公开(公告)号：US10079142B2

公开(公告)日：2018-09-18

申请号：US15165020

申请日：2016-05-26

Applicant: SEMES CO., LTD.

Inventor： Dae Min Kim ,  Sul Lee ,  Bok Kyu Lee ,  Jae Myoung Lee

IPC: H01L21/02 ,  B08B15/00 ,  C11D11/00 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/02052 ,  B08B2203/0229 ,  C11D11/0047 ,  H01L21/67051 ,  H01L21/6875

Abstract: An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.

公开(公告)号：US11664212B2

公开(公告)日：2023-05-30

申请号：US17239091

申请日：2021-04-23

Applicant: SEMES CO., LTD.

Inventor： Yong Hoon Hong ,  Sul Lee ,  Myung A Jeon ,  Moonsik Choi ,  Young Su Kim

IPC: H01L21/02 ,  H01L21/263

CPC classification number: H01L21/02057 ,  H01L21/02282 ,  H01L21/2636

Abstract: The inventive concept provides a substrate treating apparatus. In an embodiment, the substrate treating apparatus includes a housing having a treatment space for treating a substrate in an interior thereof, a support unit that supports the substrate in the treatment space, a nozzle that supplies a liquid to the substrate positioned on the support unit, a liquid supply unit that supplies the liquid to the nozzle, and a controller that controls the liquid unit, the liquid supply unit includes a tank having an interior space for storing the liquid, and a first circulation line that circulates the liquid stored in the interior space and in which a first heater is installed, and the controller controls the first heater such that the first heater heats the liquid to a first temperature, at which particles in the interior of the liquid are not eluted.

公开(公告)号：US12198950B2

公开(公告)日：2025-01-14

申请号：US17943312

申请日：2022-09-13

Applicant: SEMES CO., LTD.

Inventor： Myung A Jeon ,  Muhyeon Lee ,  Sul Lee

IPC: H01L21/67 ,  B08B3/02 ,  B08B3/08 ,  B32B41/00 ,  B32B43/00 ,  H01L21/683

Abstract: Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive. The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.

公开(公告)号：US10022746B2

公开(公告)日：2018-07-17

申请号：US14862729

申请日：2015-09-23

Applicant: Semes Co., Ltd.

Inventor： Sul Lee ,  Young Hun Jung ,  Jong Su Choi

IPC: B05D1/00 ,  H01L21/67 ,  B05D1/02

Abstract: In apparatus and method according to example embodiments of the inventive concept, a substrate may be treated using two or more treatment solutions. The substrate treating apparatus may include a treatment vessel providing a treatment space, a substrate supporting unit provided in the treatment vessel to support a substrate, and a solution supplying unit supplying a treatment solution on the substrate supported by the substrate supporting unit. The solution supplying unit may include an etching solution supplying nozzle supplying an etching solution on an edge region of the substrate supported by the substrate supporting unit and an etch prevention solution (EPS) supplying nozzle supplying an etch prevention solution on a center region of the substrate supported by the substrate supporting unit. Accordingly, it is possible to prevent the center region of the substrate from being dried.

公开(公告)号：US10707101B2

公开(公告)日：2020-07-07

申请号：US15677321

申请日：2017-08-15

Applicant: SEMES CO., LTD.

Inventor： Heehwan Kim ,  Sul Lee

IPC: H01L21/67 ,  H01L21/687

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the substrate, a nozzle configured to discharge a chemical to the substrate located on the spin head, a first passage configured to supply a first chemical, a chemical property of which is the same as the chemical, a second passage configured to supply a second chemical, a chemical property of which is the same as the first chemical, and a discharge passage connecting the first passage and the second passage, and the nozzle.