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公开(公告)号：US20150085458A1
公开(公告)日：2015-03-26
申请号：US14037826
申请日：2013-09-26
申请人： Raul Enriquez Shibayama , Mauro Lai , Richard K. Kunze , Nicholas B. Peterson , Carlos A. Lizalde Moreno , Kai Xiao
发明人： Raul Enriquez Shibayama , Mauro Lai , Richard K. Kunze , Nicholas B. Peterson , Carlos A. Lizalde Moreno , Kai Xiao
CPC分类号： H05K1/0231 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K1/0228 , H05K1/115 , H05K1/116 , H05K1/162 , H05K3/303 , H05K2201/09636 , Y10T29/4913 , H01L2924/00
摘要： Inductive coupling arising between adjacent vias in interconnect technologies (commonly associated with printed circuit boards or package) can be combatted through the addition of metal plates to vias. The plates generate capacitive coupling that can compensate for the inductive crosstalk normally generated between vias in printed circuit boards or packages. When the added plates of two neighboring vias overlap with each other, a capacitive coupling is generated. By balancing the inductive coupling with capacitive coupling, an effective reduction of far end crosstalk may be obtained.
摘要翻译： 通过在通孔中添加金属板，互连技术中相邻通孔之间产生的感应耦合（通常与印刷电路板或封装相关联）可以对抗。 板产生电容耦合，可以补偿印刷电路板或封装中通孔之间通常产生的电感串扰。 当两个相邻通孔的添加板彼此重叠时，产生电容耦合。 通过将电感耦合与电容耦合进行平衡，可以获得远端串扰的有效减少。
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公开(公告)号：US20140266490A1
公开(公告)日：2014-09-18
申请号：US13844761
申请日：2013-03-15
申请人： Kai Xiao , Jimmy Hsu , Yuan-Liang Li , Richard K. Kunze
发明人： Kai Xiao , Jimmy Hsu , Yuan-Liang Li , Richard K. Kunze
CPC分类号： H05K1/0228 , H01P3/08 , H01P11/00 , H05K1/0245 , H05K1/0298 , H05K2201/09236 , H05K2201/09709 , Y10T29/49155
摘要： A signal line design is described herein. A circuit board may include a first signal line and a second signal line. The first signal line includes a pair of signal lines at a first depth of a section of a circuit board, wherein a centerline extends lengthwise between the pair of signal lines. The second signal line is disposed at a second depth of the circuit board. The second signal line includes a first segment that runs parallel to the first signal line at a first displacement from the center line. The second signal line includes a second segment that runs parallel to the first signal line on the other side of the center line at a second displacement distance from the center line.
摘要翻译： 这里描述了信号线设计。 电路板可以包括第一信号线和第二信号线。 第一信号线包括在电路板的一部分的第一深度处的一对信号线，其中中心线在该对信号线之间纵向延伸。 第二信号线设置在电路板的第二深度处。 第二信号线包括第一段，该第一段在与中心线的第一位移处平行于第一信号线延伸。 第二信号线包括与中心线的另一侧平行于第一信号线的第二段，距中心线的第二位移距离。
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公开(公告)号：US20140266516A1
公开(公告)日：2014-09-18
申请号：US13834863
申请日：2013-03-15
申请人： Kai Xiao , Richard K. Kunze
发明人： Kai Xiao , Richard K. Kunze
CPC分类号： H05K1/16 , H01P3/08 , H01P11/00 , H04B3/14 , H04L25/03878 , H05K1/0225 , H05K1/0234 , H05K1/0239 , H05K1/0245 , H05K1/0246 , H05K1/025 , H05K1/165 , H05K3/10 , H05K2201/09309 , H05K2201/0969 , H05K2201/10015 , H05K2201/10022 , Y10T29/49155
摘要： Disclosed in the present specification is a circuit board. The circuit board includes a first reference plane and a second reference plane, wherein the second reference plane includes a defected ground structure. The circuit board also includes a signal trace coupled to a signal via, wherein the signal trace is disposed above the first reference plane. The circuit board additionally includes a spiral inductor positioned adjacent to the defected ground structure, wherein the spiral inductor is coupled to the signal via.
摘要翻译： 在本说明书中公开的是电路板。 电路板包括第一参考平面和第二参考平面，其中第二参考平面包括缺陷的接地结构。 电路板还包括耦合到信号通孔的信号迹线，其中信号迹线设置在第一参考平面上方。 电路板另外包括邻近缺陷接地结构定位的螺旋电感器，其中螺旋电感器耦合到信号通孔。
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4.发明授权Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate 有权在具有由柔性绝缘材料和金属背板覆盖的微带线的电子设备中减少串扰公开(公告)号：US07573359B2
公开(公告)日：2009-08-11
申请号：US11729731
申请日：2007-03-29
IPC分类号： H01P5/02
CPC分类号： H05K1/0218 , H05K1/0203 , H05K1/0237 , H05K1/0271 , H05K3/0061 , H05K2201/09063 , H05K2201/10734 , H05K2201/2009
摘要： An electronic device may be formed of a printed circuit board having integrated circuits mounted thereon. A backing plate may compress an insulating layer against a microstrip line formed on one surface of said circuit board opposite to the surface that includes integrated circuits. By compressing said backing plate against said insulating layer, less crosstalk may result from the formation of a microstrip on the bottom surface of the printed circuit board. The backing plate may also be used to secure a cooling device, such as a heat sink, on the opposite side of the circuit board.
