公开(公告)号：US11942337B2

公开(公告)日：2024-03-26

申请号：US17063820

申请日：2020-10-06

Applicant: SEMES CO., LTD.

Inventor： Eui Sang Lim ,  Young Hun Lee ,  Jinwoo Jung ,  Miso Park ,  Byongwook Ahn ,  Yong Hee Lee

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67017 ,  H01J37/32449 ,  H01J37/32467 ,  H01J37/32715 ,  H01J37/32834 ,  H01J2237/334

Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.

公开(公告)号：US09406501B2

公开(公告)日：2016-08-02

申请号：US13905634

申请日：2013-05-30

Applicant: Semes Co., Ltd.

Inventor： Yong Hee Lee ,  Bok Kyu Lee ,  Jongsu Choi

IPC: B08B3/00 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02052 ,  H01L21/67051

Abstract: Provided are an apparatus and a method of cleaning a substrate. The apparatus includes a substrate supporting unit supporting a substrate, a container surrounding the substrate supporting unit and collecting an organic solvent scattered from the substrate, and a fluid supplying unit provided on one side of the container and spraying a liquid organic solvent with bubbles to the substrate. The fluid supplying unit includes a nozzle head ejecting the organic solvent to the substrate, an organic solvent supplying line supplying the organic solvent from an organic solvent storage tank to the nozzle head, and a bubble providing element provided on the organic solvent supplying line and providing bubbles to the liquid organic solvent.

Abstract translation: 提供一种清洗基板的装置和方法。 该装置包括支撑基板的基板支撑单元，围绕基板支撑单元并收集从基板散射的有机溶剂的容器以及设置在容器的一侧上的流体供给单元，并且向液体有机溶剂喷射气泡 基质。 流体供给单元包括将有机溶剂喷射到基板的喷嘴头，将有机溶剂从有机溶剂容器供给到喷嘴头的有机溶剂供给管线和设置在有机溶剂供给管线上的气泡供给元件， 气泡到液体有机溶剂。

公开(公告)号：US11908710B2

公开(公告)日：2024-02-20

申请号：US17520826

申请日：2021-11-08

Applicant: SEMES CO., LTD.

Inventor： Jin Woo Jung ,  Do Hyeon Yoon ,  Yong Hee Lee

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67028 ,  H01L21/02101 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67739

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US11495474B2

公开(公告)日：2022-11-08

申请号：US17026389

申请日：2020-09-21

Applicant: SEMES CO., LTD.

Inventor： Yong Hee Lee ,  Young Hun Lee ,  Jinwoo Jung ,  Eui Sang Lim

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.

公开(公告)号：US12300515B2

公开(公告)日：2025-05-13

申请号：US17370469

申请日：2021-07-08

Applicant: SEMES CO., LTD.

Inventor： Miso Park ,  Yong Hee Lee ,  Dohyeon Yoon

IPC: H01L21/67 ,  B08B7/00 ,  B08B7/04 ,  F27B17/00 ,  F27D5/00 ,  H05B1/02 ,  H05B3/30 ,  H01L21/687 ,  H05B3/28

Abstract: The inventive concept provides an apparatus for treating a substrate by using a supercritical fluid. In an embodiment, the apparatus may include a process chamber that provides a treatment space, and including a chamber heater that increases a temperature of an interior of the treatment space, a substrate support provided in the treatment space and that supports the substrate, and a substrate heating member that heats a lower surface of the substrate while contacting the lower surface of the substrate.

公开(公告)号：US10395915B2

公开(公告)日：2019-08-27

申请号：US14190534

申请日：2014-02-26

Applicant: Semes Co., Ltd.

Inventor： Se Won Lee ,  Yong Hee Lee ,  Jae Yong Kim

IPC: H01L21/02 ,  H01L21/67

Abstract: Provided is a substrate treatment apparatus. The apparatus includes a chuck supporting a substrate and being rotatable, a container surrounding the chuck and collecting chemicals scattered due to rotations of the substrate, and a first spray nozzle spraying the chemicals to the substrate.

公开(公告)号：US10818519B2

公开(公告)日：2020-10-27

申请号：US16044601

申请日：2018-07-25

Applicant: SEMES CO., LTD.

Inventor： Yong Hee Lee ,  Young Hun Lee

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02

Abstract: Disclosed are an apparatus and a method for drying a substrate. The apparatus for drying a substrate includes a chamber having a treatment space in the interior thereof, a substrate support unit configured to the substrate in the treatment space, a conversion unit configured to convert a state of the substrate supported by the substrate support unit between a horizontal state and an inclined state, a fluid supply unit configured to supply a drying fluid into the treatment space, and a controller configured to control the conversion unit and the fluid supply unit.

公开(公告)号：US12300483B2

公开(公告)日：2025-05-13

申请号：US17370475

申请日：2021-07-08

Applicant: SEMES CO., LTD.

Inventor： Miso Park ,  Yong Hee Lee ,  Eui Sang Lim ,  Jinwoo Jung

IPC: H01L21/02 ,  B08B7/00 ,  B08B13/00 ,  H01L21/67

Abstract: An apparatus for treating a substrate using a treating fluid in a supercritical state is provided. In a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the apparatus controls a supply amount of the treating fluid supplied from a first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through an exhaust port.

公开(公告)号：US12293928B2

公开(公告)日：2025-05-06

申请号：US17563189

申请日：2021-12-28

Applicant: SEMES CO., LTD.

Inventor： Eui Sang Lim ,  Yong Hee Lee

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

Abstract: A substrate treating device includes a liquid treating chamber for liquid-treating a substrate therein, a drying chamber for dry-treating the liquid-treated substrate, a transfer device for transferring the substrate between the liquid treating chamber and the drying chamber, and a controller for controlling the liquid treating chamber and the transfer device. The transfer device includes a transfer robot having a hand for placing the substrate thereon, and a heating member for heating the substrate. The controller controls the transfer device such that the heating member of the transfer device heats a liquid on the substrate to a first temperature before the transfer device transfers the substrate taken out from the liquid treating chamber to the drying chamber.

公开(公告)号：US12278128B2

公开(公告)日：2025-04-15

申请号：US17365165

申请日：2021-07-01

Applicant: SEMES CO., LTD.

Inventor： Jinwoo Jung ,  Yong Hee Lee

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: An apparatus for treating a substrate is provided. The apparatus for treating the substrate includes a first process chamber to perform a liquid treatment process with respect to the substrate, a second process chamber to perform a drying treatment process with respect to the substrate which is liquid treated in the first process chamber, a first hand to introduce the substrate to the first process chamber, before the liquid treatment process is performed, a second hand to withdraw the substrate from the first process chamber after the liquid treatment process is performed and to introduce the substrate into the second process chamber, and a third hand to withdraw the substrate from the second process chamber after the drying treatment process is performed.