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公开(公告)号：US5768770A
公开(公告)日：1998-06-23
申请号：US477074
申请日：1995-06-07
CPC分类号： H01L21/4842 , H05K13/0092 , H05K3/3426 , Y02P70/613 , Y10T29/49121 , Y10T29/49149 , Y10T29/49204 , Y10T29/515
摘要： Process for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
摘要翻译： 用于成形导体在载体上严格间隔的结合到衬底表面上的接触位置的工艺。 导体是悬臂的，每个相邻的导体结合到距离载体不同距离的接触位置。 每个导体保持在载体的支撑体的平面中至其相应的接触位置附近，在其附近，其形状几乎垂直于衬底延伸，然后横向穿过接触位置施加在接触位置上的压力。
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公开(公告)号：US5675884A
公开(公告)日：1997-10-14
申请号：US487465
申请日：1995-06-07
CPC分类号： H01L21/4842 , H05K13/0092 , H05K3/3426 , Y02P70/613 , Y10T29/49121 , Y10T29/49149 , Y10T29/49204 , Y10T29/515
摘要： Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
摘要翻译： 用于成形导体在载体上断裂的导体的装置，其结合到衬底表面上的接触位置。 导体是悬臂的，每个相邻的导体结合到距离载体不同距离的接触位置。 每个导体保持在载体的支撑体的平面中至其相应的接触位置附近，在其附近，其形状几乎垂直于衬底延伸，然后横向穿过接触位置施加在接触位置上的压力。
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公开(公告)号：US5734196A
公开(公告)日：1998-03-31
申请号：US542689
申请日：1995-10-13
CPC分类号： H01L21/4842 , H05K13/0092 , H05K3/3426 , Y02P70/613 , Y10T29/49121 , Y10T29/49149 , Y10T29/49204 , Y10T29/515
摘要： An electronic packaging interface between conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
摘要翻译： 在载体上临界间隔的导体之间的电子封装接口，其结合到衬底表面上的接触位置。 导体是悬臂的，每个相邻的导体结合到距离载体不同距离的接触位置。 每个导体保持在载体的支撑体的平面中至其相应的接触位置附近，在其附近，其形状几乎垂直于衬底延伸，然后横向穿过接触位置施加在接触位置上的压力。
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公开(公告)号：US06326696B1
公开(公告)日：2001-12-04
申请号：US09018698
申请日：1998-02-04
申请人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
发明人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
IPC分类号： H01L2348
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/854 , H01L2224/85439 , H01L2224/85444 , H01L2224/8547 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
摘要翻译： 一种电子封装，其包括具有空腔的电路化基板和位于其中的第一半导体芯片。 第一芯片电耦合到位于电路化基板上的导电构件。 第二半导体芯片位于第一芯片上并电耦合到第一芯片。
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公开(公告)号：US06306686B1
公开(公告)日：2001-10-23
申请号：US09487747
申请日：2000-01-19
申请人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
发明人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
IPC分类号： H01L2150
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/854 , H01L2224/85439 , H01L2224/85444 , H01L2224/8547 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
摘要翻译： 一种电子封装，其包括具有空腔的电路化基板和位于其中的第一半导体芯片。 第一芯片电耦合到位于电路化基板上的导电构件。 第二半导体芯片位于第一芯片上并电耦合到第一芯片。
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公开(公告)号：US06403892B1
公开(公告)日：2002-06-11
申请号：US08669598
申请日：1996-06-24
申请人： Claudius Feger , Teresita Ordonez Graham , Kurt Rudolph Grebe , Alphonso Philip Lanzetta , John Joseph Liutkus , Linda Carolyn Matthew , Michael Jon Palmer , Nelson Russell Tanner , Ho-Ming Tong , Charles Haile Wilson , Helen Li Yeh
发明人： Claudius Feger , Teresita Ordonez Graham , Kurt Rudolph Grebe , Alphonso Philip Lanzetta , John Joseph Liutkus , Linda Carolyn Matthew , Michael Jon Palmer , Nelson Russell Tanner , Ho-Ming Tong , Charles Haile Wilson , Helen Li Yeh
IPC分类号： H05K100
CPC分类号： H01L24/45 , H01L21/481 , H01L23/49572 , H01L23/49894 , H01L24/85 , H01L2224/056 , H01L2224/05644 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/0017 , H05K3/3452 , H05K3/363 , H05K2201/10681 , H05K2201/10977 , H05K2203/176 , Y10T29/49121 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/48 , H01L2924/0002 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.
