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公开(公告)号:US11984537B2
公开(公告)日:2024-05-14
申请号:US17188783
申请日:2021-03-01
发明人: Su Bin Bae , Yun Jong Yeo , Jung Yun Jo
CPC分类号: H01L33/387 , H01L33/405 , H01L33/42 , H01L33/502 , H01L33/62
摘要: A display device includes a substrate; a first circuit part and a second circuit part on the substrate and spaced from each other in a first direction; and an emission part between the first circuit part and the second circuit part, the emission part being located between the first circuit part and the second circuit part in a direction parallel to the substrate, wherein the first circuit part includes a first electrode extending to the emission part, wherein the second circuit part includes a second electrode extending to the emission part, and wherein the emission part includes a light emitting element located between the first electrode and the second electrode.
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公开(公告)号:US11127724B2
公开(公告)日:2021-09-21
申请号:US16691495
申请日:2019-11-21
发明人: Su Bin Bae , Yu Gwang Jeong , Shin Il Choi , Joon Geol Lee , Sang Gab Kim
IPC分类号: H01L21/306 , H01L25/16 , H01L33/20 , H01L33/44 , H01L33/54 , H01L33/62 , H01L25/075 , H01L33/00 , H01L27/12
摘要: A light emitting diode device includes a thin film transistor substrate having a plurality of light emitting areas, a first diode electrode and a second diode electrode on the thin film transistor substrate, a first passivation pattern between the first diode electrode and the second diode electrode, a plurality of micro light emitting diodes on the first passivation pattern, a first bridge pattern on the micro light emitting diodes and electrically connecting the first diode electrode to the micro light emitting diodes, and a second bridge pattern on the first bridge pattern and electrically connecting the second diode electrode to the micro light emitting diodes, wherein each sidewall of each of the micro light emitting diodes and each sidewall of the first passivation pattern form a same plane.
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公开(公告)号:US09978777B2
公开(公告)日:2018-05-22
申请号:US15392888
申请日:2016-12-28
发明人: Tae An Seo , Su Bin Bae , Yu-Gwang Jeong , Hyun Min Cho , Shin Il Choi , Jin Hwan Choi
IPC分类号: H01L27/12 , H01L29/66 , H01L29/786
CPC分类号: H01L27/1225 , H01L27/124 , H01L27/1288 , H01L29/66969 , H01L29/7869
摘要: A TFT array panel of a display device includes a first substrate, a first electrode disposed on the first substrate, a first insulating layer including a first hole, the first insulating layer disposed on the first electrode, a second insulating layer disposed on the first insulating layer and including a second hole corresponding to the first hole, and a capping layer including a first inner portion, the capping layer disposed on an inner lateral surface forming the second hole, where an end portion of the first inner portion disposed in the second hole is separated from the first electrode.
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公开(公告)号:US09691795B2
公开(公告)日:2017-06-27
申请号:US15175839
申请日:2016-06-07
发明人: Jung Yun Jo , Su Bin Bae , Sang Hyeon Song , Cheol Geun An
CPC分类号: H01L27/124 , G06F3/0416 , G06F2203/04103 , H01L27/1262
摘要: An exemplary embodiment of the described technology relates generally to a display apparatus including a plurality of pixels and corresponding to one area of a substrate for displaying an image, and a pad area corresponding to another area of the substrate, the pad area including a lower electrode configured to transmit an electric signal to the pixels, and a plurality of pad electrodes electrically connecting the lower electrode and a driving chip, wherein each of the pad electrodes includes a first contact surface for contacting the lower electrode, a second contact surface for contacting the driving chip, and an oxide layer on a surface of the pad electrode that is exposed to the outside, and that connects the first contact surface and the second contact surface.
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公开(公告)号:US11276580B2
公开(公告)日:2022-03-15
申请号:US16296646
申请日:2019-03-08
发明人: Su Bin Bae , Yu-Gwang Jeong , Shin Il Choi , Sang Gab Kim , Joon Geol Lee
IPC分类号: H01L29/41 , H01L21/311 , H01L21/027 , H01L21/768 , H01L21/763
摘要: A connecting structure of a conductive layer includes a first conductive layer, a first insulating layer disposed on the first conductive layer and including a first opening overlapping the first conductive layer, a connecting conductor disposed on the first insulating layer and connected to the first conductive layer through the first opening, an insulator island disposed on the connecting conductor, a second insulating layer disposed on the first insulating layer and including a second opening overlapping the connecting conductor and the insulator island, and a second conductive layer disposed on the second insulating layer and connected to a connecting electrode through the second opening. A sum of a thickness of the first insulating layer and a thickness of the second insulating layer is greater than or equal to 1 μm, and each of the thicknesses of the first and second insulating layers is less than 1 μm.
