公开(公告)号：US11031185B2

公开(公告)日：2021-06-08

申请号：US15975131

申请日：2018-05-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Ryeol Kim ,  Bum Suk Kang ,  Hyo Min Kang ,  Hang Kyu Cho ,  Chang Hoon Kim

IPC: H01G4/232 ,  H01C1/148 ,  H01C7/18 ,  H01C17/28 ,  H01L41/047 ,  H01L41/293 ,  H01C7/00 ,  H01G4/30 ,  H01L41/273 ,  H01C7/10 ,  H01F17/00 ,  H01F27/29 ,  H01G4/12 ,  H01F27/28 ,  H01F37/00 ,  H01F41/10 ,  H01G4/008

Abstract: An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.

公开(公告)号：US09704648B2

公开(公告)日：2017-07-11

申请号：US14527400

申请日：2014-10-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Ho Lee ,  Myung Jun Park ,  Doo Young Kim ,  Chang Hoon Kim

IPC: H01G4/228 ,  H01G2/06 ,  H01G4/30 ,  H01G4/232 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G2/065 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer ceramic capacitor may include: a ceramic body having first and second main surfaces opposing each other in a thickness direction and first and second end surfaces opposing each other in a length direction, a thickness of the ceramic body being greater than a width thereof; a first external electrode disposed on the first end surface and having a greater thickness in a region thereof adjacent to the second main surface than in a region thereof adjacent to the first main surface; a second external electrode disposed on the second end surface and having a greater thickness in a region thereof adjacent to the second main surface than in a region thereof adjacent to the first main surface; and first and second internal electrodes disposed in the ceramic body and connected to the first and second external electrodes, respectively.

公开(公告)号：US09666369B2

公开(公告)日：2017-05-30

申请号：US15040237

申请日：2016-02-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Sung Park ,  Chan Hee Nam ,  Doo Young Kim ,  Seok Hyun Yoon ,  Du Won Choi ,  Chang Hoon Kim

IPC: C04B35/00 ,  H01G4/12 ,  H01G4/30 ,  C04B35/468 ,  C04B35/49

CPC classification number: H01G4/1218 ,  C04B35/4682 ,  C04B35/49 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3239 ,  C04B2235/3241 ,  C04B2235/3251 ,  C04B2235/3262 ,  C04B2235/3272 ,  C04B2235/3275 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3293 ,  C04B2235/3294 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/5436 ,  C04B2235/652 ,  C04B2235/6582 ,  C04B2235/781 ,  C04B2235/786 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/30

Abstract: There are provided a dielectric ceramic composition and a multilayer ceramic capacitor containing the same. The dielectric ceramic composition according to the present disclosure may contain a main base material ingredient and a first accessory ingredient, wherein the first accessory ingredient contains samarium (Sm) and other rare earth (RE) elements, and a ratio (a/b) of a content (a) of samarium (Sm) to a content (b) of other rare earth elements in the first accessory ingredient satisfies 0.1≦a/b≦2.0.

公开(公告)号：US09514882B2

公开(公告)日：2016-12-06

申请号：US13902587

申请日：2013-05-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byung Jun Jeon ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/012 ,  H01G4/232

CPC classification number: H01G4/12 ,  H01G4/005 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te≦0.6 μm, N>200, and 3 μm≦t

Abstract translation: 提供了一种多层陶瓷电子部件，其包括：形成有内部电极的陶瓷体; 形成在陶瓷体的外表面并与内部电极连接的外部电极; 以及在陶瓷体的内部方向上形成在内部电极和外部电极之间的接触表面上的缓冲层，其中当内部电极的厚度由Te表示时，层叠的数量 内部电极由N表示，缓冲层的厚度由t表示，陶瓷体的长度方向的边缘宽度由L表示，Te≤0.6μm，N> 200， 和3μm≤t

公开(公告)号：US09439301B2

公开(公告)日：2016-09-06

申请号：US13902521

申请日：2013-05-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byung Jun Jeon ,  Byoung Hwa Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Young Ghyu Ahn

IPC: H02H7/06 ,  H05K3/34 ,  H01G2/06 ,  H01G4/232

CPC classification number: H05K3/3442 ,  H01G2/065 ,  H01G4/232 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers.