摘要翻译： 电子设备可以由其上安装有集成电路的印刷电路板形成。 背板可以将绝缘层压在形成在与包括集成电路的表面相对的所述电路板的一个表面上的微带线上。 通过将所述背板压靠所述绝缘层，在印刷电路板的底表面上形成微带带可能导致较少的串扰。 背板也可以用于将诸如散热器的冷却装置固定在电路板的相对侧上。
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公开(公告)号：US20140177150A1
公开(公告)日：2014-06-26
申请号：US13725703
申请日：2012-12-21
申请人： Olufemi B. Oluwafemi , Richard K. Kunze , Henry I. Peng , Karen Navarro Castillo , Adefisayo O. Adepetun , Brandon Gore , Oluwafemi Akinwale
发明人： Olufemi B. Oluwafemi , Richard K. Kunze , Henry I. Peng , Karen Navarro Castillo , Adefisayo O. Adepetun , Brandon Gore , Oluwafemi Akinwale
CPC分类号： H05K1/0228 , H05K1/024 , H05K1/0243 , H05K1/0251 , Y10T29/4913
摘要： The present disclosure provides techniques for decreasing vertical crosstalk in a stripline. An apparatus may include a conductor bracketed by ground layers. The conductor may have a horizontal crosstalk. A vertical component may be coupled to the conductor. The vertical component may have a vertical crosstalk cancelled by the horizontal crosstalk.
摘要翻译： 本公开提供了用于减少带状线中的垂直串扰的技术。 设备可以包括由接地层包围的导体。 导体可能具有水平串扰。 垂直分量可以耦合到导体。 垂直分量可能具有由水平串扰消除的垂直串扰。
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公开(公告)号：US09240621B2
公开(公告)日：2016-01-19
申请号：US12490863
申请日：2009-06-24
申请人： John J. Abbott , Richard K. Kunze
发明人： John J. Abbott , Richard K. Kunze
摘要： A micro-strip transmission line may include a plurality of conductors, wherein each conductor has a compensating portion and a remaining portion. The compensating portion can compensate for far-end crosstalk in the remaining portion. In one example, the compensating portion has a longitudinal section and a plurality of alternating stubs extending from lateral surfaces of the longitudinal section.
摘要翻译： 微带传输线可以包括多个导体，其中每个导体具有补偿部分和剩余部分。 补偿部分可以补偿剩余部分中的远端串扰。 在一个示例中，补偿部分具有从纵向部分的侧表面延伸的纵向部分和多个交替的短截线。
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公开(公告)号：US20080238584A1
公开(公告)日：2008-10-02
申请号：US11729731
申请日：2007-03-29
CPC分类号： H05K1/0218 , H05K1/0203 , H05K1/0237 , H05K1/0271 , H05K3/0061 , H05K2201/09063 , H05K2201/10734 , H05K2201/2009
摘要： An electronic device may be formed of a printed circuit board having integrated circuits mounted thereon. A backing plate may compress an insulating layer against a microstrip line formed on one surface of said circuit board opposite to the surface that includes integrated circuits. By compressing said backing plate against said insulating layer, less crosstalk may result from the formation of a microstrip on the bottom surface of the printed circuit board. The backing plate may also be used to secure a cooling device, such as a heat sink, on the opposite side of the circuit board.
摘要翻译： 电子设备可以由其上安装有集成电路的印刷电路板形成。 背板可以将绝缘层压在形成在与包括集成电路的表面相对的所述电路板的一个表面上的微带线上。 通过将所述背板压靠所述绝缘层，在印刷电路板的底表面上形成微带带可能导致较少的串扰。 背板也可以用于将诸如散热器的冷却装置固定在电路板的相对侧上。
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公开(公告)号：US06416330B1
公开(公告)日：2002-07-09
申请号：US09617151
申请日：2000-07-17
IPC分类号： H01R909
CPC分类号： H01R12/7088 , H01R13/2421
摘要： A canted coiled spring is used as a highly conductive, high current electrode between a printed circuit board and a conductive strip connected to a selected voltage. A conductive channel member has fixed therein a coil spring made of a highly conductive, metallic material. The canted coiled spring is fixed at each end so that it may be easily slid along an adjacent electrode of the power strip. The channel member holding the canted coiled spring is coupled to a printed circuit board with a clamped, highly conductive contact surface. The use of the coil spring in a channel member connected to a printed circuit board permits the printed circuit board to be easily slid into, and out of electrical contact with power carrying electrodes.
摘要翻译： 倾斜螺旋弹簧用作印刷电路板和连接到选定电压的导电条之间的高导电高电流电极。 导电通道构件固定有由高导电性金属材料制成的螺旋弹簧。 倾斜的螺旋弹簧在每一端固定，使得它可以容易地沿着电源板的相邻电极滑动。 保持倾斜螺旋弹簧的通道构件与夹持的高度导电的接触表面联接到印刷电路板。 在连接到印刷电路板的通道构件中使用螺旋弹簧允许印刷电路板容易地滑入到与承载电极的电接触中。
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公开(公告)号：US20100327989A1
公开(公告)日：2010-12-30
申请号：US12490863
申请日：2009-06-24
申请人： John J. Abbott , Richard K. Kunze
发明人： John J. Abbott , Richard K. Kunze
摘要： A micro-strip transmission line may include a plurality of conductors, wherein each conductor has a compensating portion and a remaining portion. The compensating portion can compensate for far-end crosstalk in the remaining portion. In one example, the compensating portion has a longitudinal section and a plurality of alternating stubs extending from lateral surfaces of the longitudinal section.
摘要翻译： 微带传输线可以包括多个导体，其中每个导体具有补偿部分和剩余部分。 补偿部分可以补偿剩余部分中的远端串扰。 在一个示例中，补偿部分具有从纵向部分的侧表面延伸的纵向部分和多个交替的短截线。
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