Abstract:
An array substrate and a display apparatus including the array substrate are provided. The array substrate includes a substrate divided into a display area and a peripheral area adjacent to the display area. A pixel array is formed on the substrate corresponding to the display area and receives a driving signal. A driving circuit includes a plurality of stages and is formed on the substrate corresponding to the peripheral area. Each of the stages includes a first transistor having a source electrode connected to an output terminal to output the driving signal, a channel layer formed between a gate insulating layer and the source electrode, the channel layer having an opening to facilitate contact between a portion of the gate insulating layer and the source electrode, and a capacitor defined by a gate electrode of the first transistor, the source electrode, and the gate insulating layer contacting the source electrode.
Abstract:
A method of manufacturing a roll type imprint master mold including disposing a base layer on a substrate including a first area and a second area adjacent to the first area, disposing an inorganic insulation layer on the base layer, forming a first mask pattern and a first resin pattern in the first area, forming a pattern layer by etching the inorganic insulation layer using the first resin and the first mask patterns as a mask, removing the first resin and the first mask patterns, forming a second mask pattern and a second resin pattern in the second area, forming a pattern layer by etching the inorganic insulation layer using the second resin and the second mask patterns as a mask, removing the second resin and the second mask patterns, separating the base layer from the substrate, and attaching the base layer onto a roll body.
Abstract:
A backlight assembly includes a plurality of point light sources, a light guide plate (“LGP”) and a printed circuit board (“PCB”). The LGP has a light incident face in which light is incident, a side surface extending from an edge portion of the light incident face, and a fixing groove which is formed from the side surface toward an inner portion thereof. The PCB includes a point light source disposing portion in which the point light sources are disposed along a first direction, an extending portion extending from the point light disposing portion along a second direction substantially perpendicular to the first direction, and a protrusion which is fixed at an end portion of the extending portion. The protrusion of the PCB is coupled with the fixing groove of the LGP.
Abstract:
A photosensitive resin composition includes: an acrylic copolymer comprising a polymerization product of a first monomer comprising at least one selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a second monomer comprising an olefin-based unsaturated compound; a photosensitive component comprising at least one 1,2-quinonediazide-5-sulfonic acid ester compound selected from compounds represented by Chemical Formulae 1 to 4; a coupling agent; and a solvent, wherein a total amount of asymmetric compounds in the photosensitive component is greater than or equal to 45 area percent as determined by high performance liquid chromatography: wherein R1 is a hydroxyl group or a methyl group, and NQD is a 1,2-quinonediazide 5-sulfonyl group.
Abstract:
A backlight assembly includes a plurality of point light sources, a light guide plate (“LGP”) and a printed circuit board (“PCB”). The LGP has a light incident face in which light is incident, a side surface extending from an edge portion of the light incident face, and a fixing groove which is formed from the side surface toward an inner portion thereof. The PCB includes a point light source disposing portion in which the point light sources are disposed along a first direction, an extending portion extending from the point light disposing portion along a second direction substantially perpendicular to the first direction, and a protrusion which is fixed at an end portion of the extending portion. The protrusion of the PCB is coupled with the fixing groove of the LGP.
Abstract:
A backlight assembly includes a plurality of point light sources, a light guide plate (“LGP”) and a printed circuit board (“PCB”). The LGP has a light incident face in which light is incident, a side surface extending from an edge portion of the light incident face, and a fixing groove which is formed from the side surface toward an inner portion thereof. The PCB includes a point light source disposing portion in which the point light sources are disposed along a first direction, an extending portion extending from the point light disposing portion along a second direction substantially perpendicular to the first direction, and a protrusion which is fixed at an end portion of the extending portion. The protrusion of the PCB is coupled with the fixing groove of the LGP.
Abstract:
An array substrate and a display apparatus including the array substrate are provided. The array substrate includes a substrate divided into a display area and a peripheral area adjacent to the display area. A pixel array is formed on the substrate corresponding to the display area and receives a driving signal. A driving circuit includes a plurality of stages and is formed on the substrate corresponding to the peripheral area. Each of the stages includes a first transistor having a source electrode connected to an output terminal to output the driving signal, a channel layer formed between a gate insulating layer and the source electrode, the channel layer having an opening to facilitate contact between a portion of the gate insulating layer and the source electrode, and a capacitor defined by a gate electrode of the first transistor, the source electrode, and the gate insulating layer contacting the source electrode.
Abstract:
A photosensitive resin composition includes: a) an acryl-based copolymer obtained by copolymerizing i) a hydroxyl group-containing unsaturated compound; ii) an unsaturated carboxylic acid, an unsaturated carboxylic anhydride, or a mixture thereof; iii) an epoxy group-containing unsaturated compound; and iv) an olefin-based unsaturated compound, b) a 1,2-quinonediazide 5-sulfonic ester compound having a phenol compound including a compound represented by the above Chemical Formula A as ballast, c) a silane coupling agent, and d) a solvent.
Abstract:
A positive photosensitive siloxane resin composition includes a) a siloxane copolymer obtained by performing hydrolysis and condensation polymerization of i) at least one reactive silane represented by the following Chemical Formula 1 and ii) at least one 4-functional reactive silane represented by the following Chemical Formula 2 under a catalyst, the copolymer having a polystyrene-converted weight average molecular weight Mw of 1,000 to 20,000, b) a 1,2-quinonediazide compound, and c) a solvent, (R1)nSi(R2)4-n [Chemical Formula 1] Si(R3)4 [Chemical Formula 2] wherein R1s may each independently be any one of an alkyl group having 1 to 10 carbon atoms and an aryl group having 6 to 15 carbon atoms, R2 may be an alkoxy group having 1 to 4 carbon atoms, phenoxy, or acetoxy, R3s may each independently be any one of an alkoxy group having 1 to 4 carbon atoms, phenoxy, or an acetoxy group, and n may be a natural number of 1 to 3.