摘要翻译： 适用于芯片载体应用的柔性或TAB产品，其中在功率和热循环期间由铜枝晶生长和引线弯曲引起的柔性可靠性问题通过将特殊涂层施加到柔性带的引导区域来减少。
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公开(公告)号：US6019530A
公开(公告)日：2000-02-01
申请号：US129508
申请日：1998-08-05
申请人： Alphonso Philip Lanzetta , David Andrew Lewis , Lawrence Shungwei Mok , Stanley Joseph Whitehair
发明人： Alphonso Philip Lanzetta , David Andrew Lewis , Lawrence Shungwei Mok , Stanley Joseph Whitehair
CPC分类号： G06F1/1616 , G06F1/1666 , G06F3/0221 , H01H2223/052 , H01H2223/062
摘要： The invention is directed to a keyboard where the keys are raised up from a retracted position upon the initialization of usage of the keyboard. An embedded airbag mechanism is self-inflatable to raise keys to the normal operating heights. The keys will be retracted when the airbag is deflated. The rising and retracting of the keys can also be controlled by hinge-like structure. The close and open of the cover of a laptop computer will activate the mechanism to raise and retract the keys on the keyboard.
摘要翻译： 本发明涉及一种键盘，其中键盘在键盘的使用初始化时从缩回位置升起。 嵌入式安全气囊机构可自动充气，以将钥匙提升到正常操作高度。 当气囊放气时，钥匙将缩回。 键的上升和缩回也可以通过铰链式结构来控制。 膝上型计算机的盖子的关闭和打开将激活提升和缩回键盘上的键的机构。
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公开(公告)号：US6009247A
公开(公告)日：1999-12-28
申请号：US739248
申请日：1996-10-29
申请人： Frank J. Canora , Michael Frank Cina , Brian Paul Gaucher , Paul Francis Greier , Richard Ian Kaufman , Alphonso Philip Lanzetta , Lawrence Shungwei Mok , Robert Stephen Olyha , Saila Ponnapalli , John LeRoy Staples
发明人： Frank J. Canora , Michael Frank Cina , Brian Paul Gaucher , Paul Francis Greier , Richard Ian Kaufman , Alphonso Philip Lanzetta , Lawrence Shungwei Mok , Robert Stephen Olyha , Saila Ponnapalli , John LeRoy Staples
IPC分类号： G06F13/38
CPC分类号： H04W84/18
摘要： A portable or notebook type computer communication interface that permits portable computers to be reliably used in a data processing network. The interface involves communication circuitry, special device inputs and power monitoring and charging. A flexible portable computer wireless time and frequency division network is formed using a time and frequency division multiplexed communication channel assignment feature that together with a wireless link establishes a unique direct communication channel between data processing devices on different levels with data packet type transmission security. The principle permits each portable computer in the network to communicate with any other and any and all can transmit and receive at the same time.
摘要翻译： 便携式或笔记本型计算机通信接口，其允许便携式计算机在数据处理网络中可靠地使用。 该接口包括通信电路，专用设备输入和电源监控和充电。 利用时分多路复用通信信道分配特征形成灵活的便携式计算机无线时分频网络，其与无线链路一起在不同级别的数据处理设备之间建立与数据分组类型传输安全性的独特的直接通信信道。 该原理允许网络中的每个便携式计算机与任何其他计算机进行通信，任何和所有可以同时发送和接收。
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