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1.发明授权公开(公告)号：US07085135B2
公开(公告)日：2006-08-01
申请号：US10872879
申请日：2004-06-21
IPC分类号： H05K7/20
CPC分类号： F28F3/02 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.
摘要翻译： 提供了一种散热结构和方法，其包括具有被配置为耦合到电子部件的表面的表面的散热器，以便于从部件移除热量。 散热器表面和电子部件表面包括具有不同热膨胀系数的不同材料。 散热器表面具有限定多个散热器子结构的通道图案。 每个散热器子结构包括散热器表面的一部分。 散热器表面的部分是共面的，并且通过散热器表面提供与中性点的距离减小。 当散热器表面的部分结合到电子部件表面时，键内的剪切应力降低。
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2.发明授权公开(公告)号：US08857057B2
公开(公告)日：2014-10-14
申请号：US13447421
申请日：2012-04-16
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons , Prabjit Singh
CPC分类号： H05K7/20781 , Y10T29/49002 , Y10T29/4935 , Y10T29/49352 , Y10T29/49826
摘要： An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.
摘要翻译： 提供一种用于便利液体冷却电子机架的维修的装置。 该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线， 冷却液返回口和冷却液箱。 每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。 至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。 当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。
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3.发明授权公开(公告)号：US08387249B2
公开(公告)日：2013-03-05
申请号：US11942221
申请日：2007-11-19
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
CPC分类号： H05K7/20781 , Y10T29/49002 , Y10T29/4935 , Y10T29/49352 , Y10T29/49826
摘要： Apparatus and method for facilitating servicing of a liquid-cooled electronics rack are provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.
摘要翻译： 提供了一种便于维护液冷电子机架的设备和方法。 该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线， 冷却液返回口和冷却液箱。 每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。 至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。 当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。
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4.发明授权Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins 失效冷却装置，冷却电子模块及其制造方法采用导热的引线引脚散热片公开(公告)号：US07301770B2
公开(公告)日：2007-11-27
申请号：US11009935
申请日：2004-12-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons , Prabjit Singh
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , F28F3/022 , H01L23/433 , H01L23/473 , H01L2224/78301 , H01L2924/10253 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.
摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。 导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。 如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。 在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。
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公开(公告)号：US08743545B2
公开(公告)日：2014-06-03
申请号：US13271268
申请日：2011-10-12
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
CPC分类号： H05K7/20 , H01L23/367 , H01L23/373 , H01L23/3736 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2023/4087 , H01L2224/16 , Y10T29/49002 , Y10T29/4935 , Y10T29/49353
摘要： A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.
摘要翻译： 散热器和制造方法被提供用于从电子部件去除热量。 散热器包括散热器底座和框架。 基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。 框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。 散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。 热界面材料设置在基底表面和电子部件之间。
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6.发明授权Electronic device substrate assembly with impermeable barrier and method of making 有权具有不渗透屏障的电子器件基板组件及其制造方法公开(公告)号：US06587345B2
公开(公告)日：2003-07-01
申请号：US10047497
申请日：2001-11-09
IPC分类号： H05K720
CPC分类号： H01L23/04 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/16152 , H01L2924/16251 , H01L2924/19105 , Y10T29/4935 , H01L2924/00
摘要： An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device. When incorporated into an electronic module assembly including a module cap, the substrate assembly provides physical separation between a cooling fluid introduced into the module cap, and both the substrate and electronic devices.
摘要翻译： 电子模块基板组件和制造方法，该组件在电子装置和水性冷却剂之间提供良好的导热性，同时保持冷却剂和电子装置之间的物理分离，以及减轻由材料的热膨胀系数的失配引起的机械应力 设备组件。 该组件包括基底，至少一个电子器件和预先形成的导热的不可渗透屏障。 阻挡层被预成形为多个区域，其中一些区域结合到其它结构。 一个阻挡区域优选地形成与衬底周边的流体密封密封。 至少一个其它屏障区域与所述至少一个电子器件形成低热阻结合。 当结合到包括模块帽的电子模块组件中时，衬底组件提供了引入模块盖的冷却流体与衬底和电子设备两者之间的物理分离。
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7.发明授权公开(公告)号：US08867209B2
公开(公告)日：2014-10-21
申请号：US13187556
申请日：2011-07-21
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons , Prabjit Singh
IPC分类号： H05K7/20 , F28F7/00 , F28D15/02 , H01L23/473 , H01L23/427 , H05K13/00 , F28D21/00
CPC分类号： H05K13/00 , F28D15/02 , F28D2021/0028 , H01L23/427 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K7/20236 , H05K7/203 , H05K7/20745 , H05K7/20772 , H05K7/20809 , Y10T29/49002 , Y10T29/49353 , H01L2924/00
摘要： Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment. Transferred heat is subsequently conducted to, for example, a liquid-cooled cold plate or an air-cooled heat sink coupled to the housing for cooling the condenser structure.
