摘要:
A molding die 1 is constituted by an upper die 1a and a lower die 1b which are made of a material transparent to an ultraviolet light, and has a cavity 3 constituted by grooves 2c, 2d, whereas a resin injection gate 4 and a resin exit gate 7 are provided so as to communicate with the cavity 3. A junction of an optical fiber 10 is inserted into the cavity 3. A UV-curable resin is injected into the cavity 3 surrounding an exposing portion of the glass optical fiber 11 from the resin injection gate 4 positioned at one of coating ends of the optical fiber 10, whereas a part thereof is discharged from the resin exit gate 7 positioned at the other coating end. The ultraviolet light is emitted through the lower die 1b so as to cure the resin, thereby forming a reinforcement resin coating. As a consequence, bubbles can be prevented from occurring due to the residual air within the reinforcement resin coating in the junction of the optical fiber 10.
摘要:
A vehicle headlamp is provided with: a projection lens disposed on an optical axis extending in a front and rear direction of a vehicle; a light source disposed rearwardly of a rear-side focal point of the projection lens; a reflector configured to reflect direct light from the light source forward to converge reflected light toward the optical axis; a movable shade disposed between the projection lens and the light source and configured to blocking a part of the reflected light from the reflector and a part of the direct light from the light source to form a cutoff line in a light distribution pattern; and a bracket formed from a metal plate member and disposed between the projection lens and the light source, wherein the movable shade is rotatably supported on the bracket. An opening portion is formed in the bracket and configured to pass a part of the reflected light from the reflector along the optical axis. A shade portion is provided on the opening portion and configured to cover a gap between the movable shade and an opening edge of the opening portion.
摘要:
A semiconductor device substrate and a method of manufacturing the same by removing variations in resin thickness due to resin flows, warps in the substrate, cracking in the substrate, and foams contained in the resin.
摘要:
A premix, an origomeric prepolymer obtainable from a limited addition polymerization effected with the premix and a thermosetting resin obtainable from such premix or prepolymer as well as fiber reinforced plastics made of such thermosetting resin which are excellent in the heat resistance, impact resistance and flexibility and exhibit a high toughness, wherein said premix comprises, as a first essential component, an amine-terminated amic acid expressed by the formula, ##STR1## in which R.sup.1 stands for a tetravalent aromatic residue having 6 to 20 carbon atoms and R.sup.2 denotes a divalent organic residue having 2 to 20 carbon atoms, said amic acid being produced by reacting a tetracarboxylic dianhydride with a diamine compound, and, as a second essential component, an N,N'-bis maleimide of the formula, ##STR2## wherein R.sup.3 denotes a divalent organic residue having 2 to 20 carbon atoms, the mole ratio of [N,N'-bismaleimide]/[amine-terminated amic acid] being in the range from 1 to 3.
摘要:
A vehicle headlamp includes a light source configured to emit light, a reflector configured to reflect the light, a projection lens through which the light is projected, and a lens holder holding the projection lens. The projection lens has a positioning portion, and the lens holder is formed with a jig insertion hole at a location corresponding to the positioning portion in a direction around an optical axis of the projection lens such that the positioning portion is visible through the jig insertion hole. When mounting the projection lens to the lens holder, a positioning jig is inserted through the jig insertion hole and is engaged with the positioning portion to position the projection lens in the direction around the optical axis of the projection lens.
摘要:
A light source fixing structure of a lamp is provided. The structure includes a lamp body having a mounting base, a light source having a disc flange, and a set spring elastically contacting the disc flange to fix the disc flange to the mounting base. The lamp body includes a latch protrusion to lock the set spring. The set spring includes a support portion supported on the lamp body, a manually operable lock operating portion, and an elastically contacting portion. An operation of the lock operating portion in one direction causes the elastically contacting portion to elastically contact the back surface of the disc flange and generates an elastic reaction force in a direction different from the one direction. The elastic reaction force urges the lock operating portion toward the latch protrusion and causes the lock operating portion to engage with the latch protrusion.
摘要:
A an aspect of the present invention, a semiconductor device includes a lead frame having a lower base structure of oxygen free copper or copper-based alloy and having terminals; a semiconductor chip connected with the terminals of the lead frame; and a mold resin configured to cover the semiconductor chip. The lead frame has an exposed portion from the mold resin, and the exposed portion includes a diffusion prevention film formed on or above the lower base structure of the lead frame; and a Sn—Bi (tin-bismuth) film formed on the diffusion prevention film.
摘要:
A lighting unit to be used for illumination includes an LED unit having a semiconductor light emitting unit, a radiating board for directly fixing the semiconductor light emitting unit to an upper surface, and a contact formed on the radiating board and serving to input a power to cause the semiconductor light emitting unit to emit a light, an attachment having a power supply portion for surrounding and holding the LED unit and supplying a power to cause the semiconductor light emitting unit to emit a light from an external power plug to the contact in a state in which at least a part of lower and side surfaces of the radiating board and an upper part of the semiconductor light emitting unit are open.
摘要:
A semiconductor device includes a heat radiator having a convex portion. A reinforcement plate having a thermal conductivity is soldered on a portion of the convex portion of the heat radiator by a solder having a Young's modulus lower than a silver copper solder and a melting point lower than the silver copper solder. A semiconductor element soldered on the reinforcement plate by the solder.
摘要:
A hydrated chromium oxide-coated steel strip which has a satisfactory weldability and resistance to corrosion under a lacquer coating and which is useful for producing welded cans and other containers, comprises a steel strip substrate, plated nickel base layers formed on the surfaces of the steel strip substrate and having a weight of 150-2500 mg per m.sup.2 of each surface of the substrate, hydrated chromium oxide-containing coating layers formed on the surfaces of the plated nickel base layers and having a weight of 2-20 mg, in terms of metallic chromium, per m.sup.2 of each surface of the substrate, and, optionally, plated tin intermediate layers formed between the plated nickel base layers and the chromate-containing coating layers and having a weight of 100-2000 mg per m.sup.2 of each surface of the substrate, the hydrated chromium oxide-containing coating layer optionally being composed of a metallic chromium underlayer in a weight of 10 mg or less per m.sup.2 of each surface of the steel strip substrate and a hydrated chromium oxide upper layer, the sum of the weights of the underlayer and the upper layer being 2-20 mg, in terms of metallic chromium, per m.sup.2 of each surface of the steel strip substrate.