Laminated ceramic electronic component and method of fabricating the same
    1.
    发明授权
    Laminated ceramic electronic component and method of fabricating the same 有权
    层压陶瓷电子部件及其制造方法

    公开(公告)号:US09202625B2

    公开(公告)日:2015-12-01

    申请号:US13678364

    申请日:2012-11-15

    Abstract: There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2≦D99/D50≦3 and 2≦D50/D1≦3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented.

    Abstract translation: 提供一种层叠陶瓷电子部件,其包括:包含电介质层的陶瓷体; 以及第一和第二内部电极,所述第一和第二内部电极彼此相对设置,所述陶瓷体内具有介电层,其中当1%的值被设置为D1时,50%的值被设置为D50, 在电介质层中的平均粒径为2& NlE; D99 / D50≦̸ 3和2≦̸ D50 / D1&nlE 3时,99%的电介质晶粒的累积分布设定为D99。 可以通过改善电介质层和内部电极之间的粘附力来实现高容量层叠陶瓷电子部件,并且可以实现改善的耐电压特性和优异的可靠性。

    Laminated ceramic electronic component having a cover layer with dielectric grains and method of fabricating the same
    2.
    发明授权
    Laminated ceramic electronic component having a cover layer with dielectric grains and method of fabricating the same 有权
    具有电介质晶粒的覆盖层的层叠陶瓷电子部件及其制造方法

    公开(公告)号:US09076596B2

    公开(公告)日:2015-07-07

    申请号:US13839781

    申请日:2013-03-15

    CPC classification number: H01G4/12 H01G4/1227 H01G4/30

    Abstract: There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied.

    Abstract translation: 提供层叠陶瓷电子部件及其制造方法。 层叠陶瓷电子部件包括:陶瓷体,其包括电介质层; 以及第一和第二内部电极,所述第一和第二内部电极彼此相对设置,所述陶瓷体在陶瓷体内具有介电层,其中所述陶瓷体包括作为电容形成部的有源层和形成为非电容形成部的覆盖层 在有源层的上表面和底面中的至少一个上,并且当陶瓷体的厚度为t且覆盖层的厚度为T时,满足T< 1l; t×0.05,并且当平均粒径 在有源层中的电介质晶粒为Da,并且覆盖层中的电介质晶粒的平均粒径为Dc,0.7≦̸ Dc / Da≦̸ 1.5。

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 审中-公开
    电子元器件及其制造方法

    公开(公告)号:US20130155573A1

    公开(公告)日:2013-06-20

    申请号:US13720405

    申请日:2012-12-19

    CPC classification number: H01G13/00 H01G4/0085 H01G4/12 H01G4/2325 H01G4/30

    Abstract: There is provided an electronic component including a ceramic sintered body having a plurality of internal electrodes formed therein, and external electrodes formed on an outer surface of the ceramic sintered body. Each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed on an outer surface of the electrode layer, and a tin (Sn) plating layer formed on an outer surface of the alloy layer.

    Abstract translation: 提供了一种电子部件,其包括形成有多个内部电极的陶瓷烧结体和形成在陶瓷烧结体的外表面上的外部电极。 每个外部电极包括与内部电极电连接的铜(Cu)电极层,形成在电极层的外表面上的铜(Cu) - 锡(Sn)合金层和锡(Sn)镀层 形成在合金层的外表面上。

Patent Agency Ranking