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公开(公告)号：US12046451B2
公开(公告)日：2024-07-23
申请号：US17750653
申请日：2022-05-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Nam Kyun Kim , Seung Bo Shim , Doug Yong Sung , Seung Han Baek , Ju Ho Lee
IPC: H01J37/32 , H01L21/3065
CPC classification number: H01J37/32165 , H01J37/32183 , H01J37/32577 , H01J37/32715 , H01L21/3065
Abstract: A plasma etching apparatus may include a first source electrode, a first bias electrode, and a second bias electrode configured to generate a plasma by supplying energy to a process gas injected into a chamber; and a controller. The controller may be configured to supply a first high-frequency RF power, a first low-frequency RF power, and a second low-frequency RF power to the chamber during a first period from a first time to a second time; ramp down and turn off the first high-frequency RF power to the chamber during a second period from the second time to a third time; and ramp down and turn off the first low-frequency RF power to the chamber during a third period from the second time to a fourth time different from the third time. The third period may be smaller than ½ of the first period and greater than the second period.
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公开(公告)号：US10971343B2
公开(公告)日：2021-04-06
申请号：US16262024
申请日：2019-01-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Protopopov Vladimir , Ki Ho Hwang , Doug Yong Sung , Se Jin Oh , Kul Inn , Sung Ho Jang , Yun Kwang Jeon
Abstract: An apparatus for monitoring an interior of a process chamber including a process chamber including a chamber body and a view port defined in the chamber body, a cover section including a pinhole in one end, the cover section disposed to correspond to an end portion of the view port, the cover section having a first length in a direction toward a center point of the process chamber, and a sensing unit inserted into the view port to monitor the interior of the process chamber through the pinhole, a region in the process chamber to be sensed by the sensing unit determined based on the first length may be provided.
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公开(公告)号：US10395900B2
公开(公告)日：2019-08-27
申请号：US15415403
申请日：2017-01-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hak Young Kim , Jung Pyo Hong , Jong Woo Sun , Doug Yong Sung , Yong Ho Lim , Yun Kwang Jeon , Hwa Jun Jung
Abstract: A plasma processing apparatus includes a chamber, a window plate disposed in an upper portion of the chamber and having a fastening hole defined therein, an injector having a body part including a plurality of nozzles and configured to be fastened to the fastening hole, and a flange part extending radially from the body part to partially cover a bottom surface of the window plate when the body part is fastened to the fastening hole, and a stopper configured to be fastened to the body part on an upper surface of the window plate to hold the injector in the fastening hole when the body part is fastened to the fastening hole.
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公开(公告)号：US11501953B2
公开(公告)日：2022-11-15
申请号：US16361341
申请日：2019-03-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seung Bo Shim , Doug Yong Sung , Young Jin Noh , Yong Woo Lee , Ji Soo Im , Hyeong Mo Kang , Peter Byung H Han , Cheon Kyu Lee , Masato Horiguchi
Abstract: Plasma processing equipment includes a chuck stage for supporting a wafer and including a lower electrode, an upper electrode disposed on the chuck stage, an AC power supply which applies first to third signals having different magnitudes of frequencies to the upper electrode or the lower electrode, a dielectric ring which surrounds the chuck stage, an edge electrode located within the dielectric ring, and a resonance circuit connected to the edge electrode. The resonance circuit includes a filter circuit which allows only the third signal among the first to third signals to pass, and a series resonance circuit connected in series with the filter circuit and having a first coil and a first variable capacitor connected in series and grounded.
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公开(公告)号：US20170365444A1
公开(公告)日：2017-12-21
申请号：US15415403
申请日：2017-01-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hak Young Kim , Jung Pyo Hong , Jong Woo Sun , Doug Yong Sung , Yong Ho Lim , Yun Kwang Jeon , Hwa Jun Jung
CPC classification number: H01J37/3244 , H01J37/321 , H01J37/32119 , H01J37/32449 , H01J37/32458 , H01J2237/334 , H01L21/67069
Abstract: A plasma processing apparatus includes a chamber, a window plate disposed in an upper portion of the chamber and having a fastening hole defined therein, an injector having a body part including a plurality of nozzles and configured to be fastened to the fastening hole, and a flange part extending radially from the body part to partially cover a bottom surface of the window plate when the body part is fastened to the fastening hole, and a stopper configured to be fastened to the body part on an upper surface of the window plate to hold the injector in the fastening hole when the body part is fastened to the fastening hole.
