公开(公告)号：US20130170178A1

公开(公告)日：2013-07-04

申请号：US13732883

申请日：2013-01-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheol Jun YOO ,  Young Hee SONG

IPC: F21V9/16 ,  F21V13/12 ,  F21V13/02

CPC classification number: F21V9/30 ,  F21K9/61 ,  F21K9/64 ,  F21V3/061 ,  F21V3/062 ,  F21V13/02 ,  F21V13/12 ,  F21V29/507 ,  F21V29/71 ,  F21V29/77 ,  F21V29/83 ,  F21Y2103/00 ,  F21Y2103/33 ,  F21Y2115/10 ,  G02B6/0003 ,  G02B6/001 ,  G02B6/4298

Abstract: A light source module including: a cover unit having a pipe structure with one open end or two open ends; a cap unit coupled to the one open end or two open ends of the cover unit; a light source unit including a light emitting device, the light source unit mounted on the cap unit and covered by the cover unit; and a wavelength conversion unit disposed in an internal space of the cover unit and coupled to the light source unit while covering the light emitting device, the wavelength conversion unit converting a wavelength of light emitted from the light emitting device to allow the wavelength-converted light to be emitted through the cover unit.

Abstract translation: 一种光源模块，包括：盖单元，其具有具有一个开放端或两个开放端的管结构; 盖单元，其联接到盖单元的一个开口端或两个开口端; 光源单元，其包括发光器件，所述光源单元安装在所述盖单元上并被所述盖单元覆盖; 以及波长转换单元，其设置在所述盖单元的内部空间中并且在覆盖所述发光器件的同时耦合到所述光源单元，所述波长转换单元将从所述发光器件发射的光的波长转换为允许所述波长转换的光 通过盖单元发射。

公开(公告)号：US20130240934A1

公开(公告)日：2013-09-19

申请号：US13800824

申请日：2013-03-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il Woo PARK ,  Cheol Jun YOO

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/38

CPC classification number: H01L33/60 ,  H01L21/568 ,  H01L33/38 ,  H01L33/46 ,  H01L33/50 ,  H01L33/505 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/13 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/18162 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: There is provided a light emitting element package including: a light emitting laminate having a structure in which semiconductor layers are laminated and having a first main surface and a second main surface opposing the first main surface; a terminal unit disposed on an electrode disposed on the second main surface; a molded unit disposed on the second main surface of the light emitting laminate and allowing a portion of the terminal unit to be exposed; and a wavelength conversion unit disposed on the first main surface of the light emitting laminate.

Abstract translation: 提供了一种发光元件封装，包括：发光层压体，其具有层叠半导体层的结构，并具有与第一主表面相对的第一主表面和第二主表面; 设置在设置在所述第二主表面上的电极上的端子单元; 设置在所述发光层叠体的所述第二主面上并使所述端子单元的一部分露出的成型单元; 以及设置在发光层叠体的第一主表面上的波长转换单元。

公开(公告)号：US20140299906A1

公开(公告)日：2014-10-09

申请号：US14310664

申请日：2014-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hak Hwan KIM ,  Min Jung KIM ,  Kyung Mi MOON ,  Jong Sup SONG ,  Jae Sung YOU ,  Ill Heoung CHOI ,  Cheol Jun YOO

IPC: H01L33/62 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L21/568 ,  H01L33/505 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/83

Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

Abstract translation: 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

公开(公告)号：US20140045286A1

公开(公告)日：2014-02-13

申请号：US14058152

申请日：2013-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheol Jun YOO ,  Young Hee SONG ,  Seong Deok HWANG ,  Sang Hyun LEE

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.

Abstract translation: 提供了一种发光器件封装，包括：多个引线框架，被布置成彼此分离; 至少一个发光装置，其安装在引线框架上，并通过设置在引线接合焊盘上的接合线电连接到引线框架，所述引线接合焊盘设置在作为上表面设置的发光面的同一表面上 发光装置; 形成为封装并支撑引线接合焊盘，接合线，发光器件和引线框架的主体部分，并且具有形成在其上表面中的反射槽，以将发光表面暴露于外部; 以及设置在主体部分上的透镜部分，以覆盖发光器件。