公开(公告)号：US07271086B2

公开(公告)日：2007-09-18

申请号：US11218254

申请日：2005-09-01

申请人： Sanh D. Tang ,  Troy Gugel ,  John Lee ,  Fred Fishburn

发明人： Sanh D. Tang ,  Troy Gugel ,  John Lee ,  Fred Fishburn

IPC分类号： H01L21/4763

CPC分类号： H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/05082 ,  H01L2224/05181 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： Methods for forming a redistribution layer on microfeature workpieces, and microfeature workpieces having such a redistribution layer are disclosed herein. In one embodiment, a method includes constructing a dielectric structure on a microfeature workpiece having a substrate and a terminal carried by the substrate, and removing a section of the dielectric structure to form an opening. The opening has a first portion extending through the dielectric structure and exposing the terminal and a second portion extending to an intermediate depth in the dielectric structure. The second portion is spaced laterally apart from the terminal. The method further includes forming a conductive layer on the microfeature workpiece with the conductive layer in electrical contact with the terminal and disposed in the first and second portions of the opening.

公开(公告)号：US20070045865A1

公开(公告)日：2007-03-01

申请号：US11218254

申请日：2005-09-01

申请人： Sanh Tang ,  Troy Gugel ,  John Lee ,  Fred Fishburn

发明人： Sanh Tang ,  Troy Gugel ,  John Lee ,  Fred Fishburn

IPC分类号： H01L21/28 ,  H01L23/48

CPC分类号： H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/05082 ,  H01L2224/05181 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： Methods for forming a redistribution layer on microfeature workpieces, and microfeature workpieces having such a redistribution layer are disclosed herein. In one embodiment, a method includes constructing a dielectric structure on a microfeature workpiece having a substrate and a terminal carried by the substrate, and removing a section of the dielectric structure to form an opening. The opening has a first portion extending through the dielectric structure and exposing the terminal and a second portion extending to an intermediate depth in the dielectric structure. The second portion is spaced laterally apart from the terminal. The method further includes forming a conductive layer on the microfeature workpiece with the conductive layer in electrical contact with the terminal and disposed in the first and second portions of the opening.

公开(公告)号：US20070066040A1

公开(公告)日：2007-03-22

申请号：US11603816

申请日：2006-11-21

申请人： Sanh Tang ,  Troy Gugel ,  John Lee ,  Fred Fishburn

发明人： Sanh Tang ,  Troy Gugel ,  John Lee ,  Fred Fishburn

IPC分类号： H01L21/28 ,  H01L23/48

CPC分类号： H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/05082 ,  H01L2224/05181 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： Methods for forming a redistribution layer on microfeature workpieces, and microfeature workpieces having such a redistribution layer are disclosed herein. In one embodiment, a method includes constructing a dielectric structure on a microfeature workpiece having a substrate and a terminal carried by the substrate, and removing a section of the dielectric structure to form an opening. The opening has a first portion extending through the dielectric structure and exposing the terminal and a second portion extending to an intermediate depth in the dielectric structure. The second portion is spaced laterally apart from the terminal. The method further includes forming a conductive layer on the microfeature workpiece with the conductive layer in electrical contact with the terminal and disposed in the first and second portions of the opening.

摘要翻译： 在微型工件上形成再分布层的方法以及具有这种再分配层的微特征工件在此公开。 在一个实施例中，一种方法包括在具有衬底和由衬底承载的端子的微特征工件上构造电介质结构，以及去除电介质结构的一部分以形成开口。 开口具有延伸穿过电介质结构并且暴露端子的第一部分和延伸到电介质结构中的中间深度的第二部分。 第二部分与端子横向间隔开。 该方法还包括在微特征工件上形成导电层，导电层与端子电接触并设置在开口的第一和第二部分中。

公开(公告)号：USD782295S1

公开(公告)日：2017-03-28

申请号：US29458773

申请日：2013-06-21

申请人： John Lee

设计人： John Lee

公开(公告)号：US20160302445A1

公开(公告)日：2016-10-20

申请号：US14690118

申请日：2015-04-17

申请人： John Lee

发明人： John Lee

IPC分类号： A23K1/04

CPC分类号： A23K40/00 ,  A23K10/24 ,  A23K20/158 ,  A23K40/30 ,  A23K40/35 ,  A23K50/10 ,  A23L29/275

摘要： A processing method to convert oily sticky food byproducts into non-oily and non-sticky dry products by using liquid animal blood is provided. Moisture in the food byproducts is reduced for reducing drying cost and pH is adjusted to 4-10 with preferred range at 6-8, then liquid animal blood is mixed, heated to above 65° C. for coagulation to form non-oily and non-sticky wet products after removing free water. Then related drying equipment is used to produce the non-oily and non-sticky dry products. The non-oily and non-sticky dry products are in particle or fine form with good flowability. The dry products are easy to be stored, transported and applied, which are used in food and feed industries. Besides general feed applications, the non-oily and non-sticky dry products have bypass function for ruminants.

