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    Electronic component built-in substrate and electronic component device
    1.
    发明授权
    Electronic component built-in substrate and electronic component device 有权

    公开(公告)号：US10264681B2

    公开(公告)日：2019-04-16

    申请号：US15632706

    申请日：2017-06-26

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Kenji Kawai

    IPC: H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H01L23/13 ,  H01L23/14 ,  H01L23/15 ,  H01L23/538

    Abstract: A substrate includes a core substrate; a cavity formed on an upper surface side of the core substrate; a bottom plate of the cavity formed integrally with the core substrate; a through-hole formed in the bottom plate, a component mounting portion formed at a portion of the bottom plate, an electronic component mounted on the component mounting portion so as to be disposed inside the cavity; a first insulating layer formed on an upper surface of the core substrate so as to cover an upper surface of the electronic component; and a second insulating layer formed on a lower surface of the core substrate so as to fill the through-hole and cover a lower surface of the electronic component. The cavity is filled with the first insulating layer and the second insulating layer. The first insulating layer and the second insulating layer are formed of the same insulating resin.

    Wiring substrate and method of making wiring substrate
    3.
    发明授权
    Wiring substrate and method of making wiring substrate 有权
    接线基板及制作布线基板的方法

    公开(公告)号：US09560768B2

    公开(公告)日：2017-01-31

    申请号：US14634972

    申请日：2015-03-02

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Yasuhiko Kusama ,  Hideyuki Tako ,  Kenji Kawai ,  Fumihisa Miyasaka

    IPC: H05K1/16 ,  H05K1/18 ,  H05K3/46

    CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15313 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09972

    Abstract: A wiring substrate includes a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, the projecting part being situated at a border that divides a plurality of areas in the hole, a plurality of electronic components disposed in the areas, respectively, the electronic components being arranged at a spaced interval with the projecting part therebetween, and a resin layer filling the hole and supporting the electronic components, wherein a thickness of the projecting part in the thickness direction of the core layer decreases toward a tip of the projecting part.

    Abstract translation: 布线基板包括芯层，该芯层在其厚度方向上具有贯穿其中的孔，并且具有从孔的内壁朝向孔的内部空间突出的突出部分，突出部分位于边界处， 所述孔中的多个区域，分别设置在所述区域中的多个电子部件，所述电子部件以与所述突出部分间隔的间隔布置，以及填充所述孔并支撑所述电子部件的树脂层，其中， 在芯层的厚度方向上的突出部分朝向突出部分的尖端减小。

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