ,  John Posthill ,  Thomas Colpitts

发明人： Rama Venkatasubramanian ,  Randall G. Alley ,  Pratima Addepalli ,  Anil J-Reddy ,  Edward P. Siivola ,  Brooks C. O'Quinn ,  Kip D. Coonley ,  John Posthill ,  Thomas Colpitts

IPC分类号： F25B21/02

CPC分类号： F25B21/02 ,  F25B2321/003 ,  H01L35/30 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.

摘要翻译： 一种用于控制固体介质中的发热装置的温度的结构，系统和方法，其中热量从所述介质提取到至少一个热提取装置中，所述热提取装置将热量散发到除了介质之外的环境中 与散热装置热耦合的散热器; 并且来自介质的热量通过将散热器热耦合到介质的第一热界面材料散发到散热器中。

公开(公告)号：US07838760B2

公开(公告)日：2010-11-23

申请号：US10536463

申请日：2003-11-25

申请人： Rama Venkatasubramanian ,  Kip D. Coonley ,  Edward P. Siivola ,  Michael Puchan ,  Randall G. Alley ,  Pratima Addepalli ,  Brooks C. O'Quinn ,  Thomas Colpitts ,  Mary Napier

发明人： Rama Venkatasubramanian ,  Kip D. Coonley ,  Edward P. Siivola ,  Michael Puchan ,  Randall G. Alley ,  Pratima Addepalli ,  Brooks C. O'Quinn ,  Thomas Colpitts ,  Mary Napier

IPC分类号： H01L35/30 ,  F25B21/02

CPC分类号： B82Y10/00 ,  H01L35/16 ,  H01L35/30 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermoelectric device having at least one unipolar couple element (22) including two legs (22a) of a same electrical conductivity type. A first-temperature stage (24) is connected to one of the two legs. A second-temperature stage (28) is connected across the legs of the at least one unipolar couple element. A third-temperature stage (30) is connected to the other of the two legs. Methods for cooling an object and for thermoelectric power conversion utilize the at least one unipolar couple element to respectively cool an object and produce electrical power.

摘要翻译： 一种具有至少一个单极耦合元件（22）的热电器件，其包括具有相同导电类型的两个支脚（22a）。 第一温度级（24）连接到两条腿之一。 第二温度级（28）跨越至少一个单极耦合元件的腿连接。 第三温度台（30）连接到两条腿中的另一条。 用于冷却物体和用于热电功率转换的方法利用至少一个单极耦合元件来分别冷却物体并产生电力。