PATTERN TREATMENT METHODS
    2.
    发明申请
    PATTERN TREATMENT METHODS 有权
    模式处理方法

    公开(公告)号:US20160357110A1

    公开(公告)日:2016-12-08

    申请号:US15172246

    申请日:2016-06-03

    Abstract: Pattern treatment methods comprise: (a) providing a semiconductor substrate comprising a patterned feature on a surface thereof; (b) applying a pattern treatment composition to the patterned feature, wherein the pattern treatment composition comprises a block copolymer and a solvent, wherein the block copolymer comprises a first block and a second block, wherein the first block comprises a unit formed from a first monomer comprising an ethylenically unsaturated polymerizable group and a hydrogen acceptor group, wherein the hydrogen acceptor group is a nitrogen-containing group, and the second block comprises a unit formed from a second monomer comprising an ethylenically unsaturated polymerizable group and a cyclic aliphatic group; and (c) rinsing residual pattern treatment composition from the substrate, leaving a portion of the block copolymer bonded to the patterned feature. The methods find particular applicability in the manufacture of semiconductor devices for providing high resolution patterns.

    Abstract translation: 图案处理方法包括:(a)在其表面上提供包括图案化特征的半导体衬底; (b)将图案处理组合物施加到所述图案化特征,其中所述图案处理组合物包含嵌段共聚物和溶剂,其中所述嵌段共聚物包含第一嵌段和第二嵌段,其中所述第一嵌段包含由第一嵌段 包含烯属不饱和可聚合基团和氢受体基团的单体,其中所述氢受体基团是含氮基团,并且所述第二嵌段包含由包含烯键式不饱和可聚合基团和环状脂族基团的第二单体形成的单元; 和(c)从基材漂洗残余图案处理组合物,使一部分嵌段共聚物结合到图案化特征。 该方法在用于提供高分辨率图案的半导体器件的制造中具有特别的适用性。

    Pattern treatment methods
    7.
    发明授权

    公开(公告)号:US10133179B2

    公开(公告)日:2018-11-20

    申请号:US15224503

    申请日:2016-07-29

    Abstract: A pattern treatment method, comprising: (a) providing a semiconductor substrate comprising a patterned feature on a surface thereof; (b) applying a pattern treatment composition to the patterned feature, wherein the pattern treatment composition comprises: a block copolymer and an organic solvent, wherein the block copolymer comprises: (i) a first block comprising a first unit formed from 4-vinyl-pyridine, and (ii) a second block comprising a first unit formed from a vinyl aromatic monomer; and (c) removing residual pattern shrink composition from the substrate, leaving a coating of the block copolymer over the surface of the patterned feature, thereby providing a reduced pattern spacing as compared with a pattern spacing of the patterned feature prior to coating the pattern treatment composition. The methods find particular applicability in the manufacture of semiconductor devices for providing high resolution patterns.

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