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1.发明申请PRELIMINARY-CURED MATERIAL, ROUGHENED PRELIMINARY-CURED MATERIAL, AND LAMINATED BODY 有权初始固化材料，粗化初始固化材料和层压体公开(公告)号：US20130108861A1
公开(公告)日：2013-05-02
申请号：US13582214
申请日：2011-03-31
申请人： Reona Yokota , Koichi Shibayama , Akihiro Uenishi , Hidenobu Deguchi , Tomoki Kunikawa , Tatsushi Hayashi
发明人： Reona Yokota , Koichi Shibayama , Akihiro Uenishi , Hidenobu Deguchi , Tomoki Kunikawa , Tatsushi Hayashi
IPC分类号： B32B15/092 , C08K3/36
CPC分类号： B32B15/092 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/38 , B32B2264/102 , B32B2307/538 , C08G59/4014 , C08G59/42 , C08G59/621 , C08G59/686 , C08J7/00 , C08K3/36 , C08L63/00 , Y10T428/259 , Y10T428/268 , C08L71/12
摘要： A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 μm but smaller than 0.5 μm, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 μm but not larger than 20 μm. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.
摘要翻译： 预固化材料允许粗糙化处理的表面的表面粗糙度降低，并且增加固化物体和金属层之间的粘合强度。 预固化材料是通过使包含环氧树脂，固化剂和二氧化硅的环氧树脂材料进行固化而得到的。 预固化材料包括待粗化处理的第一主表面和第二主表面。 二氧化硅包括粒径不小于0.01μm但小于0.5μm的第一小粒径二氧化硅和粒径不小于0.5μm但不大于20μm的第二大粒径二氧化硅。 第一小粒径二氧化硅被定位成大量存在于第一主表面的一侧，第二大颗粒直径二氧化硅在第二主表面的一侧大量存在。
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2.发明授权Preliminary-cured material, roughened preliminary-cured material, and laminated body 有权预固化材料，粗化预固化材料和层压体公开(公告)号：US09120293B2
公开(公告)日：2015-09-01
申请号：US13582214
申请日：2011-03-31
申请人： Reona Yokota , Koichi Shibayama , Akihiro Uenishi , Hidenobu Deguchi , Tomoki Kunikawa , Tatsushi Hayashi
发明人： Reona Yokota , Koichi Shibayama , Akihiro Uenishi , Hidenobu Deguchi , Tomoki Kunikawa , Tatsushi Hayashi
IPC分类号： B32B5/16 , B32B27/20 , B32B27/38 , C08J7/00 , G11B5/64 , B32B15/092 , C08G59/40 , C08G59/42 , C08G59/62 , C08G59/68 , C08L63/00 , C08K3/36
CPC分类号： B32B15/092 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/38 , B32B2264/102 , B32B2307/538 , C08G59/4014 , C08G59/42 , C08G59/621 , C08G59/686 , C08J7/00 , C08K3/36 , C08L63/00 , Y10T428/259 , Y10T428/268 , C08L71/12
摘要： A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 μm but smaller than 0.5 μm, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 μm but not larger than 20 μm. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.
摘要翻译： 预固化材料允许粗糙化处理的表面的表面粗糙度降低，并且增加固化物体和金属层之间的粘合强度。 预固化材料是通过使包含环氧树脂，固化剂和二氧化硅的环氧树脂材料进行固化而得到的。 预固化材料包括待粗化处理的第一主表面和第二主表面。 二氧化硅包括粒径不小于0.01μm但小于0.5μm的第一小粒径二氧化硅和粒径不小于0.5μm但不大于20μm的第二大粒径二氧化硅。 第一小粒径二氧化硅被定位成大量存在于第一主表面的一侧，第二大颗粒直径二氧化硅在第二主表面的一侧大量存在。
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3.发明申请Thermosetting Resin Composition, Resin Sheet and Resin Sheet for Insulated Substrate 失效热固性树脂组合物，树脂片和绝缘基材树脂片公开(公告)号：US20080233386A1
公开(公告)日：2008-09-25
申请号：US10581928
申请日：2004-12-07
申请人： Koichi Shibayama , Koji Yonezawa , Kazuyoshi Shiomi , Motohiro Yagi , Hidenobu Deguchi , Nobuhiro Goto
发明人： Koichi Shibayama , Koji Yonezawa , Kazuyoshi Shiomi , Motohiro Yagi , Hidenobu Deguchi , Nobuhiro Goto
IPC分类号： C08G59/62 , B32B15/092 , C08K3/36 , C08K5/17
CPC分类号： H01L23/295 , C08G59/625 , H01L2924/0002 , H05K1/0373 , H05K2201/0245 , Y10T428/25 , Y10T428/259 , Y10T428/26 , Y10T428/31525 , H01L2924/00
摘要： A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.