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Patent Agency Ranking
公开(公告)号：US11735396B2
公开(公告)日：2023-08-22
申请号：US17148037
申请日：2021-01-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung Bo Shim , Doug Yong Sung , Ho-Jun Lee , Jee Hun Jeong , Sung Hwan Cho , Ju-Hong Cha
IPC: H01J37/32
CPC classification number: H01J37/3211 , H01J37/3244 , H01J37/32119
Abstract: An inductively coupled plasma processing apparatus includes a lower chamber providing a space for a substrate, a high-frequency antenna that generates inductively coupled plasma in the lower chamber, dielectric windows disposed between the lower chamber and the high-frequency antenna, metal windows alternatingly disposed between the dielectric windows, and gas inlet pipes disposed in each of the metal windows, wherein each of the gas inlet pipes includes nozzles that introduce gases to the lower chamberamber.
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公开(公告)号：US10964511B2
公开(公告)日：2021-03-30
申请号：US15864529
申请日：2018-01-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seung Bo Shim , Myung Sun Choi , Nam Jun Kang , Doug Yong Sung , Sang Min Jeong , Peter Byung H Han
IPC: H01L21/00 , C23C16/00 , H01J37/32 , H01L21/3065 , H01L21/67
Abstract: A semiconductor manufacturing device includes a plasma chamber, a source power supply, and first and second bias power supplies. The source power supply applies a first source voltage to the plasma chamber at a first time and a second source voltage to the plasma chamber at a second time. The first bias power supply applies a first turn-on voltage to the plasma chamber at the first time and a first turn-off voltage to the plasma chamber at the second time. The second bias power supply applies a second turn-off voltage to the plasma chamber at the first time and a second turn-on voltage to the plasma chamber at the second time. The plasma chamber forms plasmas of different conditions from a gas mixture in the plasma chamber based on the source, turn-on, and turn-off voltages.
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公开(公告)号：US10903053B2
公开(公告)日：2021-01-26
申请号：US16549408
申请日：2019-08-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hak Young Kim , Jung Pyo Hong , Jong Woo Sun , Doug Yong Sung , Yong Ho Lim , Yun Kwang Jeon , Hwa Jun Jung
Abstract: A plasma processing apparatus includes a chamber, a window plate disposed in an upper portion of the chamber and having a fastening hole defined therein, an injector having a body part including a plurality of nozzles and configured to be fastened to the fastening hole, and a flange part extending radially from the body part to partially cover a bottom surface of the window plate when the body part is fastened to the fastening hole, and a stopper configured to be fastened to the body part on an upper surface of the window plate to hold the injector in the fastening hole when the body part is fastened to the fastening hole.
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9.发明授权公开(公告)号：US10481005B2
公开(公告)日：2019-11-19
申请号：US16157682
申请日：2018-10-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Se Jin Oh , Tae Kyun Kang , Yu Sin Kim , Jae Ik Kim , Chan Bin Mo , Doug Yong Sung , Seung Bin Ahn , Kul Inn , Yun Kwang Jeon
Abstract: A semiconductor substrate measuring apparatus includes a light source unit generating irradiation light including light in a first wavelength band and light in a second wavelength band. An optical unit irradiates the irradiation light on a measurement object and condenses reflected light. A light splitting unit splits the reflected light, condensed in the optical unit, into a first optical path and a second optical path. A first detecting unit is disposed on the first optical path and detects first interference light in the first wavelength band in the reflected light. A second detecting unit is disposed on the second optical path and detects second interference light in the second wavelength band in the reflected light. A controlling unit calculates at least one of a surface shape or a thickness of the measurement object. The controlling unit calculates a temperature of the measurement object.
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公开(公告)号：US10229818B2
公开(公告)日：2019-03-12
申请号：US15260910
申请日：2016-09-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Protopopov Vladimir , Ki Ho Hwang , Doug Yong Sung , Se Jin Oh , Kul Inn , Sung Ho Jang , Yun Kwang Jeon
Abstract: An apparatus for monitoring an interior of a process chamber including a process chamber including a chamber body and a view port defined in the chamber body, a cover section including a pinhole in one end, the cover section disposed to correspond to an end portion of the view port, the cover section having a first length in a direction toward a center point of the process chamber, and a sensing unit inserted into the view port to monitor the interior of the process chamber through the pinhole, a region in the process chamber to be sensed by the sensing unit determined based on the first length may be provided.
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