公开(公告)号：US20240274513A1

公开(公告)日：2024-08-15

申请号：US18645947

申请日：2024-04-25

Applicant: Rohm Co., Ltd.

Inventor： Koshun SAITO ,  Hiroyuki SAKAIRI ,  Yasufumi MATSUOKA ,  Kenichi YOSHIMOCHI

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48245 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1067 ,  H01L2924/13055 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/30101 ,  H01L2924/30107

Abstract: A semiconductor device provided with first and second semiconductor element each having an obverse and a reverse surface with a drain electrode, source electrode and gate electrode provided on the obverse surface. The semiconductor device is also provided with a control element electrically connected to the gate electrodes of the respective semiconductor elements, and with a plurality of leads, which include a first lead carrying the first semiconductor element, a second lead carrying the second semiconductor element, and a third lead carrying the control element. The first and second leads overlap with each other as viewed in a first direction perpendicular to the thickness direction of the semiconductor device, and the third lead overlaps with the first and second leads as viewed in a second direction perpendicular to the thickness direction and the first direction.

公开(公告)号：US20210343629A1

公开(公告)日：2021-11-04

申请号：US17373165

申请日：2021-07-12

Applicant: Rohm Co., Ltd.

Inventor： Koshun SAITO ,  Hiroyuki SAKAIRI ,  Yasufumi MATSUOKA ,  Kenichi YOSHIMOCHI

IPC: H01L23/495 ,  H01L23/00

Abstract: A semiconductor device provided with first and second semiconductor element each having an obverse and a reverse surface with a drain electrode, source electrode and gate electrode provided on the obverse surface. The semiconductor device is also provided with a control element electrically connected to the gate electrodes of the respective semiconductor elements, and with a plurality of leads, which include a first lead carrying the first semiconductor element, a second lead carrying the second semiconductor element, and a third lead carrying the control element. The first and second leads overlap with each other as viewed in a first direction perpendicular to the thickness direction of the semiconductor device, and the third lead overlaps with the first and second leads as viewed in a second direction perpendicular to the thickness direction and the first direction.

公开(公告)号：US20170011978A1

公开(公告)日：2017-01-12

申请号：US15269633

申请日：2016-09-19

Applicant: ROHM CO., LTD.

Inventor： Kensuke MIKADO ,  Makoto SHIBUYA ,  Yasufumi MATSUOKA

IPC: H01L23/29 ,  H01L23/492 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/293 ,  H01L21/568 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3192 ,  H01L23/492 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.

Abstract translation: 半导体器件包括半导体元件，主引线和树脂封装。 半导体元件包括在厚度方向上彼此间隔开的正面和反面。 主引线通过半导体元件的反面支撑半导体元件。 树脂封装覆盖整个半导体元件。 树脂封装以主引线的一部分从树脂封装体露出的方式覆盖主引线。 半导体元件包括在厚度方向上看不与主引线重叠的部分。

公开(公告)号：US20160086877A1

公开(公告)日：2016-03-24

申请号：US14958200

申请日：2015-12-03

Applicant: ROHM CO., LTD.

Inventor： Kensuke MIKADO ,  Makoto SHIBUYA ,  Yasufumi MATSUOKA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/293 ,  H01L21/568 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3192 ,  H01L23/492 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.

Abstract translation: 半导体器件包括半导体元件，主引线和树脂封装。 半导体元件包括在厚度方向上彼此间隔开的正面和反面。 主引线通过半导体元件的反面支撑半导体元件。 树脂封装覆盖整个半导体元件。 树脂封装以主引线的一部分从树脂封装体露出的方式覆盖主引线。 半导体元件包括在厚度方向上看不与主引线重叠的部分。

公开(公告)号：US20230395483A1

公开(公告)日：2023-12-07

申请号：US18454582

申请日：2023-08-23

Applicant: Rohm Co., Ltd.

Inventor： Koshun SAITO ,  Yasufumi MATSUOKA

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/07 ,  H01L23/31

CPC classification number: H01L23/49844 ,  H01L24/49 ,  H01L25/072 ,  H01L23/3121 ,  H01L2924/13091

Abstract: A semiconductor device includes a semiconductor element, a first lead including a mounting portion for the semiconductor element and a first terminal portion connected to the mounting portion, and a sealing resin covering the semiconductor element and a portion of the first lead. The mounting portion has a mounting-portion front surface and a mounting-portion back surface opposite to each other in a thickness direction, with the semiconductor element mounted on the mounting-portion front surface. The sealing resin includes a resin front surface, a resin back surface and a resin side surface connecting the resin front surface and the resin back surface. The mounting-portion back surface of the first lead is flush with the resin back surface. The first terminal portion includes a first-terminal-portion back surface exposed from the resin back surface, in a manner such that the first-terminal-portion back surface extends to the resin side surface.

公开(公告)号：US20230187336A1

公开(公告)日：2023-06-15

申请号：US18164410

申请日：2023-02-03

Applicant: Rohm Co., Ltd.