摘要翻译： 提供了一种通过使用液体动物血液将油状粘性食物副产品转化成非油性和非粘性干燥产品的加工方法。 减少食品副产品中的水分以降低干燥成本，并将pH调节至4-10，优选范围为6-8，然后将液体动物血液混合，加热至65℃以上以凝结形成非油性和非油性 去除自由水后粘稠的湿产品。 然后使用相关的干燥设备生产非油性和非粘性干燥产品。 非油性和非粘性干燥产品具有良好流动性的颗粒或微细形式。 干燥产品易于储存，运输和应用，用于食品和饲料行业。 除了一般的饲料应用，非油性和非粘性干燥产品具有反刍动物的旁路功能。

公开(公告)号：US08792492B2

公开(公告)日：2014-07-29

申请号：US13275057

申请日：2011-10-17

申请人： Wai Chen ,  Ratul Guha ,  John Lee ,  Junichiro Fukuyama ,  Rama Vuyyuru

发明人： Wai Chen ,  Ratul Guha ,  John Lee ,  Junichiro Fukuyama ,  Rama Vuyyuru

IPC分类号： H04L12/28

CPC分类号： H04W40/06 ,  H04L45/02 ,  H04L45/741 ,  H04L45/745 ,  H04L49/355 ,  H04L67/12 ,  H04L67/327 ,  H04L69/22 ,  H04W4/025 ,  H04W4/06 ,  H04W4/90 ,  H04W88/04

摘要： An open communication method between at least two sub-networks using a broker node. Each of the sub-networks has a different routable network addressing scheme. The method comprises receiving a packet for a specific application, the packet includes an application identifier, determining if the packet is to be relayed to another of the at least two sub-networks based upon the application identifier, determining if a node receiving the packet is a broker node, relaying the packet to a broker node if not a broker node and forwarding, by the broker node, the packet to at least one node in another of the at least two sub-networks. The node generating the packet communicates using a first of the at least two sub-networks. A broker node communicates using at least two of the at least two sub-networks via a corresponding routable network addressing schemes for each of the sub-networks.

摘要翻译： 使用代理节点的至少两个子网络之间的开放通信方法。 每个子网络具有不同的可路由网络寻址方案。 该方法包括接收用于特定应用的分组，分组包括应用标识符，基于应用标识确定分组是否要被中继到至少两个子网络中的另一个，确定接收分组的节点是否是 代理节点，如果不是代理节点，则将所述分组中继到代理节点，并且所述代理节点将所述分组转发到所述至少两个子网络中的另一个中的至少一个节点。 生成分组的节点使用所述至少两个子网中的第一个进行通信。 代理节点通过用于每个子网络的相应的可路由网络寻址方案，使用至少两个子网络中的至少两个进行通信。

公开(公告)号：US08682647B1

公开(公告)日：2014-03-25

申请号：US13350014

申请日：2012-01-13

申请人： John Lee

发明人： John Lee

IPC分类号： G06F17/27 ,  G06F17/20 ,  G06F17/21

CPC分类号： G06F17/2775 ,  G06F17/30654

摘要： Embodiments relate to systems for, and methods of, answering complex questions with mined natural language search results. The systems and methods generally accept a natural language query, retrieve initial search results for the query, and then thin the retrieved results such that acceptable natural language replies to the query are identified. The natural language results may be further processed for presentation to the requestor.