摘要翻译： 提供冷却装置，冷却的电子模块和制造方法用于电子部件的流体浸没冷却。 冷却的电子模块包括支撑电子部件的基板，并且冷却装置耦合到基板，并且包括至少部分围绕电子部件周围并形成隔室的壳体。 此外，冷却装置包括设置在隔室内的流体和去离子结构。 电子部件至少部分地浸没在流体内，并且流体是水基流体。 去离子结构包括去离子材料，其确保隔室内的流体的去离子。 去离子结构便于从电子部件到设置在隔室中的冷凝器结构的沸腾热传递。 随后将转移的热量传送到例如冷却冷凝器结构的液冷冷板或连接到壳体的风冷散热片。
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公开(公告)号：US07254888B2
公开(公告)日：2007-08-14
申请号：US11100874
申请日：2005-04-07
IPC分类号： H05K3/34
CPC分类号： H01L23/373 , F28D2021/0029 , F28F3/02 , F28F21/02 , H01L23/3672 , H01L2924/0002 , Y10T29/4913 , Y10T29/49135 , Y10T29/49144 , H01L2924/00
摘要： A method of fabricating a heat sink includes preparing a surface of a graphite-based substrate and removing particulate matter generated from the preparation of the surface of the substrate. A metal-based coating is applied at the surface of the prepared substrate. The prepared substrate having the metal-based coating is arranged to form a heat sink structure.
摘要翻译： 制造散热器的方法包括制备石墨基基材的表面并除去由基材表面的制备产生的颗粒物质。 在制备的基材的表面上施加金属基涂层。 制备具有金属基涂层的衬底被布置成形成散热器结构。
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9.发明授权Electronic device substrate assembly with multilayer impermeable barrier and method of making 有权具有多层不渗透屏障的电子器件基板组件及其制造方法公开(公告)号：US06940712B2
公开(公告)日：2005-09-06
申请号：US10197661
申请日：2002-07-17
IPC分类号： H01L23/00 , H01L23/31 , H01L23/42 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/564 , H01L23/3121 , H01L23/42 , H01L23/4334 , H01L23/4338 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15312 , H01L2924/16152 , H01L2224/0401
摘要： An electronic module, substrate assembly, and fabrication method, the assembly providing thermal conduction between an electronic device to be cooled and an aqueous coolant, while maintaining physical separation between the coolant and electronic device. The assembly includes a substrate, one or more electronic devices to be cooled, and a multilayer, impermeable barrier. The multilayer barrier includes a first layer, providing mechanical support for a second layer. The second, thinner layer provides an impermeable barrier, and a high effective thermal conductivity path between an electronic device and a cooling fluid in contact with an upper surface of the second barrier layer. Mechanical stresses are minimized by appropriate material selection for the first layer, and a thin second layer. When incorporated into an electronic module assembly including a module cap, the substrate assembly provides physical separation between a cooling fluid introduced into the module cap, and both the substrate and electronic devices.
摘要翻译： 电子模块，基板组件和制造方法，该组件在要冷却的电子设备和水性冷却剂之间提供热传导，同时保持冷却剂和电子设备之间的物理分离。 组件包括基底，待冷却的一个或多个电子器件以及多层不可渗透的屏障。 多层屏障包括第一层，为第二层提供机械支撑。 第二较薄的层提供了不透水的屏障，以及电子器件与与第二阻挡层的上表面接触的冷却流体之间的高有效导热路径。 通过对第一层的适当材料选择和薄的第二层来最小化机械应力。 当结合到包括模块帽的电子模块组件中时，衬底组件提供了引入模块盖的冷却流体与衬底和电子设备两者之间的物理分离。
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10.发明授权公开(公告)号：US06907917B2
公开(公告)日：2005-06-21
申请号：US10340445
申请日：2003-01-10
IPC分类号： F28F3/02 , F28F21/02 , H01L23/367 , H01L23/373 , H05K7/20
CPC分类号： H01L23/373 , F28D2021/0029 , F28F3/02 , F28F21/02 , H01L23/3672 , H01L2924/0002 , Y10T29/4913 , Y10T29/49135 , Y10T29/49144 , H01L2924/00
摘要： One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the groove via a soldered joint at the metal-based coating and the groove. Another exemplary embodiment of a heat sink comprises a plurality of fins alternatingly arranged with a plurality of spacers. A method of fabricating a heat sink comprises preparing a surface of a graphite-based substrate, removing particulate matter generated from the preparation of the surface of the substrate, applying a metal-based coating at the surface of the substrate, and arranging the substrate to form a heat sink structure. An apparatus for cladding fins of a heat sink with a protective material comprises a first chamber that facilitates the preparation of substrate surfaces, a grit-removing apparatus disposed adjacent to the first chamber, a second chamber that facilitates the application of the protective material to the substrate surfaces, and a transport device configured to facilitate the movement of the substrates through the first chamber, to the grit-removing apparatus, and through the second chamber.
摘要翻译： 散热器的一个实施例包括具有设置在其表面处的凹槽的金属支撑构件和设置在凹槽处的翅片。 翅片包括其上设置有金属基涂层的石墨基材料，并且翅片通过金属基涂层和凹槽处的焊接接头保持在凹槽处。 散热器的另一示例性实施例包括交替布置有多个间隔件的多个翅片。 一种散热器的制造方法，其特征在于，准备石墨系基板的表面，除去从基板的表面的制造产生的微粒，在基板的表面涂敷金属基涂层，将基板 形成散热器结构。 一种用保护材料包覆散热片的设备包括有助于制备衬底表面的第一室，与第一室邻接设置的除砂装置，有助于将保护材料施加到第二室的第二室 衬底表面以及被配置为有助于衬底通过第一腔室移动到移砂装置和通过第二腔室的输送装置。
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