Vapour deposition
    8.
    发明授权
    Vapour deposition 有权
    气相沉积

    公开(公告)号:US09556509B2

    公开(公告)日:2017-01-31

    申请号:US13885593

    申请日:2011-11-21

    IPC分类号: C23C14/00 C23C14/34 H01J37/34

    摘要: A method, comprising: generating a vapor of a material from a source of said material comprising a plurality of separate solid pieces of said material supported on a surface of a base in a configuration in which said plurality of solid pieces of said target material are arranged at two or more levels to cover the whole of said surface of said base while providing a gap between adjacent pieces at the same level; and depositing said material from said vapor onto a substrate.

    摘要翻译: 一种方法,包括:从所述材料的源产生材料的蒸气,所述材料的蒸气包括多个分离的所述材料的固体块,所述多个独立的固体块支撑在基体的表面上,所述构型中所述多个所述目标材料的固体块被布置 在两个或更多个水平上以覆盖所述基座的整个所述表面,同时在相同水平面上的相邻块之间提供间隙; 以及将所述材料从所述蒸气沉积到基底上。

    INTEGRATED CIRCUIT WITH A RECTIFIER ELEMENT
    9.
    发明申请
    INTEGRATED CIRCUIT WITH A RECTIFIER ELEMENT 失效
    整流电路与整流器元件

    公开(公告)号:US20100079246A1

    公开(公告)日:2010-04-01

    申请号:US12241992

    申请日:2008-09-30

    申请人: Ricardo Mikalo

    发明人: Ricardo Mikalo

    摘要: An integrated circuit with a rectifier element. One embodiment provides a signal source, an electronic circuit and a rectifier element with a copper layer and a cuprous oxide layer adjacent to and in direct contact with the copper layer. The signal source is configured to drive a signal on a signal output terminal that is electrically coupled to the copper layer. The electronic circuit is electrically coupled to the cuprous oxide layer. The rectifier element may be formed between wiring layers of an integrated circuit.

    摘要翻译: 具有整流元件的集成电路。 一个实施例提供了一个信号源,一个电子电路和一个具有铜层和氧化亚铜层的整流元件,它与铜层相邻并且与铜层直接接触。 信号源被配置为驱动电耦合到铜层的信号输出端子上的信号。 电子电路电耦合到氧化亚铜层。 整流元件可以形成在集成电路的布线层之间。

    CONDUCTIVE ELEMENTS IN ORGANIC ELECTRONIC DEVICES
    10.
    发明申请
    CONDUCTIVE ELEMENTS IN ORGANIC ELECTRONIC DEVICES 审中-公开
    有机电子设备中的导电元件

    公开(公告)号:US20130153869A1

    公开(公告)日:2013-06-20

    申请号:US13701571

    申请日:2011-06-03

    IPC分类号: H01L51/05 H01L51/00

    摘要: A technique comprising: forming a conductive element of an electronic device on a portion of the surface of a first organic layer, applying a second organic layer over said conductive element and said first organic layer, and then treating at least one of the first and second organic layers to increase the strength of adhesion between said first and second organic layers. Thereby the retention of said conductive element on said first organic layer is improved.

    摘要翻译: 一种技术,包括:在第一有机层的表面的一部分上形成电子器件的导电元件,在所述导电元件和所述第一有机层上施加第二有机层,然后处理第一和第二有机层中的至少一个 有机层以增加所述第一和第二有机层之间的粘附强度。 从而改善了所述导电元件在所述第一有机层上的保持。