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公开(公告)号：US09538664B2
公开(公告)日：2017-01-03
申请号：US14104282
申请日：2013-12-12
CPC分类号： H05K3/0035 , H05K1/0366 , H05K3/0038 , H05K3/3436 , H05K3/4007 , H05K3/421 , H05K3/427 , H05K3/4652 , H05K2201/096 , H05K2201/09827 , H05K2203/0346
摘要： A wiring substrate includes a first wiring layer with a wiring pattern and a metal foil. A first insulating layer includes a first through hole having a first end facing the metal foil and a second end. A second wiring layer includes a first opening having a diameter smaller than the second end. A second insulating layer includes a second through hole having a third end facing the wiring pattern and a fourth end. A third wiring layer includes a second opening having a diameter smaller than the fourth end. A first via is filled in the first opening, the first through hole, and a first recess, in the metal foil, having a diameter greater than the first end. A second via is filled in the second opening, the second through hole, and a second recess, in the wiring pattern, having a diameter greater than the third end.
摘要翻译： 布线基板包括具有布线图案的第一布线层和金属箔。 第一绝缘层包括具有面向金属箔的第一端和第二端的第一通孔。 第二布线层包括直径小于第二端的第一开口。 第二绝缘层包括具有面向布线图案的第三端和第四端的第二通孔。 第三布线层包括直径小于第四端的第二开口。 第一通孔被填充在金属箔中的第一开口，第一通孔和第一凹部中，其具有大于第一端的直径。 第二通孔填充在布线图案中的第二开口，第二通孔和第二凹槽中，其直径大于第三端。
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公开(公告)号：US20160044792A1
公开(公告)日：2016-02-11
申请号：US14922972
申请日：2015-10-26
CPC分类号： H05K3/188 , C25D5/022 , H01L21/4857 , H01L21/6835 , H01L23/13 , H01L23/49822 , H01L23/544 , H01L24/16 , H01L24/81 , H01L2221/68345 , H01L2221/68381 , H01L2223/54426 , H01L2223/54486 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/92125 , H01L2924/12042 , H01L2924/15311 , H05K1/113 , H05K3/0017 , H05K3/46 , H05K3/4682 , H05K2201/0376 , H05K2201/09036 , H05K2203/0369 , H05K2203/0376 , H05K2203/06 , Y10T29/49155 , H01L2924/00
摘要： A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.
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公开(公告)号：US09257373B2
公开(公告)日：2016-02-09
申请号：US14170900
申请日：2014-02-03
发明人： Junichi Nakamura , Kotaro Kodani , Michiro Ogawa
IPC分类号： H05K1/00 , H05K1/02 , H05K3/46 , H01L23/495 , H01L23/498 , H01L23/00 , H05K3/00 , H05K3/28
CPC分类号： H01L23/49544 , H01L23/49822 , H01L24/97 , H01L2224/16 , H01L2224/16235 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H05K1/0271 , H05K3/0052 , H05K3/284 , H05K3/4682 , H05K2201/09136 , H05K2201/09681 , H05K2201/09781 , H05K2201/2009 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective.
摘要翻译： 布线基板包括布线形成区域，其中堆叠多个布线层，同时夹着绝缘层;外周区域布置在布线形成区域周围，并且其中加强图案形成在与每个布线形成区域相同的层中 接线层。 增强图案与外周区域的面积比和布线层与布线形成区域的面积比在各层中基本相同，并且当外围区域中没有间隙时，增强图案在外周区域中不存在间隙 接线板以平面视角观看。
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4.发明授权公开(公告)号：US10943857B2
公开(公告)日：2021-03-09
申请号：US16051878
申请日：2018-08-01
IPC分类号： H01L23/495 , H01L21/48 , H01L23/00 , H01L21/683 , H01L23/31
摘要： A substrate for semiconductor elements includes a terminal part including a first surface, a second surface opposite to the first surface, and side surfaces joining the first surface and the second surface, and a resin part covering the side surfaces and exposing the first surface of the terminal part. The resin part has a multi-layer structure including a first resin and a second resin, and the first resin is provided in contact with the side surfaces of the terminal part. The first resin and the second resin include a filler, and an amount of the filler included in the first resin is smaller than an amount of the filler included in the second resin.
