公开(公告)号：US20170077900A1

公开(公告)日：2017-03-16

申请号：US15190286

申请日：2016-06-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook PARK ,  Christian ROMERO ,  Seong Hun NA ,  Tae Sung JEONG

IPC: H03H9/54 ,  H03H3/08 ,  H03H9/72 ,  H03H3/02 ,  H03H9/64 ,  H03H9/70

CPC classification number: H03H9/105 ,  H01L41/23 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02913 ,  H03H9/02992 ,  H03H9/0504 ,  H03H9/059 ,  H03H9/1014 ,  H03H9/1071 ,  H03H9/1078 ,  H03H9/1092 ,  H03H9/706 ,  H03H9/725 ,  H01L2924/00012

Abstract: An acoustic wave device includes a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included; a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator; and a shielding member electrically connected to the ground pad and blocking reception or emission of electromagnetic waves at the acoustic wave generator.

Abstract translation: 声波装置包括：衬底，其包括一个表面，声波发生器和至少一个接地焊盘包括在该表面上; 由绝缘材料形成并沿着声波发生器的圆周设置在基板上的支撑部件; 以及屏蔽构件，其电连接到接地焊盘并阻止在声波发生器处的电磁波的接收或发射。

公开(公告)号：US20170178992A1

公开(公告)日：2017-06-22

申请号：US15205483

申请日：2016-07-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Won JEONG ,  Ji Hoon KIM ,  Sun Ho KIM ,  Shang Hoon SEO ,  Seung Yeop KOOK ,  Christian ROMERO

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/48

CPC classification number: H01L23/3157 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/552 ,  H01L23/562 ,  H01L24/10 ,  H01L24/20 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2225/00 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1432 ,  H01L2924/14335 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/3512

Abstract: An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a component disposition region defined by an inner wall of the frame surrounding the electronic component, and an encapsulant filling at least a portion of the component disposition region. A portion of the inner wall of the frame forms a protrusion protruding toward the electronic component.

公开(公告)号：US20140176278A1

公开(公告)日：2014-06-26

申请号：US13841107

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Hwan LEE ,  Seung Wook PARK ,  Christian ROMERO ,  Young Do KWEON ,  Jin Gu KIM

IPC: H01F27/29 ,  H01F41/02

CPC classification number: H01F27/2828 ,  H01F27/292 ,  H01F41/10 ,  H01F2017/048 ,  Y10T29/49073

Abstract: There is provided an inductor, including a circuit board having an input and output terminal formed on a lower surface thereof, a connection pad formed on an upper surface thereof, and a via electrically connecting the input and output terminal and the connection pad, a coil having both ends joined to the connection pad and wound in a circular or a polygonal spiral shape in a longitudinal direction of the circuit board so as to have one or more turns, and a body stacked on the circuit board such that the coil and the connection pad are embedded therein.

Abstract translation: 提供一种电感器，包括电路板，其电路板具有形成在其下表面上的输入和输出端子，形成在其上表面上的连接焊盘和将输入和输出端子与连接焊盘电连接的通孔，线圈 其两端连接到连接焊盘，并沿着电路板的纵向缠绕成圆形或多边形螺旋形，以便具有一个或多个匝，以及堆叠在电路板上的主体，使得线圈和连接 垫嵌入其中。

公开(公告)号：US20160165723A1

公开(公告)日：2016-06-09

申请号：US14955748

申请日：2015-12-01

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Christian ROMERO ,  Kyung-Seob OH ,  Jeong-Ho LEE ,  Young-Do KWEON

IPC: H05K1/11 ,  H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311

Abstract: A circuit board, and a package substrate and an electronic device that includes a circuit board are disclosed. The circuit board includes a core layer, a base pattern layer disposed on the core layer and a through-hole conductor that goes through the core layer, the base pattern layer including a circuit pattern that includes a conductive pad on the through-hole conductor, an insulator layer including at least one insulating layer stacked on the core layer and the base pattern layer, and a laminated pattern layer including a plurality of vias and a laminated circuit pattern, the plurality of vias penetrating the insulating layer, and the laminated circuit pattern being disposed on the insulating layer and including a plurality of via pads formed on the vias respectively.

Abstract translation: 公开了一种电路板，封装基板和包括电路板的电子设备。 电路板包括芯层，设置在芯层上的基底图案层和穿过芯层的通孔导体，基底图案层包括在通孔导体上包括导电焊盘的电路图案， 包括堆叠在芯层和基底图案层上的至少一个绝缘层的绝缘体层，以及包括多个通孔和层叠电路图案的层叠图案层，穿过绝缘层的多个通孔和层叠电路图案 设置在绝缘层上并且分别包括形成在通孔上的多个通孔焊盘。