公开(公告)号：US20140299898A1

公开(公告)日：2014-10-09

申请号：US14310885

申请日：2014-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hak Hwan KIM ,  Kyung Mi MOON ,  Ho Sun PAEK ,  Young Hee SONG

IPC: H01L33/50 ,  H01L33/58 ,  H01L27/15

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.

Abstract translation: 提供了可应用于各种应用的发光器件（LED）模块及其制造方法。 通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量，可以提高价格竞争力。 在制造LED模块的方法中，通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作，可以最小化和简化操作。 可以通过使用金属材料作为基板和凸块来增强散热特性。

公开(公告)号：US20130170178A1

公开(公告)日：2013-07-04

申请号：US13732883

申请日：2013-01-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheol Jun YOO ,  Young Hee SONG

IPC: F21V9/16 ,  F21V13/12 ,  F21V13/02

CPC classification number: F21V9/30 ,  F21K9/61 ,  F21K9/64 ,  F21V3/061 ,  F21V3/062 ,  F21V13/02 ,  F21V13/12 ,  F21V29/507 ,  F21V29/71 ,  F21V29/77 ,  F21V29/83 ,  F21Y2103/00 ,  F21Y2103/33 ,  F21Y2115/10 ,  G02B6/0003 ,  G02B6/001 ,  G02B6/4298

Abstract: A light source module including: a cover unit having a pipe structure with one open end or two open ends; a cap unit coupled to the one open end or two open ends of the cover unit; a light source unit including a light emitting device, the light source unit mounted on the cap unit and covered by the cover unit; and a wavelength conversion unit disposed in an internal space of the cover unit and coupled to the light source unit while covering the light emitting device, the wavelength conversion unit converting a wavelength of light emitted from the light emitting device to allow the wavelength-converted light to be emitted through the cover unit.

Abstract translation: 一种光源模块，包括：盖单元，其具有具有一个开放端或两个开放端的管结构; 盖单元，其联接到盖单元的一个开口端或两个开口端; 光源单元，其包括发光器件，所述光源单元安装在所述盖单元上并被所述盖单元覆盖; 以及波长转换单元，其设置在所述盖单元的内部空间中并且在覆盖所述发光器件的同时耦合到所述光源单元，所述波长转换单元将从所述发光器件发射的光的波长转换为允许所述波长转换的光 通过盖单元发射。

公开(公告)号：US20140045286A1

公开(公告)日：2014-02-13

申请号：US14058152

申请日：2013-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheol Jun YOO ,  Young Hee SONG ,  Seong Deok HWANG ,  Sang Hyun LEE

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.

Abstract translation: 提供了一种发光器件封装，包括：多个引线框架，被布置成彼此分离; 至少一个发光装置，其安装在引线框架上，并通过设置在引线接合焊盘上的接合线电连接到引线框架，所述引线接合焊盘设置在作为上表面设置的发光面的同一表面上 发光装置; 形成为封装并支撑引线接合焊盘，接合线，发光器件和引线框架的主体部分，并且具有形成在其上表面中的反射槽，以将发光表面暴露于外部; 以及设置在主体部分上的透镜部分，以覆盖发光器件。