公开(公告)号：US20120139808A1

公开(公告)日：2012-06-07

申请号：US13304504

申请日：2011-11-25

申请人： Seung-Woo SHIN ,  Seong-Cheol LIM ,  Jong-Wook ZEONG ,  Byung-Tae YOON ,  Jin-Soo PARK

发明人： Seung-Woo SHIN ,  Seong-Cheol LIM ,  Jong-Wook ZEONG ,  Byung-Tae YOON ,  Jin-Soo PARK

IPC分类号： H01Q1/52

CPC分类号： H01Q1/245 ,  H01Q1/526 ,  H01Q9/0407

摘要： A Global Positioning System (GPS) antenna apparatus in a wireless communication device is provided. The GPS antenna apparatus includes a GPS antenna radiator and at least one blocking layer. The GPS antenna radiator receives a GPS signal. The at least one blocking layer is installed proximate to the GPS antenna radiator so as to block an external noise introduced to the GPS antenna radiator.

摘要翻译： 提供了一种无线通信设备中的全球定位系统（GPS）天线装置。 GPS天线装置包括GPS天线辐射器和至少一个阻挡层。 GPS天线辐射器接收GPS信号。 至少一个阻挡层安装在GPS天线辐射器附近，以便阻挡引入GPS天线辐射器的外部噪声。

公开(公告)号：US20120231909A1

公开(公告)日：2012-09-13

申请号：US13345830

申请日：2012-01-09

申请人： Seung-Woo SHIN

发明人： Seung-Woo SHIN

IPC分类号： F16H55/48

CPC分类号： F16F15/126

摘要： The invention is a damper pulley which comprises of a cylindrical hub 12 being made of cast iron and coupled to the crankshaft of the engine, a hub plate 16 being made of steel plate and having a central hole 22 on which the hub 12 is attached and a rim 24 at the periphery of it, a rubber layer 18 being attached on the rim 24 of the hub plate 16, and a pulley attached on the outer surface of the rubber layer 18.

摘要翻译： 本发明是一种阻尼滑轮，其包括由铸铁制成并联接到发动机曲轴的圆柱形轮毂12，轮毂板16由钢板制成并具有中心孔22，毂12附接在其上， 在其周围的边缘24，附接在轮毂板16的轮缘24上的橡胶层18和附接在橡胶层18的外表面上的滑轮。

公开(公告)号：US20130095964A1

公开(公告)日：2013-04-18

申请号：US13345815

申请日：2012-01-09

申请人： Seung-Woo SHIN

发明人： Seung-Woo SHIN

IPC分类号： F16H55/36

CPC分类号： F16F15/126 ,  Y10T403/1608

摘要： A torsional vibration damper which comprises of a hub 12 having a central hole 3 to be inserted on the crankshaft and being formed to have a recess opened on one side, a disc 4 extending from the hub 2, a rim 5 being bent and extending from the periphery of the disc 4, a rubber layer 6 attached on the outer surface of the rim 5, and a ring member 8 or pulley inserted on the outer surface of the rubber layer 6, wherein a polygonal recess 10 is formed on the connecting area between the hub 2 and the disc 4 so that the polygonal recess 10 surrounds the hub 2.

摘要翻译： 一种扭转振动阻尼器，包括具有中心孔3的轮毂12，该中心孔3插入在曲轴上并形成为具有在一侧开口的凹部，从轮毂2延伸的盘4，弯曲并从 盘4的周边，安装在轮辋5的外表面上的橡胶层6和插入橡胶层6的外表面的环形构件8或滑轮，其中在连接区域上形成多边形凹部10 在轮毂2和盘4之间，使得多边形凹部10围绕轮毂2。

公开(公告)号：US20100013077A1

公开(公告)日：2010-01-21

申请号：US12485965

申请日：2009-06-17

申请人： Seung-Woo SHIN

发明人： Seung-Woo SHIN

IPC分类号： H01L23/52

CPC分类号： H01L23/3192 ,  H01L23/3114 ,  H01L23/525 ,  H01L23/562 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/16225 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/013

摘要： A semiconductor device includes a semiconductor chip having a top surface on which a first conductive pad is disposed, a bottom surface opposite to the top surface, and a side surface connecting the top and bottom surfaces to each other, a first reinforcement layer on the top surface of the semiconductor chip, a first absorption layer between the top surface of the semiconductor chip and the first reinforcement layer to absorb a stress resulting from a difference in thermal expansion coefficient between the first reinforcement layer and the semiconductor chip, and a connection terminal disposed on the first reinforcement layer and electrically connected to the first conductive pad.

摘要翻译： 一种半导体器件包括具有顶表面的半导体芯片，第一导电焊盘设置在该顶表面上，与顶表面相对的底表面和将顶表面和底表面彼此连接的侧表面，顶部上的第一加强层 半导体芯片的表面，在半导体芯片的顶表面和第一加强层之间的第一吸收层，以吸收由第一加强层和半导体芯片之间的热膨胀系数的差异引起的应力，以及布置的连接端子 在第一加强层上并电连接到第一导电垫。

公开(公告)号：US20090115036A1

公开(公告)日：2009-05-07

申请号：US11939622

申请日：2007-11-14

申请人： Seung-Woo SHIN

发明人： Seung-Woo SHIN

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/58 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/108 ,  H05K3/243 ,  H05K2201/09745 ,  H05K2203/0369 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package having a metal bump and related method of fabrication are provided. The semiconductor chip package includes first and second bonding pads separated on a substrate, an insulating layer from on the substrate with first and second openings respectively exposing the first and second bonding pads, and an oxidation preventing pattern formed from a nickel layer and a silver layer and formed on the first and second bonding pads.

摘要翻译： 提供了具有金属凸块的半导体芯片封装和相关的制造方法。 半导体芯片封装包括在基板上分离的第一和第二焊盘，来自基板的绝缘层，第一和第二开口分别露出第一和第二焊盘，以及由镍层和银层形成的防氧化图案 并形成在第一和第二接合焊盘上。