Abstract:
A vFET includes a first impurity region doped with first impurities at an upper portion of the substrate. A first diffusion control pattern is formed on the first impurity region. The first diffusion control pattern is configured to control the diffusion of the first impurities. A channel extends in a vertical direction substantially orthogonal to an upper surface of the substrate. A second impurity region is doped with second impurities on the channel. A second diffusion control pattern is between the channel and the second impurity region. The second diffusion control pattern is configured to control the diffusion of the second impurities. A gate structure is adjacent to the channel.
Abstract:
A display apparatus and a controlling method thereof are provided. The controlling method of a display apparatus includes displaying a mode conversion user interface (UI) that provides a guideline to enter a motion task mode; recognizing a first motion that corresponds to the guideline; entering the motion task mode that enables a second motion to control a function of the display apparatus in response to the first motion being recognized while the guideline is displayed on the display apparatus; and displaying a motion task UI to perform the motion task mode.
Abstract:
A vFET includes a first impurity region doped with first impurities at an upper portion of the substrate. A first diffusion control pattern is formed on the first impurity region. The first diffusion control pattern is configured to control the diffusion of the first impurities. A channel extends in a vertical direction substantially orthogonal to an upper surface of the substrate. A second impurity region is doped with second impurities on the channel. A second diffusion control pattern is between the channel and the second impurity region. The second diffusion control pattern is configured to control the diffusion of the second impurities. A gate structure is adjacent to the channel.
Abstract:
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a multi-channel active pattern including germanium and an inner region and an outer region, the outer region formed along a profile of the inner region, and a germanium fraction of the outer region being smaller than a germanium fraction of the inner region. A gate electrode intersects the multi-channel active pattern.
Abstract:
A semiconductor device includes a first semiconductor pattern doped with first impurities on a substrate, a first channel pattern on the first semiconductor pattern, second semiconductor patterns doped with second impurities contacting upper edge surfaces, respectively, of the first channel pattern, and a first gate structure surrounding at least a portion of a sidewall of the first channel pattern.
Abstract:
A line memory device includes a plurality of memory cells, a data line pair, a sense amplifier and an output unit. The plurality of memory cells are disposed adjacent to each other in a line. The data line pair is coupled to the memory cells to sequentially transfer memory data bits stored in the memory cells to the sense amplifier. The sense amplifier is configured to amplify the memory data bits that are sequentially transferred through the data line pair by corresponding delay times which are different from each other. The output unit samples an output of the sense amplifier to sequentially output retimed data bits of the memory data bits in response to a read clock signal. The read clock signal has a cyclic period which is less than a maximum delay time among the delay times.
Abstract:
A method of forming a semiconductor device includes sequentially forming a hard mask layer and a first sacrificial layer on a substrate, forming a first mandrel on the first sacrificial layer, forming a first spacer on both sidewalls of the first mandrel, removing the first mandrel, forming a second mandrel by etching the first sacrificial layer using the first spacer as an etch mask, forming a second spacer on both sidewalls of the second mandrel, removing the second mandrel, forming a hard mask pattern by patterning the hard mask layer using the second spacer as an etch mask, the hard mask pattern including first to ninth fin-type mask patterns extending to be parallel with each other in a first direction and sequentially spaced apart from each other in a second direction perpendicular to the first direction, removing the third, fifth and seventh fin-type mask patterns, forming first to sixth active patterns by etching the substrate using the hard mask pattern as an etch mask, and forming a first gate electrode extending in the second direction to intersect the first to fourth active patterns and a second gate electrode extending in the second direction to intersect the third to sixth active patterns and spaced apart from the first gate electrode in the first direction without intersecting the first and second active patterns.
Abstract:
A line memory device includes a plurality of memory cells, a data line pair, a sense amplifier and an output unit. The plurality of memory cells are disposed adjacent to each other in a line. The data line pair is coupled to the memory cells to sequentially transfer memory data bits stored in the memory cells to the sense amplifier. The sense amplifier is configured to amplify the memory data bits that are sequentially transferred through the data line pair by corresponding delay times which are different from each other. The output unit samples an output of the sense amplifier to sequentially output retimed data bits of the memory data bits in response to a read clock signal. The read clock signal has a cyclic period which is less than a maximum delay time among the delay times.
Abstract:
A method of forming a semiconductor device includes sequentially forming a hard mask layer and a first sacrificial layer on a substrate, forming a first mandrel on the first sacrificial layer, forming a first spacer on both sidewalls of the first mandrel, removing the first mandrel, forming a second mandrel by etching the first sacrificial layer using the first spacer as an etch mask, forming a second spacer on both sidewalls of the second mandrel, removing the second mandrel, forming a hard mask pattern by patterning the hard mask layer using the second spacer as an etch mask, the hard mask pattern including first to ninth fin-type mask patterns extending to be parallel with each other in a first direction and sequentially spaced apart from each other in a second direction perpendicular to the first direction, removing the third, fifth and seventh fin-type mask patterns, forming first to sixth active patterns by etching the substrate using the hard mask pattern as an etch mask, and forming a first gate electrode extending in the second direction to intersect the first to fourth active patterns and a second gate electrode extending in the second direction to intersect the third to sixth active patterns and spaced apart from the first gate electrode in the first direction without intersecting the first and second active patterns.
Abstract:
A counter circuit includes a first counter and a second counter. The first counter is configured to count a first counter clock signal which toggles with a first frequency to generate upper (N−M)-bit signals of N-bit counter output signals, in response to a first counting enable signal based on a first comparison signal during a coarse counting interval. N and M are natural numbers, N is greater than M, and M is greater than or equal to 3. The second counter is configured to count a second counter clock signal which toggles with a second frequency which is higher than the first frequency to generate lower M-bit signals of the N-bit counter output signals, in response to a second counting enable signal based on the first comparison signal and a second comparison signal during a fine counting interval which follows the coarse counting interval.