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1.发明申请公开(公告)号：US20180086895A1
公开(公告)日：2018-03-29
申请号：US15515230
申请日：2016-09-14
发明人： Jiang YOU , Tianhui HUANG , Yongjing XU , Zhongqiang YANG
CPC分类号： C08K3/32 , B32B15/092 , B32B27/38 , C08G59/1477 , C08G59/3236 , C08G59/4014 , C08J5/24 , C08J2363/00 , C08K5/49 , C08L63/00 , C08L79/04 , C08L2201/02 , C08L2203/206 , H05K1/024 , H05K1/0346 , H05K1/0373 , H05K3/38 , H05K2201/012
摘要： The present invention provides a halogen-free thermosetting resin composition, a prepreg, a laminate and a printed circuit board comprising the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free thermosetting resin, (B) from 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant. The prepregs, laminates and printed circuit boards prepared from the halogen-free thermosetting resin composition of the present invention have excellent dimensional stability and dielectric properties, high adhesive force, high heat resistance, low water absorption and better processability, and can achieve halogen-free flame retardancy and reach UL94 V-0.
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2.发明申请HALOGEN-FREE RESIN COMPOSITION, AND A PREPREG AND A LAMINATE USED FOR PRINTED CIRCUIT USING THE SAME 有权无卤素树脂组合物，以及用于印刷电路的PREPREG和层压板公开(公告)号：US20160244602A1
公开(公告)日：2016-08-25
申请号：US15027374
申请日：2014-06-10
发明人： Jiang YOU
CPC分类号： C08L63/00 , B32B27/38 , B32B27/42 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2264/104 , B32B2307/204 , B32B2307/306 , B32B2307/3065 , B32B2307/714 , B32B2307/726 , B32B2307/7265 , B32B2307/734 , B32B2457/08 , C08G14/06 , C08G59/3218 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2363/00 , C08J2379/02 , C08J2379/04 , C08J2461/06 , C08J2463/00 , C08J2479/02 , C08J2479/04 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K5/49 , C08L61/04 , C08L61/06 , C08L61/34 , C08L63/04 , C08L79/02 , C08L79/04 , C08L79/06 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/03 , H05K1/0373 , H05K2201/012 , H05K2201/015
摘要： The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.
摘要翻译： 该技术公开了一种无卤树脂组合物和用于印刷电路的预浸料和层压材料。 树脂组合物包括：烷基酚环氧树脂; 苯并恶嗪树脂，烷基苯酚酚醛清漆固化剂和含磷阻燃剂。 烷基酚环氧树脂在其分子结构中具有许多烷基支链，使得组合物具有优异的介电性能，较高的玻璃化转变温度，低吸水率和良好的耐热性。 将苯并恶嗪树脂混合到组合物中可以进一步降低固化产物的介电常数，介电损耗值和吸水率。 使用烷基苯酚酚醛清漆固化剂，分子结构将具有许多烷基，介电性能优异和吸水率低。 用于使用该树脂组合物制备的印刷电路板的预浸料和层压材料具有低介电常数，介电损耗因子和吸水率，高尺寸稳定性，高耐热性，良好的阻燃性，加工性和耐化学性。
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3.发明申请公开(公告)号：US20180126701A1
公开(公告)日：2018-05-10
申请号：US15529335
申请日：2016-09-08
发明人： Jiang YOU , Tianhui HUANG , Yongjing XU , Zhongqiang YANG
CPC分类号： B32B15/092 , B32B27/18 , B32B33/00 , C08G59/32 , C08G59/62 , C08J2300/24 , C08K3/36 , C08K5/357 , C08L63/00
摘要： The present invention relates to a halogen-free thermosetting resin composition, a prepreg and a laminate for printed circuit boards using the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 16 to 42 parts by weight of a halogen-free epoxy resin, (B) from 1.5 to 4.8 parts by weight of a compound containing dihydrobenzoxazine ring; (C) from 10 to 28 parts by weight of a phosphorus-containing bisphenol curing agent, wherein the phosphorus-containing bisphenol curing agent has a weight average molecular weight of 1000-6500, and (D) from 30 to 70 parts by weight of silicon dioxide. The prepreg and laminate for printed circuit boards prepared from the halogen-free thermosetting resin composition have high glass transition temperature, excellent dielectric performances, low water absorption, high heat resistance and better processability, and can achieve halogen-free flame retardancy and UL94 V-0.
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公开(公告)号：US20160272808A1
公开(公告)日：2016-09-22
申请号：US15035601
申请日：2014-07-17
发明人： Jiang YOU , Yueshan HE
IPC分类号： C08L63/00 , C08J5/24 , C09D163/00 , C08L79/04 , C09D179/04
CPC分类号： C08L63/00 , C08G59/4215 , C08G59/4276 , C08G59/686 , C08J5/24 , C08J2363/00 , C08J2379/04 , C08J2463/00 , C08J2479/04 , C08K5/3437 , C08K5/50 , C08L79/04 , C08L2201/02 , C08L2201/08 , C09D163/00 , C09D179/04 , C09J163/00 , C08K3/36 , C08K5/5313 , C08L67/00
摘要： Disclosed is a halogen-free resin composition. The halogen-free resin composition comprises: (A) 10-60 parts by weight of dicyclopentadiene benzoxazine resin, (B) an epoxy resin, (C) an active ester curing agent, and (D) a phosphorus-containing flame retardant, based on 100 parts by weight of the total amount of total organic solid matters of (A), (B), (C), and (D). A prepreg and a laminate which are prepared using the halogen-free resin composition have low dielectric constant, low dielectric loss factor, low water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.
摘要翻译： 公开了一种无卤树脂组合物。 无卤树脂组合物包含：（A）10-60重量份二环戊二烯苯并恶嗪树脂，（B）环氧树脂，（C）活性酯固化剂和（D）含磷阻燃剂 （A），（B），（C）和（D）的总有机固体物质总量的100重量份。 使用无卤素树脂组合物制备的预浸料和层压体具有低介电常数，低介电损耗因子，低吸水率，高尺寸稳定性，高耐热性和良好的阻燃性，加工性和耐化学性。
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