-
公开(公告)号:US20130235543A1
公开(公告)日:2013-09-12
申请号:US13873504
申请日:2013-04-30
发明人: Junichi Nakamura , Yuji Kobayashi
IPC分类号: H05K1/11
CPC分类号: H05K1/115 , H01L21/4857 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/97 , H01L2221/68345 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/81001 , H01L2224/81192 , H01L2224/81801 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H05K1/116 , H05K3/205 , H05K3/28 , H05K3/3473 , H05K3/4007 , H05K3/421 , H05K3/423 , H05K3/4644 , H05K2201/0376 , H05K2201/09481 , H05K2201/0949 , H05K2201/09509 , H05K2203/0338 , H05K2203/0361 , H05K2203/1536 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board within the opening portion, and the plating resist layer, when used, is removed. An insulating layer is formed on the electrode, as well as the support board or solder resist layer, and a wiring portion connected to the electrode at the insulating layer is also formed. A solder resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer. Another solder resist layer having an opening portion may then be formed on the exposed surface of the insulating layer.
摘要翻译: 制造布线板的方法包括在支撑板上形成限定开口部分的焊料或电镀抗蚀剂层的抗蚀剂层,使得支撑板的一部分露出。 电极直接形成在开口部内的支撑板上,当使用时,电镀抗蚀剂层被去除。 在电极以及支撑板或阻焊层上形成绝缘层,并且还形成连接到绝缘层处的电极的布线部分。 然后在布线部分上形成具有开口部分的阻焊层,并且去除支撑板以暴露电极的表面或电极和绝缘层的表面。 然后可以在绝缘层的暴露表面上形成具有开口部分的另一阻焊层。
-
公开(公告)号:US09155195B2
公开(公告)日:2015-10-06
申请号:US13873504
申请日:2013-04-30
发明人: Junichi Nakamura , Yuji Kobayashi
IPC分类号: H05K1/11 , H05K7/10 , H01L21/48 , H01L21/683 , H01L23/498 , H05K3/40 , H05K3/42 , H01L21/56 , H01L23/00 , H05K3/20 , H05K3/28 , H05K3/34 , H05K3/46
CPC分类号: H05K1/115 , H01L21/4857 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/97 , H01L2221/68345 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/81001 , H01L2224/81192 , H01L2224/81801 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H05K1/116 , H05K3/205 , H05K3/28 , H05K3/3473 , H05K3/4007 , H05K3/421 , H05K3/423 , H05K3/4644 , H05K2201/0376 , H05K2201/09481 , H05K2201/0949 , H05K2201/09509 , H05K2203/0338 , H05K2203/0361 , H05K2203/1536 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board within the opening portion, and the plating resist layer, when used, is removed. An insulating layer is formed on the electrode, as well as the support board or solder resist layer, and a wiring portion connected to the electrode at the insulating layer is also formed. A solder resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer. Another solder resist layer having an opening portion may then be formed on the exposed surface of the insulating layer.
摘要翻译: 制造布线板的方法包括在支撑板上形成限定开口部分的焊料或电镀抗蚀剂层的抗蚀剂层,使得支撑板的一部分露出。 电极直接形成在开口部内的支撑板上,当使用时,电镀抗蚀剂层被去除。 在电极以及支撑板或阻焊层上形成绝缘层,并且还形成连接到绝缘层处的电极的布线部分。 然后在布线部分上形成具有开口部分的阻焊层,并且去除支撑板以暴露电极的表面或电极和绝缘层的表面。 然后可以在绝缘层的暴露表面上形成具有开口部分的另一阻焊层。
-