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    DISPLAY MODULE INCLUDING COLOR CONVERSION LAYER FORMED ON SELFLUMINESCENCE ELEMENT AND MANUFACTURING METHOD OF THE SAME
    1.
    发明公开
    DISPLAY MODULE INCLUDING COLOR CONVERSION LAYER FORMED ON SELFLUMINESCENCE ELEMENT AND MANUFACTURING METHOD OF THE SAME 审中-公开

    公开(公告)号：US20240162390A1

    公开(公告)日：2024-05-16

    申请号：US18511414

    申请日：2023-11-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Daehee LEE ,  Sungjun KOH ,  Sanghyun SOHN

    IPC: H01L33/50 ,  H01L25/075

    CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/505 ,  H01L2933/0041

    Abstract: Provided is a display module including a substrate, and a plurality of pixels on the substrate, wherein each of the plurality of pixels includes a first self-luminescence element, a second self-luminescence element, and a third self-luminescence element respectively configured to emit light of a first wavelength band, a first color conversion layer configured to be disposed on the first self-luminescence element, and include a plurality of first quantum dots to absorb the light of the first wavelength emitted from the first self-luminescence element, and emit a light of a second wavelength band and second color conversion layer configured to be disposed on the second self-luminescence element, and comprise a plurality of second quantum dots to absorb the light of the first wavelength emitted from the second self-luminescence element, and emit a light of a third wavelength band, wherein the first color conversion layer and the second color conversion layer include a plurality of foam particles configured to scatter the light emitted from the first self-luminescence element and the light emitted from the second self-luminescence element.

    DISPLAY APPARATUS
    2.
    发明公开
    DISPLAY APPARATUS 审中-公开

    公开(公告)号：US20240297274A1

    公开(公告)日：2024-09-05

    申请号：US18396249

    申请日：2023-12-26

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Daehee LEE ,  Sungjun Koh ,  Yeseul Park ,  Yongdok Cha

    IPC: H01L33/50 ,  H01L27/15 ,  H01L33/54 ,  H01L33/58

    CPC classification number: H01L33/50 ,  H01L27/156 ,  H01L33/54 ,  H01L33/58

    Abstract: A display apparatus includes a display module array including a plurality of display modules that are horizontally arranged in a form of a matrix. Each of the plurality of display modules include: a substrate including a mounting surface and a rear surface opposite to the mounting surface; a metal plate bonded to the rear surface and configured to dissipate heat from the substrate; a front cover covering the mounting surface; inorganic light emitting devices mounted on the mounting surface; a color layer between the inorganic light emitting devices and the front cover; and an adhesive layer between the mounting surface and the color layer and configured to bond the mounting surface and the color layer.

    SEMICONDUCTOR DEVICE AND LAYOUT METHOD OF THE SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND LAYOUT METHOD OF THE SAME 有权

    公开(公告)号：US20230132080A1

    公开(公告)日：2023-04-27

    申请号：US17867195

    申请日：2022-07-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seungil CHAI ,  Kyunghee SHIN ,  Daehee LEE ,  Moonhui LEE

    IPC: H01L23/528 ,  H01L23/522 ,  H01L27/11524

    Abstract: A semiconductor device, includes a plurality of semiconductor elements, each of the plurality of semiconductor elements including a gate structure extending in a first direction and an active region provided on both sides of the gate structure in a second direction intersecting the first direction; and a plurality of interconnection patterns connected to the plurality of semiconductor elements, wherein the plurality of interconnection patterns include a plurality of upper interconnections provided above the plurality of semiconductor elements in a third direction, a plurality of intermediate interconnections provided between the plurality of semiconductor elements and the plurality of upper interconnections in the third direction, and a routing interconnection adjacent to at least one of the plurality of semiconductor elements in the second direction, wherein the routing interconnection is connected to at least one of the plurality of intermediate interconnections in the first direction or the second direction.

    SEMICONDUCTOR DEVICES INCLUDING THICK PAD
    8.
    发明申请
    SEMICONDUCTOR DEVICES INCLUDING THICK PAD 有权

    公开(公告)号：US20220262757A1

    公开(公告)日：2022-08-18

    申请号：US17736536

    申请日：2022-05-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Taeho KO ,  Daehee LEE ,  Hyunchul JUNG

    IPC: H01L23/00 ,  H01L23/31

    Abstract: A semiconductor device may include a semiconductor chip in an encapsulant. A first insulation layer may be disposed on the encapsulant and the semiconductor chip. A horizontal wiring and a primary pad may be disposed on the first insulation layer. A secondary pad may be disposed on the primary pad. A second insulation layer covering the horizontal wiring may be disposed on the first insulation layer. A solder ball may be disposed on the primary pad and the secondary pad. The primary pad may have substantially the same thickness as a thickness of the horizontal wiring.

    SEMICONDUCTOR DEVICES INCLUDING THICK PAD
    9.
    发明申请
    SEMICONDUCTOR DEVICES INCLUDING THICK PAD 有权

    公开(公告)号：US20210217720A1

    公开(公告)日：2021-07-15

    申请号：US16983296

    申请日：2020-08-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Taeho KO ,  Daehee LEE ,  Hyunchul JUNG

    IPC: H01L23/00 ,  H01L23/31

    Abstract: A semiconductor device may include a semiconductor chip in an encapsulant. A first insulation layer may be disposed on the encapsulant and the semiconductor chip. A horizontal wiring and a primary pad may be disposed on the first insulation layer. A secondary pad may be disposed on the primary pad. A second insulation layer covering the horizontal wiring may be disposed on the first insulation layer. A solder ball may be disposed on the primary pad and the secondary pad. The primary pad may have substantially the same thickness as a thickness of the horizontal wiring.

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