摘要翻译： 能够提供诸如树脂片的成型体的热固性树脂组合物，不仅具有介电特性，而且在高温下甚至在暴露于高温热历史之后都具有优异的尺寸稳定性，其热历史几乎没有尺寸变化，即 ，显示出低的线性膨胀系数。 此外，还提供了由热固性树脂组合物制成的用于绝缘基板的树脂片和树脂片。 特别地，提供一种热固性树脂组合物，其包含环氧树脂为100至2000环氧当量的环氧树脂，由酚化合物和层状硅酸盐组成的环氧树脂硬化剂，并且还提供由热固性树脂组合物 以及由树脂片构成的绝缘基板用树脂片。
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公开(公告)号：US07754803B2
公开(公告)日：2010-07-13
申请号：US10503491
申请日：2003-02-04
CPC分类号： H05K1/0373 , C08K3/01 , H05K1/0393 , H05K3/4626 , H05K3/4635 , H05K2201/0129 , H05K2201/0209 , H05K2201/0358 , H05K2201/068
摘要： A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of 1.0×10−3 [° C.−1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.
摘要翻译： 提供了具有改进的物理性能，尺寸稳定性，耐热性和阻燃性的树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷电路板，预浸料和粘合片 ，特别是高温物理性能。 含有100重量份热塑性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线膨胀系数（α2）为1.0×10-3 [℃-1]或 在比树脂组合物的玻璃化转变温度高10℃的温度范围内，比在树脂组合物的玻璃化转变温度高50℃的温度范围内。
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5.发明授权Thermosetting resin composition, resin sheet and resin sheet for insulated substrate 失效绝热基板的热固性树脂组合物，树脂片和树脂片公开(公告)号：US07709085B2
公开(公告)日：2010-05-04
申请号：US10581928
申请日：2004-12-07
申请人： Koichi Shibayama , Koji Yonezawa , Kazuyoshi Shiomi , Motohiro Yagi , Hidenobu Deguchi , Nobuhiro Goto
发明人： Koichi Shibayama , Koji Yonezawa , Kazuyoshi Shiomi , Motohiro Yagi , Hidenobu Deguchi , Nobuhiro Goto
CPC分类号： H01L23/295 , C08G59/625 , H01L2924/0002 , H05K1/0373 , H05K2201/0245 , Y10T428/25 , Y10T428/259 , Y10T428/26 , Y10T428/31525 , H01L2924/00
摘要： A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.
摘要翻译： 能够提供诸如树脂片的成型体的热固性树脂组合物，不仅具有介电特性，而且在高温下甚至在暴露于高温热历史之后都具有优异的尺寸稳定性，其热历史几乎没有尺寸变化，即 ，显示出低的线性膨胀系数。 此外，还提供了由热固性树脂组合物制成的用于绝缘基板的树脂片和树脂片。 特别地，提供一种热固性树脂组合物，其包含环氧树脂为100至2000环氧当量的环氧树脂，由酚化合物和层状硅酸盐组成的环氧树脂硬化剂，并且还提供由热固性树脂组合物 以及由树脂片构成的绝缘基板用树脂片。
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公开(公告)号：US20050107497A1
公开(公告)日：2005-05-19
申请号：US10503490
申请日：2003-02-04
申请人： Kazunori Akaho , Koji Yonezawa , Motohiro Yagi , Akihiko Fujiwara , Koichi Shibayama , Hidenobu Deguchi
发明人： Kazunori Akaho , Koji Yonezawa , Motohiro Yagi , Akihiko Fujiwara , Koichi Shibayama , Hidenobu Deguchi
CPC分类号： C08K3/346 , H05K1/0373 , H05K1/0393 , H05K3/4626 , H05K3/4635 , H05K2201/0129 , H05K2201/0209 , H05K2201/0358 , H05K2201/068 , Y10T428/25 , Y10T428/254 , Y10T428/26 , Y10T428/269
摘要： A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17×10−3 [° C.−1] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.
摘要翻译： 提供树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷板，预浸料和粘合片，其具有改进的机械性能，尺寸稳定性，耐热性和阻燃性， 特别是高温物理性能。 含有100重量份热固性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线性膨胀系数（α2）高达17×10 -3 [ 在比树脂组合物的玻璃化转变温度高10℃的温度到比树脂的玻璃化转变温度高50℃的温度的温度范围内， 组成。
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公开(公告)号：US07682691B2
公开(公告)日：2010-03-23
申请号：US10503490
申请日：2003-02-04
申请人： Kazunori Akaho , Koji Yonezawa , Motohiro Yagi , Akihiko Fujiwara , Koichi Shibayama , Hidenobu Deguchi
发明人： Kazunori Akaho , Koji Yonezawa , Motohiro Yagi , Akihiko Fujiwara , Koichi Shibayama , Hidenobu Deguchi
CPC分类号： C08K3/346 , H05K1/0373 , H05K1/0393 , H05K3/4626 , H05K3/4635 , H05K2201/0129 , H05K2201/0209 , H05K2201/0358 , H05K2201/068 , Y10T428/25 , Y10T428/254 , Y10T428/26 , Y10T428/269
摘要： A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. The resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of a layered silicate inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17×10−3 [° C.−1 ] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.
