公开(公告)号：US5263620A

公开(公告)日：1993-11-23

申请号：US843693

申请日：1992-02-28

申请人： Bernardo Hernandez ,  Raymond R. Horton ,  Ismail C. Noyan ,  Michael J. Palmer ,  Mark B. Ritter

发明人： Bernardo Hernandez ,  Raymond R. Horton ,  Ismail C. Noyan ,  Michael J. Palmer ,  Mark B. Ritter

IPC分类号： H01L21/60 ,  B08B3/02 ,  B23K1/018 ,  B26F3/00 ,  H05K13/04

CPC分类号： H05K13/0486 ,  B23K1/018 ,  H01L24/98 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85201 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/20752 ,  Y10T225/10 ,  Y10T225/30 ,  Y10T225/329 ,  Y10T29/49821 ,  Y10T29/53274

摘要： A method and apparatus for removing wires bonded between chip contact pads and substrate contact pads using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.

公开(公告)号：US5186632A

公开(公告)日：1993-02-16

申请号：US762977

申请日：1991-09-20

申请人： Raymond R. Horton ,  Ismail C. Noyan ,  Michael J. Palmer ,  Mark B. Ritter

发明人： Raymond R. Horton ,  Ismail C. Noyan ,  Michael J. Palmer ,  Mark B. Ritter

IPC分类号： H01R24/00 ,  H01R12/62 ,  H01R12/72 ,  H05K3/36 ,  H05K7/02

CPC分类号： H01R12/62 ,  H01R12/721 ,  H05K3/365 ,  H05K7/023

摘要： An interconnecting and mounting technology involving the use of elastomeric properties. A mounting member grips, in a notch, the edge of a device supporting planar member with the device conductors brought to that edge. Conductors are provided at the surface of the mounting member, contacting the device conductors in the notch, and connecting with external wiring conductors on an external wiring planar member. The external wiring to device conductor interconnecting conductors can be on flex tape including elastomeric contact adaptation. Retention force for mounting member compression and mounting member to external wiring planar member retention is provided.

公开(公告)号：US5205461A

公开(公告)日：1993-04-27

申请号：US524408

申请日：1990-05-16

申请人： Harry R. Bickford ,  Raymond R. Horton ,  Ismail C. Noyan ,  Michael J. Palmer ,  John C. Zyzo

发明人： Harry R. Bickford ,  Raymond R. Horton ,  Ismail C. Noyan ,  Michael J. Palmer ,  John C. Zyzo

IPC分类号： B23K1/012 ,  H01L21/00 ,  H05K3/34

CPC分类号： H01L21/67144 ,  B23K1/012 ,  H05K3/3494

摘要： Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.

摘要翻译： 将焊锡焊料无焊焊接到焊料可润湿表面的方法和装置。 加热气体，优选还原性或非反应性气体，被引导到固体焊料堆。 将气体加热到足以熔化焊料堆的温度。 加热的气体以足以将氧化物层分散在熔融焊料堆的表面的动量指向熔融焊料堆。 分散氧化物层允许熔融焊料润湿焊料可润湿表面。 将熔融的焊料冷却以形成焊料接合。

公开(公告)号：US5038195A

公开(公告)日：1991-08-06

申请号：US477705

申请日：1990-02-09

申请人： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

发明人： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

CPC分类号： H05K3/244 ,  H01L21/4846 ,  H01L23/49866 ,  H05K1/09 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0393 ,  Y10T428/1291

摘要： The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

公开(公告)号：US5229328A

公开(公告)日：1993-07-20

申请号：US908429

申请日：1992-06-30

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084 ,  Y10T29/49121

摘要： A method for bonding conductors to semiconductor chip contact pads wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

摘要翻译： 一种用于将导体接合到半导体芯片接触焊盘的方法，其中每个导体安装在电介质带上，并且具有由带支撑到相邻位置的附接部分，距离接合位置具有均匀的距离，并且与平面接触 的磁带下面。 一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。 另一个支撑带在接触位置处具有窗口。 导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

