Abstract:
A view transformer of an image processing apparatus may generate a first view transformation image by transforming a first view color image with a first resolution to a third view, and may generate a second view transformation image by transforming, to the third view, a second view color image with a second resolution higher than the first resolution. A parameter calculator of the image processing apparatus may calculate a per-pixel weight parameter that is applied to each of the first view transformation image and the second view transformation image. An image generator of the image processing apparatus may generate a third view color image corresponding to the third view by applying the calculated per-pixel weight parameter to the first view transformation image and the second view transformation image.
Abstract:
A method and apparatus for encoding an image, and a method and apparatus for decoding an image are provided. In the image encoding method, an input image may be encoded hierarchically based on a unified image compression format, irrespective of whether the input image corresponds to a two-dimensional (2D) image, a stereo image, or a three-dimensional (3D) image. An encoded bit stream generated through the encoding may be transmitted to the image decoding apparatus.
Abstract:
Disclosed is a package substrate, in which the plating area of a first plating layer formed on a layer which is to be connected to a motherboard is larger than the plating area of a second plating layer formed on a layer which is to be connected to an electronic part, and open portions are formed on the first plating layer, thus balancing the plating areas of the plating layers formed on the layers of the package substrate, thereby minimizing warpage of the package substrate due to differing coefficients of thermal expansion.
Abstract:
Disclosed is a package substrate, which includes an insulating layer including a circuit layer having a via for connecting layers and an insulating member formed in the insulating layer so as to separate the insulating layer, thus preventing the package substrate from warping and reducing land co-planarity of the substrate. A method of fabricating the package substrate is also provided, including (a) forming a first circuit layer on a carrier, (b) forming an insulating layer on the carrier having the first circuit layer, (c) forming an insulating member in the insulating layer so as to separate the insulating layer, (d) forming a second circuit layer including a via on the insulating layer and the insulating member, and (e) removing the carrier.
Abstract:
An apparatus and method for processing a depth image are provided. A compressed depth image may be divided into a plurality of regions, and may be processed, and thus it is possible to improve a quality of the compressed depth image, and to increase a compression rate.
Abstract:
Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.
Abstract:
A frame rate conversion apparatus and method for an Ultra-High Definition (UD) image. The frame rate conversion apparatus may store a previous frame and a current frame of an edge of an input image, divided into N images, and insert an interpolation frame between the current frame and the previous frame. Also, the frame rate conversion apparatus may convert a frame rate of each of the N images.
Abstract:
A method of manufacturing a printed circuit board, including: applying a dry film on a carrier and then patterning the dry film to form holes for forming metal bumps; forming an upper circuit layer including metal bumps charged in the holes and connection pads on the dry film; forming an insulation layer on the dry film; forming a build-up layer including a lower circuit layer on the insulation layer; removing the carrier; and removing the dry film.