摘要翻译： 提供树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷板，预浸料和粘合片，其具有改进的机械性能，尺寸稳定性，耐热性和阻燃性， 特别是高温物理性能。 含有100重量份热固性树脂和0.1-65重量份层状硅酸盐无机化合物的树脂组合物，该树脂组合物的平均线性膨胀系数（α2）高达17×10-3 [℃ -1]在比树脂组合物的玻璃化转变温度高10℃的温度范围内，高于树脂组合物的玻璃化转变温度50℃。
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公开(公告)号：US20050165151A1
公开(公告)日：2005-07-28
申请号：US10503491
申请日：2003-02-04
CPC分类号： H05K1/0373 , C08K3/01 , H05K1/0393 , H05K3/4626 , H05K3/4635 , H05K2201/0129 , H05K2201/0209 , H05K2201/0358 , H05K2201/068
摘要： A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of 1.0×10−3 [° C.−1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.
摘要翻译： 提供了具有改进的物理性能，尺寸稳定性，耐热性和阻燃性的树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷电路板，预浸料和粘合片 ，特别是高温物理性能。 含有100重量份热塑性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线膨胀系数（α2）为1.0×10 -3 [° 在低于玻璃化转变温度的温度10℃以上的温度范围内，在高于玻璃化转变温度50℃的温度范围内， 树脂组合物。
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9.发明申请EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BODY, LAMINATE AND MULTILAYER LAMINATE 审中-公开环氧树脂组合物，PREPREG，固化体，片状模体，层压板和多层层压板公开(公告)号：US20110189432A1
公开(公告)日：2011-08-04
申请号：US13056392
申请日：2009-07-29
CPC分类号： C08J7/14 , B32B3/26 , B32B7/12 , B32B15/08 , B32B15/082 , B32B15/20 , B32B27/04 , B32B27/26 , B32B27/28 , B32B27/302 , B32B27/38 , B32B2260/02 , B32B2260/046 , B32B2307/306 , B32B2307/308 , B32B2307/538 , B32B2307/54 , B32B2307/546 , B32B2307/734 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K9/06 , C08L63/00 , H05K1/0373 , H05K3/181 , H05K3/381 , H05K2201/0209 , H05K2201/0239 , H05K2203/0773 , Y10T428/24355 , Y10T428/259
摘要： Provided is an epoxy resin composition capable of reducing the surface roughness of the surface of a roughening-treated cured body.The epoxy resin composition includes an epoxy resin, a curing agent, and a silica component obtained by performing a surface treatment on silica particles using a silane coupling agent; and the epoxy resin composition does not include a curing accelerator, or includes a curing accelerator at a content equal to or less than 3.5 parts by weight to a total of 100 parts by weight of the epoxy resin and the curing agent. Mean particle diameter of the silica particles is equal to or less than 1 μm. An amount B (g) of the silane coupling agent used for surface treatment, per 1 g of the silica particles in the silica component, is within a range between 10% to 80% with regard to a value C (g) per 1 g of the silica particles, which is calculated by the following formula (X). C (g)/1 g of Silica Particles=[Specific Surface Area of Silica Particles (m2/g)/Minimum Area Coated by Silane Coupling Agent (m2/g)] Formula (X)
摘要翻译： 提供能够降低经粗化处理的固化体的表面的表面粗糙度的环氧树脂组合物。 环氧树脂组合物包括环氧树脂，固化剂和通过使用硅烷偶联剂对二氧化硅颗粒进行表面处理而获得的二氧化硅组分; 环氧树脂组合物不包含固化促进剂，或者包含相对于总共100重量份的环氧树脂和固化剂为3.5重量份以下的固化促进剂。 二氧化硅颗粒的平均粒径等于或小于1μm。 用于表面处理的硅烷偶联剂的量B（g）与二氧化硅组分中的每1g二氧化硅颗粒相比，相对于每1g的C（g）值在10％至80％的范围内 的二氧化硅颗粒，其通过下式（X）计算。 C（g）/ 1g二氧化硅粒子= [二氧化硅粒子的比表面积（m2 / g）/硅烷偶联剂涂布的最小面积（m2 / g）]式（X）
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