摘要:
A CMOS integrated circuit structure is disclosed having a patterned nitride passivation layer, wherein the nitride is patterned such that it does not overlie the thin gate oxide portions of one or more of the MOS devices. When protection against the effects of external radiation is desired, the thin gate oxide areas of the PMOS devices are left uncovered by the patterned nitride passivation layer. When protection is desired against the effects of internally generated "hot electrons", the thin gate oxide areas of the NMOS devices are left uncovered by the patterned nitride passivation layer.
摘要:
A technique for improving the radiation hardness and hot-electron resistance of a CMOS integrated circuit is described whereby undesirable hydrogen ions may be vented through any holes, such as contact holes, in an overlying passivation layer by applying an elevated temperature and/or electrical bias to the integrated circuit die. The elevated temperature and electrical bias serve to accelerate the process by which hydrogen vents from the die. The elimination of unwanted hydrogen significantly reduces threshold shifts in the CMOS integrated circuit, providing greater radiation hardness and hot-electron resistance.
摘要:
A radiation hardened NMOS transistor structure suited for application to radiation hardened CMOS devices, and the method for manufacturing it is disclosed. The new transistor structure is characterized by "P" doped guard bands running along and immediately underlying the two bird's beak regions perpendicular to the gate. The transistor and the CMOS structure incorporating it exhibit speed and size comparable to those of conventional non-rad-hard CMOS structure, relatively simple manufacturing, and excellent total-dose radiation hardness.
摘要:
An improved MOS-type integrated circuit structure, and a method of making same, are described wherein a diode is electrically connected between the polysilicon gate electrode and the semiconductor substrate, and physically located in the substrate below the contact area of the polysilicon gate electrode so that no extra lateral space is needed to provide such a diode connection between the polysilicon gate electrode and the substrate. The junction is formed in the substrate in a region where the contact area of the gate electrode is usually positioned over field oxide. An opening is provided for the diode in the field oxide region of the substrate, by masking off an additional portion of the substrate, when the field oxide is initially grown, to provide for location of the diode therein.
摘要:
A method of testing of an embedded core of an integrated circuit (“IC”) is described. An IC has a hardwired embedded core and memory coupled to each other in the IC. The method includes writing a test vector to the memory while the embedded core is operative. The test vector is input from the memory to the embedded core to mimic scan chain input to the embedded core. A test result is obtained from the embedded core responsive in part to the test vector input.
摘要:
A method and apparatus are disclosed that simplify and reduce the time required for detecting faults in a programmable device such as a programmable logic device (PLD) by utilizing fault coverage information corresponding to a plurality of test patterns for the PLD to reduce the set of potential faults. For one embodiment, each test pattern is designated as either passing or failing, the faults that are detectable by at least two failing test patterns and the faults that are not detectable by any passing test patterns are eliminated, and the remaining faults are diagnosed. For another embodiment, the faults detectable by each failing test pattern are diagnosed to generate corresponding fault sets, and the faults not common to the fault sets and not detectable by one or more of the failing test patterns are eliminated.
摘要:
A new method to test short faults in a programmable logic device is described. The line segments under test are connected together to form a conducting chain. All the line segments neighboring to the conducting chain are tied to a known state. A test vector is applied to the programmable logic device. The state of the line under test is measured. If it is the same as the known state, the programmable logic device is likely to have faults.
摘要:
An MOS transistor is programmed in a non-volatile memory cell. A storage capacitor in the non-volatile memory cell is used to enhance programming efficiency by providing additional charge to the programming terminal of the MOS transistor during breakdown of the gate dielectric, thus avoiding soft programming faults. In a particular embodiment the storage capacitor is a second MOS transistor having a thicker gate dielectric layer than the dielectric layer of the programmable MOS transistor.
摘要:
A PMOS transistor is programmed as a non-volatile memory element by operating the PMOS transistor in accumulation mode. This facilitates merging the source and drain regions to form a low-resistance path because most heating occurs on the channel side of the gate dielectric, rather than on the gate terminal side. In a particular embodiment, boron is used as the dopant. Boron has a higher diffusivity than arsenic or phosphorous, which are typical n-type dopants. Boron's higher diffusivity promotes merging the source and drain regions.
摘要:
A Built-in Self Test (BIST) system is provided in a Field Programmable Gate Array (FPGA) that can adjust test signal patterns provided for testing after partial reconfiguration of the FPGA. The BIST system includes a decoder that monitors I/O signals and provides an output indicating when I/O signals change indicating partial reconfiguration has occurred. The decoder output is provided to a BIST test signal generator providing signals to an IP core of the FPGA as well as a BIST comparator for monitoring test results to change test signals depending on the partial configuration mode.