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1.
公开(公告)号:US20140290979A1
公开(公告)日:2014-10-02
申请号:US13854292
申请日:2013-04-01
Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventor: Jake Joo , Jerome Claracq , Sylvie Vervoort , Mubasher Bashir , Peter Trefonas , Garo Khanarian , Kathleen O'Connell
CPC classification number: H05K1/0274 , G06F2203/04103 , G06F2203/04112 , H05K3/0079 , H05K3/061 , H05K3/067 , H05K9/0084 , H05K2201/0108 , H05K2201/0278
Abstract: Method of manufacturing patterned conductor is provided, comprising: providing a conductivised substrate, wherein the conductivised substrate comprises a substrate and an electrically conductive layer; providing an electrically conductive layer etchant; providing a spinning material; providing a masking fiber solvent; forming a plurality of masking fibers and depositing the plurality of masking fibers onto the electrically conductive layer; exposing the electrically conductive layer to the electrically conductive layer etchant, wherein the electrically conductive layer that is uncovered by the plurality of masking fibers is removed from the substrate, leaving an interconnected conductive network on the substrate covered by the plurality of masking fibers; and, exposing the plurality of masking fibers to the masking fiber solvent, wherein the plurality of masking fibers are removed to uncover the interconnected conductive network on the substrate.
Abstract translation: 提供制造图案化导体的方法,包括:提供导电基底,其中所述电导基底包括基底和导电层; 提供导电层蚀刻剂; 提供纺纱材料; 提供掩蔽纤维溶剂; 形成多个掩模光纤,并将多个掩模光纤沉积到导电层上; 将所述导电层暴露于所述导电层蚀刻剂,其中由所述多个掩蔽光纤未覆盖的所述导电层从所述衬底移除,在由所述多个掩蔽光纤覆盖的所述衬底上留下互连的导电网络; 以及将所述多个屏蔽纤维暴露于掩蔽纤维溶剂中,其中去除所述多个掩蔽纤维以露出所述基底上的所述互连的导电网络。
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2.
公开(公告)号:US20140131078A1
公开(公告)日:2014-05-15
申请号:US14074390
申请日:2013-11-07
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Jaebum Joo , Jerome Claracq , Garo Khanarian , Kathleen M. O'Connell , Lijia Bu , Peter Trefonas
CPC classification number: H05K1/097 , G06F3/041 , G06F3/044 , G06F2203/04103 , H01B1/02 , H01B1/22 , H01L31/1884 , H05K3/02 , H05K3/1283 , H05K2201/0108 , Y02E10/50 , Y10T29/49155
Abstract: Method of manufacturing patterned transparent conductor is provided, comprising: providing a silver ink core component containing silver nanoparticles dispersed in a silver carrier; providing a shell component containing a film forming polymer dispersed in a shell. carrier; providing a substrate; coelectrospinning the silver ink core component and the shell component to form a core shell fiber, wherein the silver nanoparticles are in the core; depositing the core shell fiber on the substrate; selectively treating a portion of the deposited core shell fiber to provide a patterned transparent conductor, wherein the patterned transparent conductor has a treated region and a non-treated region; wherein the treated region comprises a plurality of electrically interconnected silver miniwires and wherein the treated region is an electrically conductive region; and, wherein the non-treated region is an electrically insulative region.
Abstract translation: 提供制造图案化透明导体的方法,包括:提供含银分散在银载体中的银墨芯组分; 提供包含分散在壳中的成膜聚合物的壳组分。 载体 提供衬底; 共同电纺丝银芯组分和壳组分以形成芯壳纤维,其中银纳米颗粒在芯中; 将芯壳纤维沉积在基底上; 选择性地处理沉积的芯壳纤维的一部分以提供图案化的透明导体,其中图案化的透明导体具有处理区域和未处理区域; 其中所述经处理的区域包括多个电互连的银微丝,并且其中所述经处理的区域是导电区域; 并且其中未处理区域是电绝缘区域。
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3.
