公开(公告)号：US20150140783A1

公开(公告)日：2015-05-21

申请号：US14510246

申请日：2014-10-09

申请人： Won-chul Lim

发明人： Won-chul Lim

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B28D5/0011 ,  H01L21/00 ,  H01L21/67 ,  H01L21/67011 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  Y10T225/321

摘要： In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.

摘要翻译： 在晶片切割机中，为了降低晶片切割的时间和成本，并且对整个晶片均匀地施加切割压力，晶片切割机包括支撑晶片的第一侧的支撑单元; 以及加压装置，通过将压力分散到晶片的第二面上，使得晶片的激光划线层作为分割起点施加压力。 因此，晶片切割机减少了将晶片分成半导体器件的激光辐射和压力施加时间。 在不增加损坏晶片的可能性的情况下实现提高的效率。

公开(公告)号：US20070141754A1

公开(公告)日：2007-06-21

申请号：US11679730

申请日：2007-02-27

申请人： Won-Chul LIM

发明人： Won-Chul LIM

IPC分类号： H01L21/00

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A support inserted through an opening in the printed circuit board supporting the overhang portion of the semiconductor chip structure is installed in a predetermined region of the heating block. Multiple supports on the heating block may support overhand portions on multiple semiconductor chip structures.

摘要翻译： 提供半导体封装引线接合系统和使用方法。 引线接合系统包括加热并支撑其上安装有具有突出端的多层半导体芯片结构的印刷电路板的加热块。 通过支撑半导体芯片结构的突出部分的印刷电路板中的开口插入的支撑件安装在加热块的预定区域中。 加热块上的多个支撑件可以支撑多个半导体芯片结构上的过分部分。

公开(公告)号：US09252055B2

公开(公告)日：2016-02-02

申请号：US14510246

申请日：2014-10-09

申请人： Won-chul Lim

发明人： Won-chul Lim

IPC分类号： H01L21/78 ,  B28D5/00 ,  H01L21/67 ,  H01L21/00 ,  H01L21/683 ,  H01L21/673

CPC分类号： H01L21/78 ,  B28D5/0011 ,  H01L21/00 ,  H01L21/67 ,  H01L21/67011 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  Y10T225/321

摘要： In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.

摘要翻译： 在晶片切割机中，为了降低晶片切割的时间和成本，并且对整个晶片均匀地施加切割压力，晶片切割机包括支撑晶片的第一侧的支撑单元; 以及加压装置，通过将压力分散到晶片的第二面上，使得晶片的激光划线层作为分割起点施加压力。 因此，晶片切割机减少了将晶片分成半导体器件的激光辐射和压力施加时间。 在不增加损坏晶片的可能性的情况下实现提高的效率。

公开(公告)号：US20120115307A1

公开(公告)日：2012-05-10

申请号：US13253425

申请日：2011-10-05

申请人： Sang Wook Park ,  Tae Gyeong Chung ,  Ho Geon Song ,  Won Chul Lim

发明人： Sang Wook Park ,  Tae Gyeong Chung ,  Ho Geon Song ,  Won Chul Lim

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing semiconductor chips includes providing a semiconductor substrate including circuit regions, irradiating the semiconductor substrate with a laser beam onto to form a frangible layer, and polishing the semiconductor substrate to separate the circuit regions of the semiconductor substrate from one another into semiconductor chips. The frangible layer may be removed completely during the polishing of the semiconductor substrate.

摘要翻译： 制造半导体芯片的方法包括提供包括电路区域的半导体衬底，用激光束照射半导体衬底以形成易碎层，以及抛光半导体衬底以将半导体衬底的电路区域彼此分离为半导体芯片 。 在半导体衬底的抛光期间可以完全去除易碎层。

公开(公告)号：US20070290372A1

公开(公告)日：2007-12-20

申请号：US11761306

申请日：2007-06-11

申请人： Won-Chul LIM

发明人： Won-Chul LIM

IPC分类号： H01L23/52

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/859 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device having a wire loop and a method and apparatus for manufacturing the semiconductor device are provided. The semiconductor device includes a wiring board having an electrode pad, a semiconductor chip having a bonding pad and attached on a top surface of the wiring board while exposing the electrode pad, and a wire loop electrically connecting the bonding pad of the semiconductor chip to the electrode pad of the wiring board. The wire loop includes a contact ball bonded on the bonding pad and a wire extending from a side portion of the contact ball and bonded on the electrode pad of the wiring board.

