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    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号：US20160043197A1

    公开(公告)日：2016-02-11

    申请号：US14820564

    申请日：2015-08-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： CHEOL KIM ,  DONGHYUN KIM ,  MYEONGCHEOL KIM ,  DAEYONG KIM ,  CHULSUNG KIM

    IPC: H01L29/66 ,  H01L21/02 ,  H01L21/768

    CPC classification number: H01L29/6681 ,  H01L21/31116 ,  H01L21/76897 ,  H01L29/6656

    Abstract: Provided are a semiconductor device and a fabrication method thereof. The semiconductor device may include a fin-shaped active pattern and a gate electrode provided on a substrate, first and second spacers provided on a sidewall of the gate electrode, impurity regions provided at both sides of the gate electrode, a contact plug electrically connected to one of the impurity regions, and a third spacer enclosing the contact plug and having a top surface positioned at substantially the same level as a top surface of the contact plug.

    Abstract translation: 提供半导体器件及其制造方法。 半导体器件可以包括鳍形有源图案和设置在基板上的栅电极，设置在栅电极的侧壁上的第一和第二间隔物，设置在栅电极两侧的杂质区，电连接到 一个杂质区，以及包围该接触插塞的第三间隔件，并且具有位于该接触插塞顶表面基本相同高度的顶表面。

    SEMICONDUCTOR DEVICE
    3.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220293600A1

    公开(公告)日：2022-09-15

    申请号：US17522051

    申请日：2021-11-09

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： CHEOL KIM ,  JONGCHUL PARK ,  HYUNHO JUNG

    IPC: H01L27/092 ,  H01L23/528 ,  H01L29/06 ,  H01L29/423 ,  H01L29/417 ,  H01L29/786 ,  H01L29/08 ,  H01L29/78 ,  H01L21/8238 ,  H01L29/66

    Abstract: A semiconductor device includes a substrate having first and second active regions. A first active pattern is on the first active region and includes first source/drain patterns and a first channel pattern therebetween. A second active pattern is on the second active region and includes second source/drain patterns and a second channel pattern therebetween. A gate electrode includes a first gate electrode on the first channel pattern and a second gate electrode on the second channel pattern. A gate cutting pattern is between the first and second gate electrodes and separates the first and second gate electrodes from each other. A pair of gate spacers is on opposite sidewalls of the first gate electrode extending along opposite sidewalls of the gate cutting pattern towards the second gate electrode. The gate cutting pattern includes first to third parts having maximum widths that increase from the first to the third part.

    SEMICONDUCTOR PACKAGE
    4.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20240071866A1

    公开(公告)日：2024-02-29

    申请号：US18237209

    申请日：2023-08-23

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： CHEOL KIM ,  SEOKHYUN LEE

    IPC: H01L23/433 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10

    CPC classification number: H01L23/4334 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/24 ,  H01L25/105 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/2101 ,  H01L2224/32225 ,  H01L2224/73204

    Abstract: A semiconductor package includes a package substrate, a first semiconductor chip, and an encapsulant surrounding the semiconductor chip. The first semiconductor chip includes a semiconductor substrate having an active surface and an inactive surface opposite to the active surface, the semiconductor chip disposed on the package substrate such that the active surface faces the package substrate. The semiconductor package further includes a first redistribution structure on the encapsulant. The first redistribution structure includes a thermally conductive pattern, a heat-conducting through via providing a path for heat to conduct from the semiconductor substrate to the thermally conductive pattern, and a redistribution insulating layer surrounding the heat-conducting through via. The semiconductor substrate includes a first contact region having a higher temperature than a surrounding area on the inactive surface, and the heat-conducting through via passes through the encapsulant and contacts the first contact region.

    SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME AND MANUFACTURING METHODS THEREOF
    7.
    发明申请
    SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME AND MANUFACTURING METHODS THEREOF 有权
    半导体器件，包括其的电子器件及其制造方法

    公开(公告)号：US20150162247A1

    公开(公告)日：2015-06-11

    申请号：US14531987

    申请日：2014-11-03

    Applicant: SAMSUNG ELECTRONICS CO., Ltd.

    Inventor： Yong-Joon CHOI ,  MYEONGCHEOL KIM ,  CHEOL KIM ,  GeumJung SEONG ,  Hak-Sun LEE ,  Haegeon JUNG ,  Ji-Eun HAN

    IPC: H01L21/8234 ,  H01L21/762 ,  H01L21/308 ,  H01L27/088

    CPC classification number: H01L21/823431 ,  H01L21/3081 ,  H01L21/76224 ,  H01L27/0886

    Abstract: The disclosure provides semiconductor devices and methods of manufacturing the same. The method includes etching a substrate using a first mask pattern formed on the substrate to form a trench, forming a preliminary device isolation pattern filling the trench and including first and second regions having first thicknesses, forming a second mask pattern on the first region, etching an upper portion of the second region and a portion of the first mask pattern, which are exposed by the second mask pattern, to form a second region having a second thickness smaller than the first thickness, removing the first and second mask patterns, and etching upper portions of the first region and the second region having the second thickness to form a device isolation pattern defining preliminary fin-type active patterns. An electronic device including a semiconductor device and a manufacturing method thereof are also disclosed.

    Abstract translation: 本公开提供半导体器件及其制造方法。 该方法包括使用形成在衬底上的第一掩模图案来蚀刻衬底以形成沟槽，形成填充沟槽的初步器件隔离图案，并且包括具有第一厚度的第一和第二区域，在第一区域上形成第二掩模图案，蚀刻 第二区域的上部和第一掩模图案的一部分被第二掩模图案曝光，以形成具有小于第一厚度的第二厚度的第二区域，去除第一和第二掩模图案，以及蚀刻 所述第一区域的上部和所述第二区域具有第二厚度，以形成限定预备鳍型活性图案的器件隔离图案。 还公开了一种包括半导体器件及其制造方法的电子器件。

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