公开(公告)号:US09148969B2
公开(公告)日:2015-09-29
申请号:US13947266
申请日:2013-07-22
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Jerome Claracq , Garo Khanarian , Lujia Bu , Jaebum Joo , Peter Trefonas
IPC: D01D10/02 , H05K7/00 , B82Y30/00 , B22F1/00 , B22F9/02 , C30B29/60 , D01D5/00 , D01D5/34 , D01F1/09 , H01L31/0224 , C30B29/02 , B82Y40/00
CPC classification number: H05K7/00 , B22F1/0025 , B22F1/0062 , B22F9/02 , B82Y30/00 , B82Y40/00 , C30B29/02 , C30B29/60 , D01D5/0007 , D01D5/34 , D01F1/09 , H01L31/022466
Abstract: A process for manufacturing silver nanowires is provided, comprising: providing a silver ink core component containing ≧60 wt % silver nanoparticles dispersed in a silver carrier; providing a shell component containing a film forming polymer dispersed in a shell carrier; providing a substrate; coelectrospinning the silver ink core component and the shell component depositing on the substrate a core shell fiber having a core and a shell surrounding the core, wherein the silver nanoparticles are in the core; and, treating the silver nanoparticles to form a population of silver nanowires, wherein the population of silver nanowires exhibit an average length, L, of ≧60 μm.
Abstract translation: 提供一种制造银纳米线的方法,包括:提供含有分散在银载体中的≥60重量%银纳米颗粒的银墨芯组分; 提供包含分散在壳载体中的成膜聚合物的壳组分; 提供衬底; 将银墨芯组分和壳组分共电极旋转沉积在基底上,芯壳和纤维具有围绕芯的核和壳,其中银纳米颗粒在芯中; 并且处理银纳米颗粒以形成银纳米线群体,其中银纳米线的群体表现出≥60μm的平均长度L。
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4.
公开(公告)号:US20140027954A1
公开(公告)日:2014-01-30
申请号:US13947266
申请日:2013-07-22
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Jerome Claracq , Garo Khanarian , Lujia Bu , Jaebum Joo , Peter Trefonas
IPC: H05K7/00
CPC classification number: H05K7/00 , B22F1/0025 , B22F1/0062 , B22F9/02 , B82Y30/00 , B82Y40/00 , C30B29/02 , C30B29/60 , D01D5/0007 , D01D5/34 , D01F1/09 , H01L31/022466
Abstract: A process for manufacturing silver nanowires is provided, comprising: providing a silver ink core component containing ≧60 wt % silver nanoparticles dispersed in a silver carrier; providing a shell component containing a film forming polymer dispersed in a shell carrier; providing a substrate; coelectrospinning the silver ink core component and the shell component depositing on the substrate a core shell fiber having a core and a shell surrounding the core, wherein the silver nanoparticles are in the core; and, treating the silver nanoparticles to form a population of silver nanowires, wherein the population of silver nanowires exhibit an average length, L, of ≧60 μm.
Abstract translation: 提供一种制造银纳米线的方法,包括:提供含有分散在银载体中的≥60重量%银纳米颗粒的银墨芯组分; 提供包含分散在壳载体中的成膜聚合物的壳组分; 提供衬底; 将银墨芯组分和壳组分共电极旋转沉积在基底上,芯壳和纤维具有围绕芯的核和壳,其中银纳米颗粒在芯中; 并且,处理银纳米颗粒以形成银纳米线群体,其中银纳米线的群体显示平均长度L>≥60μm。
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5.
公开(公告)号:US09066425B2
公开(公告)日:2015-06-23
申请号:US13854292
申请日:2013-04-01
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Jake Joo , Jerome Claracq , Sylvie Vervoort , Mubasher Bashir , Peter Trefonas , Garo Khanarian , Kathleen O'Connell
CPC classification number: H05K1/0274 , G06F2203/04103 , G06F2203/04112 , H05K3/0079 , H05K3/061 , H05K3/067 , H05K9/0084 , H05K2201/0108 , H05K2201/0278
Abstract: Method of manufacturing patterned conductor is provided, comprising: providing a conductivized substrate, wherein the conductivized substrate comprises a substrate and an electrically conductive layer; providing an electrically conductive layer etchant; providing a spinning material; providing a masking fiber solvent; forming a plurality of masking fibers and depositing the plurality of masking fibers onto the electrically conductive layer; exposing the electrically conductive layer to the electrically conductive layer etchant, wherein the electrically conductive layer that is uncovered by the plurality of masking fibers is removed from the substrate, leaving an interconnected conductive network on the substrate covered by the plurality of masking fibers; and, exposing the plurality of masking fibers to the masking fiber solvent, wherein the plurality of masking fibers are removed to uncover the interconnected conductive network on the substrate.