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公开(公告)号:US11127807B2
公开(公告)日:2021-09-21
申请号:US16521394
申请日:2019-07-24
发明人: Sang Gab Kim , Hyun Min Cho , Tae Sung Kim , Yu-Gwang Jeong , Su Bin Bae , Jin Seock Kim , Sang Gyun Kim , Hyo Min Ko , Kil Won Cho , Hansol Lee
摘要: An manufacturing method of a display device may include the following steps: forming a transistor on a substrate; forming an insulating layer on the transistor; forming a conductive layer including silver on the insulating layer; forming a photosensitive member on the conductive layer; forming an electrode of a light-emitting element by etching the conductive layer; performing plasma treatment on a structure that comprises the electrode, the plasma treatment using a gas including a halogen; and removing a product that is resulted from the plasma treatment.
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公开(公告)号:US10741589B2
公开(公告)日:2020-08-11
申请号:US16215520
申请日:2018-12-10
发明人: Yu-Gwang Jeong , Hyun Min Cho , Su Bin Bae , Shin Il Choi , Sang Gab Kim
IPC分类号: H01L27/12 , H01L21/311 , H01L29/417 , H01L29/786 , G02F1/1368 , H01L27/32
摘要: A transistor array panel is manufactured by a method that reduces or obviates the need for highly selective etching agents or complex processes requiring multiple photomasks to create contact holes. The panel includes: a substrate; a buffer layer positioned on the substrate; a semiconductor layer positioned on the buffer layer; an intermediate insulating layer positioned on the semiconductor layer; and an upper conductive layer positioned on the intermediate insulating layer, wherein the semiconductor layer includes a first contact hole, the intermediate insulating layer includes a second contact hole positioned in an overlapping relationship with the first contact hole, and the upper conductive layer is in contact with a side surface of the semiconductor layer in the first contact hole.
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公开(公告)号:US10014362B2
公开(公告)日:2018-07-03
申请号:US15263245
申请日:2016-09-12
发明人: Jung Yun Jo , Su Bin Bae , Jang-Kyum Kim , Jeong Do Yang , Chung-Seok Lee
CPC分类号: H01L27/3279 , H01L27/3276 , H01L51/0097 , H01L2251/5338
摘要: A display device is disclosed. In one aspect, the display device includes a substrate including a display area and a non-display area and an input wiring portion and an output wiring portion formed in the non-display area. The display device also includes a driver integrated circuit (IC) formed over the substrate and electrically connected to the input and output wiring portions. Each of the input and output wiring portions includes a metal layer and a metal carbide layer that covers the metal layer.
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公开(公告)号:US11740526B2
公开(公告)日:2023-08-29
申请号:US17713715
申请日:2022-04-05
发明人: Seon-Il Kim , Sung Won Cho , Sang Gab Kim , Su Bin Bae , Yu-Gwang Jeong , Dae Won Choi
IPC分类号: G02F1/1368 , G02F1/1362 , H10K50/842 , H10K59/131 , H10K71/00 , H10K59/12
CPC分类号: G02F1/1368 , G02F1/136286 , H10K50/8426 , H10K59/131 , H10K71/00 , G02F2202/28 , H10K59/1201
摘要: A display device includes a thin film transistor on a base substrate and a signal wiring electrically connected to the thin film transistor. The signal wiring includes a main conductive layer including copper, and a capping layer including titanium the capping layer overlapping a portion of an upper surface of the main conductive layer. The signal wiring has a taper angle in a range of about 70° to about 90°. A thickness of the capping layer is in a range of about 100 Å to about 300 Å, and a thickness of the main conductive layer is in a range of about 1,000 Å to about 20,000 Å.
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公开(公告)号:US10672799B2
公开(公告)日:2020-06-02
申请号:US15465154
申请日:2017-03-21
发明人: Yu Gwang Jeong , Su Bin Bae , Hyun Min Cho , Sang Gab Kim
IPC分类号: H01L51/50 , H01L29/786 , H01L27/12
摘要: A display device may include a substrate, an active pattern layer, a gate insulating layer, a first metal pattern layer, an interlayer insulating layer, a second metal pattern layer, and a passivation film. The active pattern layer may be disposed on the substrate. The gate insulating layer may be disposed on the active pattern layer. The first metal pattern layer may be disposed on the gate insulating layer. The interlayer insulating layer may be disposed on the first metal pattern layer. The second metal pattern layer may be disposed on the interlayer insulating layer. The passivation film may be disposed on the side wall of the second metal pattern layer.
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