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公开(公告)号：US09230919B2
公开(公告)日：2016-01-05
申请号：US14528671
申请日：2014-10-30
发明人： Chin-Tien Chiu , Chih-Chin Liao , Ken Jian Ming Wang , Han-Shiao Chen , Cheeman Yu , Hem Takiar
IPC分类号： H01L23/48 , H01L21/00 , H05K1/00 , H05K3/02 , H05K1/11 , H01L23/00 , H01L23/498 , H01L23/528 , H01L23/31 , H01L21/56
CPC分类号： H01L23/562 , H01L21/56 , H01L23/3114 , H01L23/3121 , H01L23/48 , H01L23/49805 , H01L23/49822 , H01L23/49838 , H01L23/528 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/05015 , H01L2224/05023 , H01L2224/0605 , H01L2224/06151 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01004 , H01L2924/0102 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1438 , H01L2924/15313 , H01L2924/15323 , H01L2924/15333 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
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2.发明授权Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging 有权芯片载体基板上的刚性波纹图案设计和半导体和电子子系统封装的印刷电路板公开(公告)号：US08878368B2
公开(公告)日：2014-11-04
申请号：US13941823
申请日：2013-07-15
发明人： Chin-Tien Chiu , Chih-Chin Liao , Ken Jian Ming Wang , Han-Shiao Chen , Cheeman Yu , Hem Takiar
IPC分类号： H01L23/48 , H01L21/00 , H01L23/31 , H01L23/498 , H01L23/00
CPC分类号： H01L23/562 , H01L21/56 , H01L23/3114 , H01L23/3121 , H01L23/48 , H01L23/49805 , H01L23/49822 , H01L23/49838 , H01L23/528 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/05015 , H01L2224/05023 , H01L2224/0605 , H01L2224/06151 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01004 , H01L2924/0102 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1438 , H01L2924/15313 , H01L2924/15323 , H01L2924/15333 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
摘要翻译： 形成在半导体管芯封装中的衬底的第一侧上的刚性波形图案。 刚性波形图案与形成在基板的第二侧上的接触指状物对准并覆盖在其上。 刚性波形包括具有蚀刻部分的第一图案和围绕蚀刻部分的未蚀刻部分。 当模制过程中衬底和裸片被封装时，刚性波形有效地减少了模具的变形和应力，从而大大减轻了模具开裂。
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3.发明申请PRINTED CIRCUIT BOARD WITH COEXTENSIVE ELECTRICAL CONNECTORS AND CONTACT PAD AREAS 审中-公开印刷电路板与连接电气连接器和接触垫区域公开(公告)号：US20150223335A1
公开(公告)日：2015-08-06
申请号：US14684619
申请日：2015-04-13
发明人： Chih-Chin Liao , Han-Shiao Chen , Chin-Tien Chiu , Ken Jian Ming Wang , Cheeman Yu , Hem Takiar
CPC分类号： H05K1/111 , H01L2924/0002 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K3/4038 , H05K3/429 , H05K2201/0195 , H05K2201/0338 , H05K2201/09381 , H05K2201/094 , H05K2201/09663 , H05K2201/0969 , H05K2201/10159 , H05K2201/10689 , Y02P70/611 , H01L2924/00
摘要： A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
摘要翻译： 公开了具有共同的电连接器和接触焊盘区域的印刷电路板。 迹线和/或通孔所在接触焊盘区域可被蚀刻掉，以确保迹线，通孔和接触焊盘之间的电气隔离。
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4.发明申请RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR AND ELECTRONIC SUB-SYSTEM PACKAGING 有权用于半导体和电子子系统封装的芯片载体基板和印刷电路板上的刚体波形图案设计公开(公告)号：US20150054177A1
公开(公告)日：2015-02-26
申请号：US14528671
申请日：2014-10-30
发明人： Chin-Tien Chiu , Chih-Chin Liao , Ken Jian Ming Wang , Han-Shiao Chen , Cheeman Yu , Hem Takiar
CPC分类号： H01L23/562 , H01L21/56 , H01L23/3114 , H01L23/3121 , H01L23/48 , H01L23/49805 , H01L23/49822 , H01L23/49838 , H01L23/528 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/05015 , H01L2224/05023 , H01L2224/0605 , H01L2224/06151 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01004 , H01L2924/0102 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1438 , H01L2924/15313 , H01L2924/15323 , H01L2924/15333 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
摘要翻译： 形成在半导体管芯封装中的衬底的第一侧上的刚性波形图案。 刚性波形图案与形成在基板的第二侧上的接触指状物对准并覆盖在其上。 刚性波形包括具有蚀刻部分的第一图案和围绕蚀刻部分的未蚀刻部分。 当模制过程中衬底和裸片被封装时，刚性波形有效地减少了模具的变形和应力，从而大大减轻了模具开裂。
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公开(公告)号：US10051733B2
公开(公告)日：2018-08-14
申请号：US14684619
申请日：2015-04-13
发明人： Chih-Chin Liao , Han-Shiao Chen , Chin-Tien Chiu , Ken Jian Ming Wang , Cheeman Yu , Hem Takiar
摘要： A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
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公开(公告)号：US20130299959A1
公开(公告)日：2013-11-14
申请号：US13941823
申请日：2013-07-15
发明人： Chin-Tien Chiu , Chih-Chin Liao , Ken Jian Ming Wang , Han-Shiao Chen , Cheeman Yu , Hem Takiar
IPC分类号： H01L23/48
CPC分类号： H01L23/562 , H01L21/56 , H01L23/3114 , H01L23/3121 , H01L23/48 , H01L23/49805 , H01L23/49822 , H01L23/49838 , H01L23/528 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/05015 , H01L2224/05023 , H01L2224/0605 , H01L2224/06151 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01004 , H01L2924/0102 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1438 , H01L2924/15313 , H01L2924/15323 , H01L2924/15333 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
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