摘要翻译： 实施例涉及用开采的自然语言搜索结果回答复杂问题的系统和方法。 系统和方法通常接受自然语言查询，检索查询的初始搜索结果，然后对检索结果进行细化，以便识别可接受的自然语言对查询的回复。 可以进一步处理自然语言结果以呈现给请求者。

公开(公告)号：US08598632B2

公开(公告)日：2013-12-03

申请号：US13530679

申请日：2012-06-22

申请人： Luan Tran ,  William T. Rericha ,  John Lee ,  Ramakanth Alapati ,  Sheron Honarkhah ,  Shuang Meng ,  Puneet Sharma ,  Jingyi Bai ,  Zhiping Yin ,  Paul Morgan ,  Mirzafer K. Abatchev ,  Gurtej S. Sandhu ,  D. Mark Durcan

发明人： Luan Tran ,  William T. Rericha ,  John Lee ,  Ramakanth Alapati ,  Sheron Honarkhah ,  Shuang Meng ,  Puneet Sharma ,  Jingyi Bai ,  Zhiping Yin ,  Paul Morgan ,  Mirzafer K. Abatchev ,  Gurtej S. Sandhu ,  D. Mark Durcan

IPC分类号： H01L27/118

CPC分类号： H01L21/0338 ,  H01L21/0337 ,  H01L21/3086 ,  H01L21/3088

摘要： An integrated circuit having differently-sized features wherein the smaller features have a pitch multiplied relationship with the larger features, which are of such size as to be formed by conventional lithography.

摘要翻译： 具有不同尺寸特征的集成电路，其中较小特征与具有通过常规光刻形成的尺寸的较大特征具有间距倍增关系。

公开(公告)号：US08570994B2

公开(公告)日：2013-10-29

申请号：US13276375

申请日：2011-10-19

申请人： Wai Chen ,  John Lee ,  Ratul K. Guha ,  Ryokichi Onishi ,  Rama Vuyyuru

发明人： Wai Chen ,  John Lee ,  Ratul K. Guha ,  Ryokichi Onishi ,  Rama Vuyyuru

IPC分类号： H04W4/00

CPC分类号： H04L45/48 ,  H04W4/06 ,  H04W4/90 ,  H04W40/06 ,  H04W76/50 ,  H04W84/18

摘要： The present invention offers systems and methods for effective multiple-hop routing, multicasting and media access control for vehicle group communications that employ directional wireless radio technology. Multi-beam optic-wireless media and streamlined operations provide low-overhead communications among vehicles. Systems and methods are provided to maintain a quasi-stationary group of neighboring vehicles, enable high-throughput on-demand switching among multiple vehicles, enable group coding in the vehicle group to achieve higher throughput, and enable dynamic adjustment of link to maintain desirable vehicle group. The proposed solution builds upon the conception of a MAC-free wireless operation and quasi-stationary vehicular switched network to achieve ultra-low-overhead and high-throughput vehicle communications.

摘要翻译： 本发明提供了采用定向无线电技术的用于车载组通信的有效多跳路由，组播和媒体访问控制的系统和方法。 多光束无线介质和简化的操作在车辆之间提供低开销的通信。 提供系统和方法以维持相邻车辆的准静止组，使得能够在多个车辆之间实现高吞吐量按需切换，使得车辆组中的组编码能够实现更高的吞吐量，并且能够动态调整链路以维持所需的车辆 组。 所提出的解决方案建立在无MAC无线操作和准静态车载交换网络的概念基础上，以实现超低开销和高吞吐量车辆通信。

公开(公告)号：US08507341B2

公开(公告)日：2013-08-13

申请号：US13445797

申请日：2012-04-12

申请人： Luan C. Tran ,  John Lee ,  Zengtao “Tony” Liu ,  Eric Freeman ,  Russell Nielsen

发明人： Luan C. Tran ,  John Lee ,  Zengtao “Tony” Liu ,  Eric Freeman ,  Russell Nielsen

IPC分类号： H01L21/8242

CPC分类号： H01L21/0334 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/30604 ,  H01L21/3083 ,  H01L21/31144 ,  H01L21/76816 ,  H01L21/76877 ,  H01L21/76897 ,  H01L23/544 ,  H01L27/1052 ,  H01L2924/0002 ,  Y10S438/947 ,  H01L2924/00

摘要： A method for defining patterns in an integrated circuit comprises defining a plurality of features in a first photoresist layer using photolithography over a first region of a substrate. The method further comprises using pitch multiplication to produce at least two features in a lower masking layer for each feature in the photoresist layer. The features in the lower masking layer include looped ends. The method further comprises covering with a second photoresist layer a second region of the substrate including the looped ends in the lower masking layer. The method further comprises etching a pattern of trenches in the substrate through the features in the lower masking layer without etching in the second region. The trenches have a trench width.