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9 条记录 (耗时 0.032 秒)

    Semiconductor acceleration sensor
    1.
    发明授权
    Semiconductor acceleration sensor 失效
    半导体加速度传感器

    公开(公告)号：US06448624B1

    公开(公告)日：2002-09-10

    申请号：US08908939

    申请日：1997-08-08

    申请人： Seiichiro Ishio ,  Kenichi Ao ,  Minoru Murata ,  Yasuki Shimoyama ,  Tomohito Kunda ,  Norio Kitao

    发明人： Seiichiro Ishio ,  Kenichi Ao ,  Minoru Murata ,  Yasuki Shimoyama ,  Tomohito Kunda ,  Norio Kitao

    IPC分类号： H01L2982

    CPC分类号： G01P15/123 ,  G01P1/006 ,  G01P15/0802 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor sensor chip is provided with a weight portion supported in a frame via beams whereby acceleration up to substantially ±1 G can be detected by utilizing piezoresistance effect of resistor elements formed on the beams. The semiconductor sensor chip is supported by a seat having a thermal expansion coefficient equivalent to that of the semiconductor sensor chip via the frame. The frame and the seat are adhered to each other by a flexible adhesive agent mixed with a plurality of resin beads functioning as spacers and under an adhesion state, air damping of the weight portion is carried out by setting a dimension of an air gap between the weight portion and the seat to a range of 7 through 15 &mgr;m.

    摘要翻译： 半导体传感器芯片具有通过光束支撑在框架中的重量部分，由此通过利用形成在梁上的电阻元件的压阻效应可以检测到大致±1G的加速度。 半导体传感器芯片由具有与半导体传感器芯片的热膨胀系数相当的热膨胀系数经由框架支撑。 框架和座椅通过与作为间隔件起作用的多个树脂珠混合的柔性粘合剂彼此粘合，并且在粘合状态下，通过将重量部分的空气阻力设定在 重量部分和座椅到7到15毫米的范围。

    Physical quantity sensor capable of outputting time-serial signal indicative of plural ranges of physical quantity
    2.
    发明授权
    Physical quantity sensor capable of outputting time-serial signal indicative of plural ranges of physical quantity 失效
    能够输出指示多个物理量范围的时间序列信号的物理量传感器

    公开(公告)号：US07082830B2

    公开(公告)日：2006-08-01

    申请号：US10771500

    申请日：2004-02-05

    申请人： Tomohito Kunda ,  Yasuki Shimoyama

    发明人： Tomohito Kunda ,  Yasuki Shimoyama

    IPC分类号： G01P15/08 ,  G01P21/00

    CPC分类号： G01P21/00 ,  B60R21/0132 ,  B60R2021/01327 ,  G01D3/032

    摘要： A physical quantity sensor detecting physical quantity, such as acceleration or angular velocity, is provided and mounted on, for example, a vehicle. The sensor has a physical quantity transducer and the first to third circuits. The transducer senses physical quantity acting in a direction determined with respect to a predetermined detection axis of the transducer to output a detection signal corresponding in level to the physical quantity. The first circuit receives the detection signal and output a first physical quantity signal depending in level on the detection signal. The second circuit produces a second physical quantity signal from the first physical quantity signal, the second physical quantity signal being larger in magnitude the first physical quantity signal. The third circuit receives the first and second physical quantity signals and outputs a signal consisting of the first and second physical quantity signals alternately selected and lined up sequentially in time.

    摘要翻译： 物理量传感器检测物理量，例如加速度或角速度，并且安装在例如车辆上。 传感器具有物理量传感器和第一至第三电路。 换能器感测以相对于换能器的预定检测轴确定的方向作用的物理量，以输出与物理量相对应的检测信号。 第一电路接收检测信号，并根据检测信号的电平输出第一物理量信号。 第二电路从第一物理量信号产生第二物理量信号，第二物理量信号的幅度大于第一物理量信号。 第三电路接收第一和第二物理量信号，并且输出由交替选择的第一和第二物理量信号组成的信号并且在时间上顺序排列。

    Semiconductor dynamic sensor
    3.
    发明授权
    Semiconductor dynamic sensor 有权
    半导体动态传感器

    公开(公告)号：US06848306B2

    公开(公告)日：2005-02-01

    申请号：US09824728

    申请日：2001-04-04

    申请人： Tomohito Kunda

    发明人： Tomohito Kunda

    IPC分类号： B81B7/00 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  H01L29/84 ,  G01P15/00 ,  H01L29/82

    CPC分类号： B81C1/00333 ,  G01P1/023 ,  G01P15/125 ,  G01P2015/0814 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/00014

    摘要： A semiconductor dynamic sensor such as an acceleration sensor is composed of a sensor chip having electrodes movable in response to acceleration applied thereto and a circuit chip having a circuit for processing signals fed from the sensor chip. The sensor chip and the circuit chip are contained and held in a packaging case. The sensor chip and the circuit chip are fixedly connected via an adhesive film. The sensor chip is correctly positioned on the circuit chip without creating misalignment relative to a sensing axis, because the adhesive film from which an adhesive material does not flow out under heat is used. A semiconductor wafer including plural sensor chips is first made and the adhesive film is stuck to one surface of the wafer, and then individual sensor chips are separated by dicing. The sensor chip is connected to the circuit chip via the adhesive film.

