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1.发明申请公开(公告)号：US20170321001A1
公开(公告)日：2017-11-09
申请号：US15534557
申请日：2015-05-27
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Huayang DENG , Zengbiao HUANG , Qianfa LIU , Zhongqiang YANG , Peng WANG
IPC: C08G59/66 , C08J5/04 , C08J11/04 , C08G59/24 , B32B15/092 , C08G59/56 , C08G59/50 , C08K3/36 , C08J5/24
CPC classification number: C08G59/66 , B32B15/092 , C08G59/245 , C08G59/504 , C08G59/56 , C08J3/243 , C08J5/043 , C08J5/24 , C08J11/04 , C08J11/16 , C08J11/18 , C08J2363/00 , C08J2363/02 , C08K3/36 , C08L63/00 , Y02W30/705 , Y02W30/706
Abstract: Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.
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2.发明申请公开(公告)号：US20200224026A1
公开(公告)日：2020-07-16
申请号：US16633018
申请日：2017-11-02
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe SU , Zhongqiang YANG
Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
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3.发明申请公开(公告)号：US20180126701A1
公开(公告)日：2018-05-10
申请号：US15529335
申请日：2016-09-08
Applicant: Shengyi Technology Co., Ltd.
Inventor： Jiang YOU , Tianhui HUANG , Yongjing XU , Zhongqiang YANG
CPC classification number: B32B15/092 , B32B27/18 , B32B33/00 , C08G59/32 , C08G59/62 , C08J2300/24 , C08K3/36 , C08K5/357 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition, a prepreg and a laminate for printed circuit boards using the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 16 to 42 parts by weight of a halogen-free epoxy resin, (B) from 1.5 to 4.8 parts by weight of a compound containing dihydrobenzoxazine ring; (C) from 10 to 28 parts by weight of a phosphorus-containing bisphenol curing agent, wherein the phosphorus-containing bisphenol curing agent has a weight average molecular weight of 1000-6500, and (D) from 30 to 70 parts by weight of silicon dioxide. The prepreg and laminate for printed circuit boards prepared from the halogen-free thermosetting resin composition have high glass transition temperature, excellent dielectric performances, low water absorption, high heat resistance and better processability, and can achieve halogen-free flame retardancy and UL94 V-0.
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公开(公告)号：US20220153989A1
公开(公告)日：2022-05-19
申请号：US17437555
申请日：2019-04-08
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Liexiang HE , Yongnian QI , Xianping ZENG , Zhongqiang YANG , Hualin PAN
Abstract: The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.
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公开(公告)号：US20160007452A1
公开(公告)日：2016-01-07
申请号：US14647412
申请日：2014-02-19
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Shanyin YAN , Xianping ZENG , Yongjing XU , Zhongqiang YANG , Xiaosheng SU , Li Luo
CPC classification number: H05K1/0306 , C03C25/16 , C03C25/30 , C03C25/326 , C03C25/36 , C08J5/24 , C08J2323/20 , C08J2363/00 , C08J2371/12 , C08J2379/04 , H05K1/0366 , H05K1/0393 , H05K3/0011 , H05K3/0085 , H05K2201/029
Abstract: The present invention relates to a process for preparing a bonding sheet for composing circuit substrate, comprising pre-treating glass fabrics with a pre-treating varnish having a same or close dielectric constant (DK) to glass fabrics being used. The present invention further relates to bonding sheets prepared by the process, as well as circuit substrate. The process for preparing circuit substrate of the invention, which has a lower cost, does not need to upgrade or adjust the equipment. The circuit substrates prepared thereby have less warp-wise and weft-wise difference in dielectric constant, and thus can effectively solve the problem of signal time delay.