Abstract translation: 提供一种多层芯片电子部件，其包括：陶瓷体，其包括内部电极和电介质层; 外部电极在长度方向覆盖陶瓷体的两端面; 形成外部电极并形成在陶瓷体的外表面上的第一镀层; 形成在第一镀层的外侧表面上的非导电层; 以及形成在除了非导电层之外的第一镀层的区域上的第二镀层。

公开(公告)号：US09336946B2

公开(公告)日：2016-05-10

申请号：US14335494

申请日：2014-07-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Ho Lee ,  Doo Young Kim ,  Chang Hoon Kim ,  Byung Soo Kim

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H05K3/34

CPC classification number: H01G4/012 ,  H01G2/065 ,  H01G4/005 ,  H01G4/008 ,  H01G4/1227 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/18 ,  H05K3/3442 ,  H05K2201/10015

Abstract: The present application describes a multilayer ceramic electronic component including a ceramic body having a thickness greater than a width and includes a dielectric layers, and has upper and lower surfaces opposing each other in a thickness direction. First and second side surfaces oppose each other in a width direction, and first and second end surfaces oppose each other in a length direction. First and second internal electrodes are stacked with at least one of the dielectric layers interposed therebetween within the ceramic body in the width direction. A volume increasing part is disposed in a lower portion of the ceramic body in the thickness direction to allow a volume of a lower margin portion of the ceramic body to be greater than that of an upper margin portion thereof.

Abstract translation: 本申请描述了一种多层陶瓷电子部件，其包括厚度大于宽度的陶瓷体，并且包括电介质层，并且具有在厚度方向上彼此相对的上表面和下表面。 第一和第二侧面在宽度方向上彼此相对，并且第一和第二端面在长度方向上彼此相对。 第一和第二内部电极在宽度方向上在陶瓷体内插入至少一个电介质层。 体积增加部分沿着厚度方向设置在陶瓷体的下部，以使陶瓷体的下边缘部分的体积大于其上边缘部分的体积。

公开(公告)号：US09251925B2

公开(公告)日：2016-02-02

申请号：US13935229

申请日：2013-07-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bum Suk Kang ,  Hew Young Kim ,  Jeong Ryeol Kim ,  Chang Hoon Kim ,  Dong Hoon Kim ,  Doo Young Kim

IPC: H01B1/22 ,  H01G4/30 ,  H01G4/232

CPC classification number: H01B1/22 ,  H01G4/2325 ,  H01G4/30

Abstract: There are provided a conductive paste for external electrodes and a multilayer ceramic electronic component using the same. The conductive paste includes a conductive metal powder including conductive metal particles; and a conductive amorphous metal powder including amorphous metal particles having a(Si, B)-b(Li, K)-c(V, Mn) in which a+b+c=100, 20≦a≦60, 10≦b≦40, and 2≦c≦25 are satisfied.

Abstract translation: 提供外部电极用导电性糊剂和使用其的多层陶瓷电子部件。 导电糊包括导电金属粉末，其包括导电金属颗粒; 和包含具有（Si，B）-b（Li，K）-c（V，Mn）的非晶态金属颗粒的导电非晶金属粉末，其中+ b + c = 100,20和nlE; a＆nlE; 60,10和nlE; b ; 40和2＆nlE; c＆nlE; 25。

公开(公告)号：US09076596B2

公开(公告)日：2015-07-07

申请号：US13839781

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok Hyun Yoon ,  Byoung Hwa Lee ,  Chang Hoon Kim ,  Sang Hoon Kwon

IPC: H01G4/12 ,  H01G4/30

CPC classification number: H01G4/12 ,  H01G4/1227 ,  H01G4/30

Abstract: There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied.