公开(公告)号：US5074969A

公开(公告)日：1991-12-24

申请号：US666007

申请日：1991-03-07

申请人： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

发明人： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

CPC分类号： H05K3/244 ,  H01L21/4846 ,  H01L23/49866 ,  H05K1/09 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0393

摘要： The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

摘要翻译： 本发明包括使用含铜/镍的合金组合物或者对铜载流导线施加保护性镍合金涂层，以防止带状自动键合（TAB）封装引线之间的电解迁移。

公开(公告)号：US5446261A

公开(公告)日：1995-08-29

申请号：US148451

申请日：1993-10-26

申请人： Bernardo Hernandez ,  Raymond R. Horton ,  Michael J. Palmer ,  Ismail C. Noyan ,  Frederick G. Weindelmayer

发明人： Bernardo Hernandez ,  Raymond R. Horton ,  Michael J. Palmer ,  Ismail C. Noyan ,  Frederick G. Weindelmayer

IPC分类号： B23K3/03 ,  H05B3/42

CPC分类号： B23K3/03

摘要： A soldering tip overcomes the gravitational effects on molten solder and supplies a large molten solder sphere for contact with a surface to which solder is to be applied. A conical or cylindrical spiral or helix of solder-wettable material, preferably in the form of a compressional spring is attached to the soldering tip with the central axis of the helix aligned with the axis of the soldering tip, preferably by welding. Solder supplied to the soldering tip flows between the coils of the helix and forms a meniscus at the lower end of the helix so that only the molten solder meniscus touches the surface during application of solder. The increased surface tension acts to overcome gravitational effects and assures a more even flow of solder to the surface.

摘要翻译： 焊接头克服了对熔融焊料的重力影响，并提供了一个大的熔融焊球，用于与要施加焊料的表面接触。 焊料可润湿材料的圆锥形或圆柱形螺旋或螺旋，优选为压缩弹簧形式，优选通过焊接，将螺旋的中心轴线与烙铁头的轴线对准，从而将烙铁头连接到烙铁头。 提供给焊接头的焊料在螺旋线圈之间流动，并在螺旋的下端形成弯液面，使得在施加焊料期间仅熔融的焊料弯月面接触表面。 增加的表面张力起到克服重力作用的作用，并确保焊料更均匀地流向表面。

公开(公告)号：US5322204A

公开(公告)日：1994-06-21

申请号：US79508

申请日：1993-06-21

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/50 ,  H05K3/40 ,  B23K1/20 ,  H01K8/00

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084 ,  Y10T29/49142 ,  Y10T29/49153 ,  Y10T29/53235

摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

摘要翻译： 一种导体附件，其中每个导体安装在介质带上，并且具有由带支撑到邻近位置的附接部分，距离接合位置具有均匀的距离，并且与带的下侧平面接触。 一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。 另一个支撑带在接触位置处具有窗口。 导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

公开(公告)号：US5006925A

公开(公告)日：1991-04-09

申请号：US440180

申请日：1989-11-22

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Ismail C. Noyan ,  Michael J. Palmer

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Ismail C. Noyan ,  Michael J. Palmer

IPC分类号： H05K7/20 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L23/5385 ,  H01L25/0652 ,  H01L2924/0002

摘要： A three dimensional chip package comprising a plurality of semiconductor substrates, each having at least one semiconductor electronic device mounted thereon; wherein at least a subset of said plurality substrates are physically joined to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and further wherein at least one cooling channel is provided within said enclosure into which a cooling fluid may be introduced.

公开(公告)号：US5233221A

公开(公告)日：1993-08-03

申请号：US736090

申请日：1991-07-26

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084

摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

摘要翻译： 一种导体附件，其中每个导体安装在介质带上，并且具有由带支撑到邻近位置的附接部分，距离接合位置具有均匀的距离，并且与带的下侧平面接触。 一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。 另一个支撑带在接触位置处具有窗口。 导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。