Abstract translation: 本发明涉及一种制备用于构成电路基板的接合片的方法，包括用玻璃织物预处理玻璃织物与具有相同或接近介电常数（DK）的预处理清漆。 本发明还涉及通过该方法制备的粘合片以及电路基片。 本发明的具有较低成本的电路基板的制造方法不需要升级或调整设备。 由此制备的电路基板在介电常数方面具有较少的经向和纬向差异，因此可以有效地解决信号时间延迟的问题。
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Patent Agency Ranking
公开(公告)号：US20220135788A1
公开(公告)日：2022-05-05
申请号：US17437564
申请日：2019-04-08
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Liexiang HE , Yaode ZENG , Zhongqiang YANG , Yu YANG , Hualin PAN , Yongjing XU
Abstract: The present disclosure provides a resin composition, as well as a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 48-54 parts by weight of a halogen-free epoxy resin, 16-31 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group; and 15-32 parts by weight of a cyanate ester resin. The prepreg, laminate and printed circuit board prepared from the resin composition have a low coefficient of thermal expansion.
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7.发明申请公开(公告)号：US20180263115A1
公开(公告)日：2018-09-13
申请号：US15841439
申请日：2017-12-14
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe SU , Duye LI , Shanyin YAN , Qianfa LIU , Zhongqiang YANG
CPC classification number: H05K1/0373 , B32B5/26 , B32B17/02 , B32B25/16 , B32B2262/101 , B32B2307/204 , C08J5/24 , C08J2300/24 , C08J2325/10 , C08J2400/26 , C08J2423/16 , H05K1/0237 , H05K1/0366 , H05K2201/0154 , H05K2201/0278 , H05K2201/068
Abstract: The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite comprises (1) from 20 to 70 parts by weight of a thermosetting mixture, comprising (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.
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公开(公告)号：US20170238417A1
公开(公告)日：2017-08-17
申请号：US15316380
申请日：2015-12-07
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Shanyin YAN , Yongjing XU , Zhongqiang YANG , Yongming ZHU
IPC: H05K1/03 , C09D171/12 , D06M15/53 , H05K3/38 , D06M23/10 , D06M11/46 , D06M11/45 , D06M11/44 , C09D109/00 , D06M15/233
CPC classification number: H05K1/0306 , C03C25/1095 , C03C25/47 , C08K3/22 , C08K2003/222 , C08K2003/2227 , C08K2003/2241 , C09D109/00 , C09D171/12 , D06M11/44 , D06M11/45 , D06M11/46 , D06M15/233 , D06M15/53 , D06M23/10 , D06M2101/00 , H05K1/024 , H05K1/0366 , H05K1/0373 , H05K3/381
Abstract: The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.
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9.发明申请公开(公告)号：US20200207899A1
公开(公告)日：2020-07-02
申请号：US16633012
申请日：2017-11-02
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe SU , Zhongqiang YANG
Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
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10.发明申请公开(公告)号：US20180112133A1
公开(公告)日：2018-04-26
申请号：US15475471
申请日：2017-03-31
Applicant: Shengyi Technology Co., Ltd.
Inventor： Yongzhen WANG , Yueshan HE , Zhongqiang YANG , Yongjing XU
CPC classification number: C09K21/12 , B32B15/092 , B32B27/20 , B32B37/06 , B32B2305/076 , B32B2307/3065 , B32B2383/00 , C07F9/659 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08K3/22 , C08K3/36 , C08K5/5399 , C08K5/5406 , C08K5/5442 , C08K2003/2206 , C08K2003/2227 , C08L27/02 , C08L2201/02 , D06M15/673 , C08L63/00
Abstract: The present invention provides a siloxane-modified cyclotriphosphazene halogen-free flame retardant, and a preparation method and a use thereof. The siloxane-modified cyclotriphosphazene halogen-free flame retardant has the structural formula as shown in Formula I. In the siloxane-modified cyclotriphosphazene halogen-free flame retardant of the present invention, three kinds of structures of siloxane, aryl phosphorus oxygen compound and cyclotriphosphazene are built in one molecular formula, which combines the advantages of three structures, improves the compatibility between the flame retardant and resins, has a high flame retardant efficiency and a better char formation and can greatly increase the flame retardancy and stability of resin cured products.
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