    摘要翻译： 诸如加速度传感器的半导体动态传感器由具有可响应加速度可移动的电极的传感器芯片和具有用于处理从传感器芯片馈送的信号的电路的电路芯片组成。 传感器芯片和电路芯片被包含并保持在包装盒中。 传感器芯片和电路芯片通过粘合膜固定连接。 使用传感器芯片正确地定位在电路芯片上，而不会产生相对于感测轴线的不对准，因为粘合剂材料在加热下不会从其中流出。 首先制造包括多个传感器芯片的半导体晶片，并且将粘合膜粘贴到晶片的一个表面，然后通过切割分离各个传感器芯片。 传感器芯片通过粘合膜连接到电路芯片。

    Pressure sensor
    6.
    发明申请
    Pressure sensor 失效
    压力传感器

    公开(公告)号：US20060053894A1

    公开(公告)日：2006-03-16

    申请号：US11220534

    申请日：2005-09-08

    申请人： Tomohito Kunda ,  Osamu Ito ,  Yoshifumi Murakami ,  Takeshi Shinoda

    发明人： Tomohito Kunda ,  Osamu Ito ,  Yoshifumi Murakami ,  Takeshi Shinoda

    IPC分类号： G01L7/08

    CPC分类号： G01L9/0055 ,  F02M2200/24

    摘要： A pressure sensor includes a hollow cylindrical stem, a sensor chip, and a wiring board. The hollow cylindrical stem has a pressure-sensitive flexible diaphragm at a first axial end thereof and an opening at a second axial end thereof, the opening for transmitting pressure into the stem. The sensor chip is provided on the diaphragm for outputting an electrical signal in proportion to the deformation of the diaphragm. The wiring board electrically connects the sensor chip to an external circuit. The wiring board is located around the sensor chip on the first axial end of the stem.

    摘要翻译： 压力传感器包括中空圆柱形杆，传感器芯片和布线板。 中空圆柱形杆在其第一轴向端部处具有压敏柔性隔膜，在其第二轴向端部具有开口，用于将压力传递到杆中。 传感器芯片设置在隔膜上，用于与隔膜的变形成比例地输出电信号。 接线板将传感器芯片电连接到外部电路。 接线板位于杆的第一轴向端的传感器芯片周围。

    Pressure sensor
    8.
    发明授权
    Pressure sensor 失效
    压力传感器

    公开(公告)号：US07228745B2

    公开(公告)日：2007-06-12

    申请号：US11220534

    申请日：2005-09-08

    申请人： Tomohito Kunda ,  Osamu Ito ,  Yoshifumi Murakami ,  Takeshi Shinoda

    发明人： Tomohito Kunda ,  Osamu Ito ,  Yoshifumi Murakami ,  Takeshi Shinoda

    IPC分类号： G01L9/00

    CPC分类号： G01L9/0055 ,  F02M2200/24

    摘要： A pressure sensor includes a hollow cylindrical stem, a sensor chip, and a wiring board. The hollow cylindrical stem has a pressure-sensitive flexible diaphragm at a first axial end thereof and an opening at a second axial end thereof, the opening for transmitting pressure into the stem. The sensor chip is provided on the diaphragm for outputting an electrical signal in proportion to the deformation of the diaphragm. The wiring board electrically connects the sensor chip to an external circuit. The wiring board is located around the sensor chip on the first axial end of the stem.

    摘要翻译： 压力传感器包括中空圆柱形杆，传感器芯片和布线板。 中空圆柱形杆在其第一轴向端部处具有压敏柔性隔膜，在其第二轴向端部具有开口，用于将压力传递到杆中。 传感器芯片设置在隔膜上，用于与隔膜的变形成比例地输出电信号。 接线板将传感器芯片电连接到外部电路。 接线板位于杆的第一轴向端的传感器芯片周围。

    Capacitive-type acceleration sensor
    9.
    发明授权
    Capacitive-type acceleration sensor 有权
    电容式加速度传感器

    公开(公告)号：US06923060B2

    公开(公告)日：2005-08-02

    申请号：US10631775

    申请日：2003-08-01

    申请人： Takashi Katsumata ,  Toshiya Ikezawa ,  Tomohito Kunda

    发明人： Takashi Katsumata ,  Toshiya Ikezawa ,  Tomohito Kunda

    IPC分类号： G01P15/08 ,  G01P15/125

    CPC分类号： G01P15/125 ,  G01P2015/0814

    摘要： A capacitive-type acceleration sensor includes a sensor chip that forms a moving electrode and a fixed electrode. The electrodes face each other while maintaining a detection gap. The sensor chip is joined to a circuit chip integrally. The circuit chip is mounted on a package via a resin adhesive. The adhesive is mixed with a filler of a material having a Young's modulus higher than that of the resin.

    摘要翻译： 电容型加速度传感器包括形成移动电极和固定电极的传感器芯片。 电极彼此面对，同时保持检测间隙。 传感器芯片整体连接到电路芯片。 电路芯片通过树脂粘合剂安装在封装上。 将粘合剂与杨氏模量高于树脂的材料的填料混合。