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公开(公告)号：US10117336B2
公开(公告)日：2018-10-30
申请号：US14922972
申请日：2015-10-26
IPC分类号： H05K3/02 , H05K3/10 , H05K3/18 , H05K1/11 , H05K3/46 , H01L23/00 , H01L23/544 , H01L21/683 , H01L23/13 , H01L23/498 , H01L21/48 , C25D5/02 , H05K3/00
摘要： A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.
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公开(公告)号：US20130314886A1
公开(公告)日：2013-11-28
申请号：US13892402
申请日：2013-05-13
IPC分类号： H05K1/11
CPC分类号： H05K1/112 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15174 , H01L2924/15311 , H05K1/113 , H05K3/205 , H05K3/4007 , H05K2201/0338 , H05K2201/0367 , H05K2203/0113 , H01L2924/00
摘要： A wiring board includes an insulating layer; a connection part provided on a surface of the insulating layer, the connection part including a first plating layer including a flat surface and a curved surface continuous with the flat surface, wherein the flat surface and the curved surface are exposed on the insulating layer, and an end portion of the curved surface is in contact with the surface of the insulating layer; and a second plating layer formed on an interior surface of the first plating layer so as to be coated with the first plating layer; and a via formed in the insulating layer so as to be connected to the second plating layer.
摘要翻译： 布线板包括绝缘层; 所述连接部设置在所述绝缘层的表面上，所述连接部包括包括平坦表面的第一镀层和与所述平坦表面连续的弯曲表面，其中所述平坦表面和所述弯曲表面暴露在所述绝缘层上，以及 弯曲表面的端部与绝缘层的表面接触; 以及第二镀层，形成在所述第一镀层的内表面上以被涂覆有所述第一镀层; 以及形成在绝缘层中以与第二镀层连接的通孔。
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公开(公告)号：US09137896B2
公开(公告)日：2015-09-15
申请号：US14021110
申请日：2013-09-09
CPC分类号： H05K1/0298 , H05K3/108 , H05K3/4682 , H05K2201/09563 , H05K2203/0152
摘要： A wiring substrate includes a first insulating layer, an adhesion insulating layer formed under the first insulating layer and an outer face of the adhesion insulating layer is made to a roughened face, a first wiring layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer, and in which a first via hole reaching the first wiring layer is provided, a second wiring layer formed on the second insulating layer, and connected to the first wiring layer through the first via hole, a second via hole formed in the adhesion insulating layer and the first insulating layer, and reaching the first wiring layer, and a third wiring layer formed on the outer face of the adhesion insulating layer, and connected to the first wiring layer through the second via hole.
摘要翻译： 布线基板包括第一绝缘层，形成在第一绝缘层下方的粘合绝缘层和粘合绝缘层的外表面，粗糙面，形成在第一绝缘层上的第一布线层，第二绝缘层 形成在第一绝缘层上，并且其中设置有到达第一布线层的第一通孔，形成在第二绝缘层上的第二布线层，并且通过第一通孔连接到第一布线层，第二通孔 形成在所述粘合绝缘层和所述第一绝缘层中，并到达所述第一布线层，以及形成在所述粘合绝缘层的外表面上的第三布线层，并且通过所述第二通孔与所述第一布线层连接。
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8.发明授权公开(公告)号：US08673744B2
公开(公告)日：2014-03-18
申请号：US13911259
申请日：2013-06-06
IPC分类号： H01L21/00
CPC分类号： H05K3/10 , H01L21/4857 , H01L21/6835 , H01L23/49822 , H01L23/544 , H01L24/81 , H01L2221/68345 , H01L2223/54426 , H01L2223/54486 , H01L2224/16235 , H01L2224/16237 , H01L2224/81132 , H01L2224/81193 , H01L2224/81385 , H01L2224/82385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/351 , H05K1/0269 , H05K3/205 , H05K3/3436 , H05K3/4682 , H05K2201/09918 , H05K2203/025 , H05K2203/0361 , H05K2203/1152 , Y10T29/49155 , H01L2924/00
摘要： A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess.
