LIGHT EMITTING DEVICE PACKAGE
    1.
    发明申请

    公开(公告)号:US20190189877A1

    公开(公告)日:2019-06-20

    申请号:US16018542

    申请日:2018-06-26

    Abstract: A light emitting device package includes a package substrate and a submount on the package substrate. An upper surface of the submount includes a central region, first and second base regions spaced from the package substrate, relative to the central region, and a sloped region between the central region and the first and second base regions. A light emitting device chip is in the central region. A first electrode layer is between the central region and the light emitting device chip and extends onto the sloped region and the first base region. A second electrode layer is between the central region and the light emitting device chip, extends onto the sloped region and the second base region, and is spaced apart from the first electrode layer. First and second reflective layers are on the first and second electrode layers, respectively, and overlap the sloped region.

    METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE

    公开(公告)号:US20220246803A1

    公开(公告)日:2022-08-04

    申请号:US17720923

    申请日:2022-04-14

    Abstract: A method of manufacturing a semiconductor light emitting device, the method including forming a first conductivity-type semiconductor layer on a substrate; forming an active layer on the first conductivity-type semiconductor layer; forming a mask layer having an opening on the active layer; growing a second conductivity-type semiconductor layer through the opening; removing the mask layer; removing a portion of the active layer and a portion of the first conductivity-type semiconductor layer that do not overlap the second conductivity-type semiconductor layer; and removing a portion of the first conductivity-type semiconductor layer to expose the substrate.

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