Abstract translation: 提供层叠陶瓷电子部件及其制造方法。 层叠陶瓷电子部件包括：陶瓷体，其包括电介质层; 以及第一和第二内部电极，所述第一和第二内部电极彼此相对设置，所述陶瓷体在陶瓷体内具有介电层，其中所述陶瓷体包括作为电容形成部的有源层和形成为非电容形成部的覆盖层 在有源层的上表面和底面中的至少一个上，并且当陶瓷体的厚度为t且覆盖层的厚度为T时，满足T＆lt; 1l; t×0.05，并且当平均粒径 在有源层中的电介质晶粒为Da，并且覆盖层中的电介质晶粒的平均粒径为Dc，0.7＆nlE; Dc / Da＆nlE; 1.5。

公开(公告)号：US09076578B2

公开(公告)日：2015-07-07

申请号：US13660527

申请日：2012-10-25

Applicant: Samsung Electro-mechanics Co., Ltd.

Inventor： Sung Hyung Kang ,  Du Won Choi ,  Min Sung Song ,  Sang Hoon Kwon ,  Chang Hoon Kim ,  Byoung Hwa Lee

IPC: H01L41/187 ,  H01C17/065 ,  H01B3/12 ,  H01G4/30 ,  H01C7/00 ,  H01G4/12 ,  C04B35/468 ,  H01C7/02 ,  H01C7/04

CPC classification number: H01C17/06533 ,  C04B35/4682 ,  C04B2235/3208 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3239 ,  C04B2235/3244 ,  C04B2235/3256 ,  C04B2235/3258 ,  C04B2235/3262 ,  C04B2235/3275 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/442 ,  C04B2235/5409 ,  C04B2235/785 ,  C04B2235/79 ,  H01B3/12 ,  H01C7/003 ,  H01C7/025 ,  H01C7/045 ,  H01G4/1227 ,  H01G4/30 ,  Y10T428/2982

Abstract: There is provided a dielectric composition, including; a base powder including BamTiO3 (0.995≦m≦1.010); a first sub-component including 0.05 to 4.00 moles of an oxide or carbonate containing at least one rare-earth element based on 100 moles of the base powder; a second sub-component including 0.05 to 0.70 moles of an oxide or carbonate containing at least one transition metal; a third sub-component including 0.20 to 2.00 moles of a Si oxide; a fourth sub-component including 0.02 to 1.00 mole of an Al oxide; and a fifth sub-component including 20 to 140% of an oxide containing at least one of Ba and Ca, based on the third sub-component.

Abstract translation: 提供介电组合物，包括： 包括BamTiO 3（0.995＆nlE; m＆amp; 1.0l）的基础粉末; 包含基于100摩尔基础粉末含有至少一种稀土元素的氧化物或碳酸酯的0.05至4.00摩尔的第一子组分; 含有0.05〜0.70摩尔含有至少一种过渡金属的氧化物或碳酸盐的第二子成分; 第三子成分，含有0.20〜2.00摩尔的Si氧化物; 第四副成分，含有0.02〜1.00摩尔的Al氧化物; 和包含20〜140％的含有Ba和Ca中的至少一种的氧化物的第五子成分，基于第三子成分。

公开(公告)号：US09042080B2

公开(公告)日：2015-05-26

申请号：US13727420

申请日：2012-12-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyo Jung Kim ,  Seok Hyun Yoon ,  Chang Hoon Kim ,  Byoung Hwa Lee ,  Sang Hoon Kwon

IPC: H01G4/06 ,  H01G4/30 ,  H01G4/12 ,  H01G13/00 ,  H01G4/008

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/12 ,  H01G4/1218 ,  H01G13/003 ,  Y10T156/10

Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (Dc) of ceramic grains in a cover area is smaller than an average diameter (Da) of ceramic grains in the active area, and when a thickness of the cover area is expressed by Tc, 9 um≦Tc≦25 um and Tc/Dc≧55 are satisfied. A multilayer ceramic capacitor having excellent moisture-resistance properties may be obtained.

Abstract translation: 提供了一种多层陶瓷电子部件及其制造方法。 这里，覆盖区域中的陶瓷晶粒的平均直径（Dc）小于有源区域中的陶瓷晶粒的平均直径（Da），并且当覆盖面积的厚度由Tc表示时，为9um＆amp; nlE; Tc＆nlE; 25um，Tc /Dc≥55。 可以获得具有优异的耐湿性的多层陶瓷电容器。