摘要翻译： 所公开的布线基板包括绝缘层，形成在绝缘层的表面上的凹部和形成在凹部内部的对准标记，其中对准标记的表面被粗糙化，从绝缘层的表面凹陷， 从凹槽露出。
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9.发明授权Wiring substrate, method for manufacturing the wiring substrate, and semiconductor package 有权布线基板，布线基板的制造方法以及半导体封装公开(公告)号：US09232642B2
公开(公告)日：2016-01-05
申请号：US13936443
申请日：2013-07-08
IPC分类号： H01L23/373 , H05K1/02 , H01L23/48 , H01L25/10 , H05K3/46 , H01L23/14 , H01L23/498 , H01L23/485
CPC分类号： H05K1/0298 , H01L23/145 , H01L23/373 , H01L23/3731 , H01L23/3733 , H01L23/3735 , H01L23/48 , H01L23/485 , H01L23/49822 , H01L25/105 , H01L2224/13111 , H01L2224/16238 , H01L2224/32225 , H01L2224/48091 , H01L2224/48229 , H01L2224/73204 , H01L2225/1023 , H01L2225/1058 , H05K3/4682 , H05K2201/068 , H05K2201/096 , H01L2924/00014 , H01L2224/16225 , H01L2924/00 , H01L2924/01047 , H01L2924/01029
摘要： A wiring substrate includes an insulating layer including a reinforcement member and having a first surface and a second surface positioned on an opposite side of the first surface, an electrode pad exposed from the first surface, a layered body including first insulating layers and being formed on the second surface, the first insulating layers having a first insulating material as a main component, another layered body including second insulating layers and being formed on the layered body, the second insulating layers having a second insulating material as a main component, and another electrode pad exposed from a surface of the another layered body that is opposite to the layered body. The number of the first insulating layers is equal to that of the second insulating layers. The first insulating layers have a thermal expansion coefficient that is greater than that of the second insulating layers.
摘要翻译： 布线基板包括绝缘层，该绝缘层包括加强构件，并且具有位于第一表面的相反侧的第一表面和第二表面，从第一表面暴露的电极焊盘，包括第一绝缘层并且形成在 所述第二表面，所述第一绝缘层具有第一绝缘材料作为主要成分，所述第二绝缘层包括第二绝缘层，并且形成在所述层叠体上，所述第二绝缘层具有第二绝缘材料作为主要成分， 衬垫从与层状体相对的另一分层体的表面露出。 第一绝缘层的数量等于第二绝缘层的数量。 第一绝缘层的热膨胀系数大于第二绝缘层的热膨胀系数。
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公开(公告)号：US09155195B2
公开(公告)日：2015-10-06
申请号：US13873504
申请日：2013-04-30
发明人： Junichi Nakamura , Yuji Kobayashi
IPC分类号： H05K1/11 , H05K7/10 , H01L21/48 , H01L21/683 , H01L23/498 , H05K3/40 , H05K3/42 , H01L21/56 , H01L23/00 , H05K3/20 , H05K3/28 , H05K3/34 , H05K3/46
CPC分类号： H05K1/115 , H01L21/4857 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/97 , H01L2221/68345 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/81001 , H01L2224/81192 , H01L2224/81801 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H05K1/116 , H05K3/205 , H05K3/28 , H05K3/3473 , H05K3/4007 , H05K3/421 , H05K3/423 , H05K3/4644 , H05K2201/0376 , H05K2201/09481 , H05K2201/0949 , H05K2201/09509 , H05K2203/0338 , H05K2203/0361 , H05K2203/1536 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board within the opening portion, and the plating resist layer, when used, is removed. An insulating layer is formed on the electrode, as well as the support board or solder resist layer, and a wiring portion connected to the electrode at the insulating layer is also formed. A solder resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer. Another solder resist layer having an opening portion may then be formed on the exposed surface of the insulating layer.
摘要翻译： 制造布线板的方法包括在支撑板上形成限定开口部分的焊料或电镀抗蚀剂层的抗蚀剂层，使得支撑板的一部分露出。 电极直接形成在开口部内的支撑板上，当使用时，电镀抗蚀剂层被去除。 在电极以及支撑板或阻焊层上形成绝缘层，并且还形成连接到绝缘层处的电极的布线部分。 然后在布线部分上形成具有开口部分的阻焊层，并且去除支撑板以暴露电极的表面或电极和绝缘层的表面。 然后可以在绝缘层的暴露表面上形成具有开口部分的另一阻焊层。
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