Abstract translation: 提供制造图案化导体的方法,包括:提供导电基底,其中所述导电基底包括基底和导电层; 提供导电层蚀刻剂; 提供纺纱材料; 提供遮蔽纤维溶剂; 形成多个掩模光纤,并将多个掩模光纤沉积到导电层上; 将所述导电层暴露于所述导电层蚀刻剂,其中由所述多个掩蔽光纤未覆盖的所述导电层从所述衬底移除,在由所述多个掩蔽光纤覆盖的所述衬底上留下互连的导电网络; 以及将所述多个屏蔽纤维暴露于掩蔽纤维溶剂中,其中去除所述多个掩蔽纤维以露出所述基底上的所述互连的导电网络。
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6.
公开(公告)号:US09295153B2
公开(公告)日:2016-03-22
申请号:US14074390
申请日:2013-11-07
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Jaebum Joo , Jerome Claracq , Garo Khanarian , Kathleen M. O'Connell , Lijia Bu , Peter Trefonas
CPC classification number: H05K1/097 , G06F3/041 , G06F3/044 , G06F2203/04103 , H01B1/02 , H01B1/22 , H01L31/1884 , H05K3/02 , H05K3/1283 , H05K2201/0108 , Y02E10/50 , Y10T29/49155
Abstract: Method of manufacturing patterned transparent conductor is provided, comprising: providing a silver ink core component containing silver nanoparticles dispersed in a silver carrier; providing a shell component containing a film forming polymer dispersed in a shell carrier; providing a substrate; coelectrospinning the silver ink core component and the shell component to form a core shell fiber, wherein the silver nanoparticles are in the core; depositing the core shell fiber on the substrate; selectively treating a portion of the deposited core shell fiber to provide a patterned transparent conductor, wherein the patterned transparent conductor has a treated region and a non-treated region; wherein the treated region comprises a plurality of electrically interconnected silver miniwires and wherein the treated region is an electrically conductive region; and, wherein the non-treated region is an electrically insulative region.
Abstract translation: 提供制造图案化透明导体的方法,包括:提供含银分散在银载体中的银墨芯组分; 提供包含分散在壳载体中的成膜聚合物的壳组分; 提供衬底; 共同电纺丝银芯组分和壳组分以形成芯壳纤维,其中银纳米颗粒在芯中; 将芯壳纤维沉积在基底上; 选择性地处理沉积的芯壳纤维的一部分以提供图案化的透明导体,其中图案化的透明导体具有处理区域和未处理区域; 其中所述经处理的区域包括多个电互连的银微丝,并且其中所述经处理的区域是导电区域; 并且其中未处理区域是电绝缘区域。
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公开(公告)号:US09040114B2
公开(公告)日:2015-05-26
申请号:US13968138
申请日:2013-08-15
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Garo Khanarian , Kathleen M. O'connell , Peter Trefonas , Jerome Claracq , Lijia Bu , Jaebum Joo
CPC classification number: H01B13/00 , G06F3/041 , G06F2203/04103 , H01L31/1884 , H05K1/097 , H05K2201/0108 , H05K2201/0224 , H05K2201/0326 , Y02E10/50
Abstract: A method of manufacturing a silver miniwire film is provided, wherein the film exhibits a reduced sheet resistance.
Abstract translation: 提供一种制造银微型薄膜的方法,其中薄膜表现出降低的薄层电阻。
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公开(公告)号:US20140065300A1
公开(公告)日:2014-03-06
申请号:US13968138
申请日:2013-08-15
Applicant: Rohm and Haas Electronic Materials LLC
Inventor: Garo Khanarian , Kathleen M. O'connell , Peter Trefonas , Jerome Claracq , Lijia Bu , Jaebum Joo
IPC: H01B13/00
CPC classification number: H01B13/00 , G06F3/041 , G06F2203/04103 , H01L31/1884 , H05K1/097 , H05K2201/0108 , H05K2201/0224 , H05K2201/0326 , Y02E10/50
Abstract: A method of manufacturing a silver miniwire film is provided, wherein the film exhibits a reduced sheet resistance.
Abstract translation: 提供一种制造银微型薄膜的方法,其中薄膜表现出降低的薄层电阻。
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