公开(公告)号：US10454005B1

公开(公告)日：2019-10-22

申请号：US16109208

申请日：2018-08-22

Applicant: RayVio Corporation

Inventor： Faisal Sudradjat ,  Saijin Liu ,  Douglas A. Collins

IPC: H01L33/54 ,  H01L33/52 ,  H01L33/48 ,  H01L33/56 ,  H01L33/60

Abstract: Embodiments of the invention include a light emitting diode (UVLED), the UVLED including a semiconductor structure with an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The UVLED is disposed on a mount. A transparent encapsulant is disposed over the UVLED. The transparent encapsulant has an angled sidewall.

公开(公告)号：US20190262493A1

公开(公告)日：2019-08-29

申请号：US16289342

申请日：2019-02-28

Applicant: RayVio Corporation

Inventor： Douglas A. Collins ,  Li Zhang ,  Saijin Liu ,  Yitao Liao

IPC: A61L9/20 ,  H01L33/40 ,  H01L33/58 ,  H01L25/16 ,  C02F1/32 ,  H01L33/48 ,  H01L33/32 ,  H01L33/06 ,  H01L27/15

Abstract: Embodiments of the invention include a vessel having an opening and a detachable cover for covering the opening. The cover includes a semiconductor device with an active layer disposed between an n-type region and a p-type region. The active layer emits radiation having a peak wavelength in a UV range. The cover also includes a sensor for detecting whether the cover is covering the opening.

公开(公告)号：US20180346348A1

公开(公告)日：2018-12-06

申请号：US15613077

申请日：2017-06-02

Applicant: RayVio Corporation

Inventor： Douglas A. Collins ,  Saijin Liu ,  Li Zhang

IPC: C02F1/32 ,  C02F1/00 ,  C02F1/36 ,  B01D29/56 ,  H01L27/15 ,  H01L33/48 ,  H01L33/62 ,  H01L33/58 ,  H01L33/64 ,  H01L33/60 ,  H01L33/06 ,  H01L33/32

Abstract: Embodiments of the invention include a disinfection chamber and a ultraviolet (UV) source. The UV source includes a semiconductor device and a sealed compartment. The semiconductor device includes an active layer disposed between an n-type region and a p-type region. The active layer emits radiation having a peak wavelength in a UV range. The sealed compartment includes a support, on which the semiconductor device is disposed, a cap surrounding the semiconductor device, and a transparent window attached to the cap. The transparent window forms a wall of the disinfection chamber.

公开(公告)号：US10062817B1

公开(公告)日：2018-08-28

申请号：US15402621

申请日：2017-01-10

Applicant: RayVio Corporation

Inventor： Faisal Sudradjat ,  Saijin Liu ,  Douglas A. Collins

IPC: H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/48 ,  H01L33/52

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60

Abstract: Embodiments of the invention include a light emitting diode (UVLED), the UVLED including a semiconductor structure with an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The UVLED is disposed on a mount. A transparent encapsulant is disposed over the UVLED. The transparent encapsulant has an angled sidewall.

公开(公告)号：US20170256680A1

公开(公告)日：2017-09-07

申请号：US15063260

申请日：2016-03-07

Applicant: RayVio Corporation

Inventor： Saijin Liu ,  Li Zhang ,  Douglas A. Collins

IPC: H01L33/32 ,  H01L33/64 ,  H01L33/58 ,  H01L33/06

CPC classification number: H01L33/32 ,  H01L33/06 ,  H01L33/486 ,  H01L33/58 ,  H01L33/641 ,  H01L33/648

Abstract: Embodiments of the invention include a light emitting diode (LED) including a semiconductor structure. The semiconductor structure includes an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The LED is disposed on the mount. The mount is disposed on a conductive slug. A support surrounds the conductive slug. The support includes electrically conductive contact pads disposed on a bottom surface, and a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED.

公开(公告)号：US10381523B2

公开(公告)日：2019-08-13

申请号：US14984862

申请日：2015-12-30

Applicant: RayVio Corporation

Inventor： Saijin Liu ,  Douglas A. Collins

IPC: H01L33/48 ,  H05K1/11 ,  H05K1/02 ,  H01L33/62 ,  H01L33/60 ,  H01L33/64

Abstract: Embodiments of the invention include a light emitting diode (LED) including a semiconductor structure. The semiconductor structure includes an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The LED is disposed on the mount. The mount is disposed on a conductive slug. A support surrounds the conductive slug. The support includes electrically conductive contact pads disposed on a bottom surface, and a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED.

公开(公告)号：US20170194533A1

公开(公告)日：2017-07-06

申请号：US14984862

申请日：2015-12-30

Applicant: RayVio Corporation

Inventor： Saijin Liu ,  Douglas A. Collins

IPC: H01L33/48 ,  H05K1/11 ,  H05K1/02 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/486 ,  H01L33/642 ,  H01L2224/73265 ,  H05K1/021 ,  H05K2201/066 ,  H05K2201/10106

Abstract: Embodiments of the invention include a light emitting diode (LED) including a semiconductor structure. The semiconductor structure includes an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The LED is disposed on the mount. The mount is disposed on a conductive slug. A support surrounds the conductive slug. The support includes electrically conductive contact pads disposed on a bottom surface, and a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED.

公开(公告)号：US10403792B2

公开(公告)日：2019-09-03

申请号：US15063260

申请日：2016-03-07

Applicant: RayVio Corporation

Inventor： Saijin Liu ,  Li Zhang ,  Douglas A. Collins

IPC: H01L33/32 ,  H01L33/06 ,  H01L33/64 ,  H01L33/48 ,  H01L33/58

Abstract: Embodiments of the invention include a light emitting diode (LED) including a semiconductor structure. The semiconductor structure includes an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The LED is disposed on the mount. The mount is disposed on a conductive slug. A support surrounds the conductive slug. The support includes electrically conductive contact pads disposed on a bottom surface, and a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED.

公开(公告)号：US10258715B1

公开(公告)日：2019-04-16

申请号：US15905593

申请日：2018-02-26

Applicant: RayVio Corporation

Inventor： Douglas A. Collins ,  Li Zhang ,  Saijin Liu ,  Yitao Liao

IPC: A61L9/00 ,  A61L9/20 ,  H01L33/48 ,  H01L33/32 ,  H01L33/06 ,  H01L27/15 ,  H01L33/40 ,  H01L33/58 ,  C02F1/32 ,  H01L25/16 ,  H01L33/20

Abstract: Embodiments of the invention include a vessel having an opening and a detachable cover for covering the opening. The cover includes a semiconductor device with an active layer disposed between an n-type region and a p-type region. The active layer emits radiation having a peak wavelength in a UV range. The cover also includes a sensor for detecting whether the cover is covering the opening.

公开(公告)号：US20180182939A1

公开(公告)日：2018-06-28

申请号：US15389308

申请日：2016-12-22

Applicant: RayVio Corporation

Inventor： Saijin Liu ,  Douglas A. Collins ,  Yitao Liao

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L33/0095 ,  H01L33/52 ,  H01L2933/005 ,  H01L2933/0058

Abstract: Embodiments of the invention include a light emitting diode (UVLED), the UVLED including a semiconductor structure with an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The UVLED is attached to a mount. A lens is disposed over the UVLED. A surface of the lens closest to the UVLED is the same width as the mount.