摘要翻译： 提供一种具有线环的半导体器件及其制造方法和装置。 该半导体器件包括具有电极焊盘的布线板，具有接合焊盘的半导体芯片，并且在暴露电极焊盘的同时将电极焊盘暴露在布线板的上表面上，以及将半导体芯片的焊盘电连接到 电路板的电极板。 线圈包括接合焊盘上的接触球和从接触球的侧部延伸并接合在接线板的电极焊盘上的线。

公开(公告)号：US07199465B2

公开(公告)日：2007-04-03

申请号：US11100642

申请日：2005-04-06

申请人： Won-Chul Lim

发明人： Won-Chul Lim

IPC分类号： H01L23/10 ,  H01L23/02

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A support inserted through an opening in the printed circuit board supporting the overhang portion of the semiconductor chip structure is installed in a predetermined region of the heating block. Multiple supports on the heating block may support overhand portions on multiple semiconductor chip structures.

摘要翻译： 提供半导体封装引线接合系统和使用方法。 引线接合系统包括加热并支撑其上安装有具有突出端的多层半导体芯片结构的印刷电路板的加热块。 通过支撑半导体芯片结构的突出部分的印刷电路板中的开口插入的支撑件安装在加热块的预定区域中。 加热块上的多个支撑件可以支撑多个半导体芯片结构上的过分部分。

公开(公告)号：US20050236705A1

公开(公告)日：2005-10-27

申请号：US11100642

申请日：2005-04-06

申请人： Won-Chul Lim

发明人： Won-Chul Lim

IPC分类号： H01L21/60 ,  H01L23/02 ,  H01L25/065

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A support inserted through an opening in the printed circuit board supporting the overhang portion of the semiconductor chip structure is installed in a predetermined region of the heating block. Multiple supports on the heating block may support overhand portions on multiple semiconductor chip structures.

摘要翻译： 提供半导体封装引线接合系统和使用方法。 引线接合系统包括加热并支撑其上安装有具有突出端的多层半导体芯片结构的印刷电路板的加热块。 通过支撑半导体芯片结构的突出部分的印刷电路板中的开口插入的支撑件安装在加热块的预定区域中。 加热块上的多个支撑件可以支撑多个半导体芯片结构上的过分部分。

公开(公告)号：US08870047B2

公开(公告)日：2014-10-28

申请号：US13336218

申请日：2011-12-23

申请人： Won-chul Lim

发明人： Won-chul Lim

IPC分类号： H01L21/78 ,  B65H35/10 ,  B30B1/00 ,  B28D5/00

CPC分类号： H01L21/78 ,  B28D5/0011 ,  H01L21/00 ,  H01L21/67 ,  H01L21/67011 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  Y10T225/321

摘要： In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.

摘要翻译： 在晶片切割机中，为了降低晶片切割的时间和成本，并且对整个晶片均匀地施加切割压力，晶片切割机包括支撑晶片的第一侧的支撑单元; 以及加压装置，通过将压力分散到晶片的第二面上，使得晶片的激光划线层作为分割起点施加压力。 因此，晶片切割机减少了将晶片分成半导体器件的激光辐射和压力施加时间。 在不增加损坏晶片的可能性的情况下实现提高的效率。

公开(公告)号：US20120196426A1

公开(公告)日：2012-08-02

申请号：US13336218

申请日：2011-12-23

申请人： Won-chul Lim

发明人： Won-chul Lim

IPC分类号： H01L21/78 ,  B65H35/10 ,  B30B1/00

CPC分类号： H01L21/78 ,  B28D5/0011 ,  H01L21/00 ,  H01L21/67 ,  H01L21/67011 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  Y10T225/321

摘要： In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.

摘要翻译： 在晶片切割机中，为了降低晶片切割的时间和成本，并且对整个晶片均匀地施加切割压力，晶片切割机包括支撑晶片的第一侧的支撑单元; 以及加压装置，通过将压力分散到晶片的第二面上，使得晶片的激光划线层作为分割起点施加压力。 因此，晶片切割机减少了将晶片分成半导体器件的激光辐射和压力施加时间。 在不增加损坏晶片的可能性的情况下实现提高的效率。

公开(公告)号：US08159831B2

公开(公告)日：2012-04-17

申请号：US12348175

申请日：2009-01-02

申请人： Won-Chul Lim

发明人： Won-Chul Lim

IPC分类号： H05K7/00

CPC分类号： H05K3/242 ,  H01L21/4846 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A PCB (printed circuit board) for manufacturing a semiconductor package. The PCB includes a plurality of semiconductor package unit frames; a scribe lane dividing the plurality of semiconductor package unit frames; and a printed circuit pattern for plating directly connected to a plurality of bond fingers on the semiconductor package unit frames and disposed to cross the scribe lane between adjacent semiconductor package unit frames.

摘要翻译： 一种用于制造半导体封装的PCB（印刷电路板）。 PCB包括多个半导体封装单元框架; 划分所述多个半导体封装单元框架的划线; 以及用于电镀的印刷电路图案，其直接连接到半导体封装单元框架上的多个键合指状物并且设置成跨越相邻半导体封装单元框架之间的划线。