Inventor： Koshun SAITO ,  Yasufumi MATSUOKA

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/07 ,  H01L23/00

CPC classification number: H01L23/49844 ,  H01L23/3121 ,  H01L25/072 ,  H01L24/49 ,  H01L2924/13091

Abstract: A semiconductor device includes a semiconductor element, a first lead including a mounting portion for the semiconductor element and a first terminal portion connected to the mounting portion, and a sealing resin covering the semiconductor element and a portion of the first lead. The mounting portion has a mounting-portion front surface and a mounting-portion back surface opposite to each other in a thickness direction, with the semiconductor element mounted on the mounting-portion front surface. The sealing resin includes a resin front surface, a resin back surface and a resin side surface connecting the resin front surface and the resin back surface. The mounting-portion back surface of the first lead is flush with the resin back surface. The first terminal portion includes a first-terminal-portion back surface exposed from the resin back surface, in a manner such that the first-terminal-portion back surface extends to the resin side surface.

公开(公告)号：US20140306328A1

公开(公告)日：2014-10-16

申请号：US14253421

申请日：2014-04-15

Applicant: ROHM CO., LTD.

Inventor： Kensuke MIKADO ,  Makoto SHIBUYA ,  Yasufumi MATSUOKA

IPC: H01L23/495 ,  H01L23/28

CPC classification number: H01L23/293 ,  H01L21/568 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3192 ,  H01L23/492 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.

Abstract translation: 半导体器件包括半导体元件，主引线和树脂封装。 半导体元件包括在厚度方向上彼此间隔开的正面和反面。 主引线通过半导体元件的反面支撑半导体元件。 树脂封装覆盖整个半导体元件。 树脂封装以主引线的一部分从树脂封装体露出的方式覆盖主引线。 半导体元件包括在厚度方向上看不与主引线重叠的部分。

公开(公告)号：US20230245962A1

公开(公告)日：2023-08-03

申请号：US18298160

申请日：2023-04-10

Applicant: Rohm Co., Ltd.

Inventor： Koshun SAITO ,  Hiroyuki SAKAIRI ,  Yasufumi MATSUOKA ,  Kenichi YOSHIMOCHI

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/48 ,  H01L23/49503 ,  H01L2924/30107 ,  H01L2224/48245 ,  H01L2924/1033 ,  H01L2924/10271 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1067 ,  H01L2924/13091 ,  H01L2924/13064 ,  H01L2924/13055 ,  H01L2924/30101

Abstract: A semiconductor device provided with first and second semiconductor element each having an obverse and a reverse surface with a drain electrode, source electrode and gate electrode provided on the obverse surface. The semiconductor device is also provided with a control element electrically connected to the gate electrodes of the respective semiconductor elements, and with a plurality of leads, which include a first lead carrying the first semiconductor element, a second lead carrying the second semiconductor element, and a third lead carrying the control element. The first and second leads overlap with each other as viewed in a first direction perpendicular to the thickness direction of the semiconductor device, and the third lead overlaps with the first and second leads as viewed in a second direction perpendicular to the thickness direction and the first direction.

公开(公告)号：US20220102265A1

公开(公告)日：2022-03-31

申请号：US17643979

申请日：2021-12-13

Applicant: Rohm Co., Ltd.

Inventor： Koshun SAITO ,  Yasufumi MATSUOKA

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/07 ,  H01L23/31

Abstract: A semiconductor device includes a semiconductor element, a first lead including a mounting portion for the semiconductor element and a first terminal portion connected to the mounting portion, and a sealing resin covering the semiconductor element and a portion of the first lead. The mounting portion has a mounting-portion front surface and a mounting-portion back surface opposite to each other in a thickness direction, with the semiconductor element mounted on the mounting-portion front surface. The sealing resin includes a resin front surface, a resin back surface and a resin side surface connecting the resin front surface and the resin back surface. The mounting-portion back surface of the first lead is flush with the resin back surface. The first terminal portion includes a first-terminal-portion back surface exposed from the resin back surface, in a manner such that the first-terminal-portion back surface extends to the resin side surface.

公开(公告)号：US20150155253A1

公开(公告)日：2015-06-04

申请号：US14613473

申请日：2015-02-04

Applicant: ROHM CO., LTD.

Inventor： Yasufumi MATSUOKA

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/29 ,  H01L29/78

CPC classification number: H01L24/49 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L29/78 ,  H01L2224/0603 ,  H01L2224/14133 ,  H01L2224/16245 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48101 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/30101 ,  H01L2924/30107

Abstract: A semiconductor device includes a plurality of functional element chips, an electric connection member joined to two of the functional element chips, a first wire and a resin configured to cover the functional element chips, the electric connection member and the first wire. One of the two functional element chips may be a first semiconductor chip having first and second major surface electrodes facing toward the same direction and a first rear surface electrode facing in a direction opposite to a direction in which the first major surface electrode faces. The electric connection member may be joined to the first major surface electrode. The first wire may be joined to the second major surface electrode. The first wire may include a portion overlapping with the electric connection member in a thickness direction of the first semiconductor chip.

Abstract translation: 半导体器件包括多个功能元件芯片，连接到两个功能元件芯片的电连接构件，被配置为覆盖功能元件芯片，电连接构件和第一布线的第一布线和树脂。 两个功能元件芯片中的一个可以是具有朝向相同方向的第一和第二主表面电极的第一半导体芯片和面向与第一主表面电极面对的方向相反的方向的第一后表面电极。 电连接构件可以连接到第一主表面电极。 第一线可以连接到第二主表面电极。 第一线可以包括在第一半导体芯片的厚度方向上与电连接构件重叠的部分。